JPS61119095A - Method of mounting electronic part - Google Patents
Method of mounting electronic partInfo
- Publication number
- JPS61119095A JPS61119095A JP24100384A JP24100384A JPS61119095A JP S61119095 A JPS61119095 A JP S61119095A JP 24100384 A JP24100384 A JP 24100384A JP 24100384 A JP24100384 A JP 24100384A JP S61119095 A JPS61119095 A JP S61119095A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- solder
- wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
水元開拡平面実装用電子部品を配線基板、特にフレキシ
ブル配に基板（以下、ＦＰＣという）Ｋ実装する方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for mounting an electronic component for flat surface mounting on a wiring board, particularly on a flexible board (hereinafter referred to as FPC).
カメラ、ＶＴＲカメラ、小形ラジオ、テレビ等ハンディ
タイプの商品は薄形化、小形化の要求が彊い。従来は、
第２図に示すように％ＦＰＣ１上にはんだリフローでミ
ニ・フラットＩＣ４，抵抗コンデンサ、インダクタなど
のチップ部品化された受動素子５を配線電極２にはんだ
付け６して実装する方法があるが、製造工程が複雑にな
ることから片面実装が多く使われている。しかしながら
ＦＰＣへの片面実装はＬ８Ｉを含んだ高果槓実装が多く
なってくると配線パターン精度や配線引き回しなどの制
約で部品実装密度が上らない欠点がある。Handy-type products such as cameras, VTR cameras, small radios, and televisions are in high demand for being thinner and smaller. conventionally,
As shown in Fig. 2, there is a method of mounting passive elements 5 such as mini-flat ICs 4, resistive capacitors, and inductors as chip components on the FPC 1 by soldering 6 to the wiring electrodes 2 using solder reflow. Single-sided mounting is often used because the manufacturing process is complicated. However, single-sided mounting on FPC has the disadvantage that when high-performance mounting including L8I increases, the density of component mounting cannot be increased due to restrictions such as wiring pattern accuracy and wiring routing.
本発明の目的は配線基板に電子部品を高密度で実装でき
る実装方法を提供することＫある。An object of the present invention is to provide a mounting method that allows electronic components to be mounted on a wiring board at high density.
本発明によれば、配線基板の電子部品搭載位置に穴をあ
けておき、電子部品を配線基板に搭載抜穴を通して半田
を供給し、電子部品を配線基板に固定する電子部品の実
装方法を得る。According to the present invention, there is provided an electronic component mounting method in which a hole is made at the electronic component mounting position of a wiring board, and solder is supplied through the hole for mounting the electronic component on the wiring board to fix the electronic component to the wiring board. .
本発明によれば、半田ｔはんだリフロー等で一度の工程
で供給しても配線基板の両面でのはんだ付けが可能であ
り、１度のはんだ付は工程でよシｌｌ１ｉｉ密度の部品
実装が可能となる。According to the present invention, it is possible to solder both sides of a wiring board even if solder is supplied in one process using solder reflow, etc., and it is possible to mount components with a high density in one soldering process. becomes.
次に図面ｔ＃照して本発明をよシ詳ａＫ説明するＯ 第１図は本発明の一実施例によるＩＲ面図である。 Next, the present invention will be explained in detail with reference to the drawings. FIG. 1 is an IR plane view according to an embodiment of the present invention.
ＦＰＣＩの配線電極２には下面部品搭載部品４′。The wiring electrode 2 of the FPCI is equipped with a lower component mounting component 4'.
５′の電極に合せて穴明は加工された両面配線がなされ
ており、まず下面部品４／、Ｓ／をＦＰＣＩの穴明は部
に位置合せして仮付は樹脂３で接着し、次にＦＰＣｌの
上面電極上面搭載部品４，５の電極と穴明は加工部に合
った印刷マスクをかぶせ、はんだペースト６を印刷した
後、はんだリフローを行うことＫより上面と下面の接続
を収ったものでｂる。The holes are machined to match the electrodes of 5' and double-sided wiring is made.First, align the bottom parts 4/ and S/ with the holes of the FPCI, and temporarily adhere them with resin 3. Then, cover the electrodes and holes of the parts 4 and 5 with the upper surface electrode of FPCl with a printing mask that matches the processing area, and after printing the solder paste 6, perform solder reflow. I'm going to eat something.
以上説明したように、本発明はＦＰＣの穴に、はんだペ
ーストの粘性を利用したＩ：１］桐ではんだを供給し上
面、下面の接続ｔ−取って、両面部品実装を可能にした
ものであプ、両面配＠ＩＫよりリード端子の多いＬＳＩ
０ＦＰＣ配線引き回しは楽になプ効率良く実装でき、し
かも片面実装同様、はんだペーストの印刷訃よびはんだ
リフローは１回で済ますことができる。As explained above, the present invention enables double-sided component mounting by supplying solder with I:1] paulownia wood to the holes of the FPC using the viscosity of the solder paste and making connections on the top and bottom surfaces. Apu, double-sided @ LSI with more lead terminals than IK
0FPC wiring can be mounted easily and efficiently, and like single-sided mounting, printing of solder paste and reflow of solder can be completed only once.
第１図り本発明の一実施例による実装方法を示す断面図
、第２図は従来の実装方法を示す断面図である。
１・・・・・・ＦＰＣ，２−・・・・・配線電極、３・
・・・・・仮付は樹脂、４．４′・・・・・・フラット
ＩＣ，５，５’・・・・・・テッグ受動部品、６・・・
・・・はんだ。FIG. 1 is a sectional view showing a mounting method according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional mounting method. 1... FPC, 2-... Wiring electrode, 3...
...Temporarily attached with resin, 4.4'...Flat IC, 5,5'...Teg passive parts, 6...
...Solder.
Claims (1)
前記電極位置に外部リードが接するように前記電子部品
を搭載し、該搭載電子部品の裏面から前記穴を介しては
んだを供給しもって前記電子部品を前記配線基板に実装
すること特徴とする電子部品の実装方法。The electronic component is mounted on a wiring board in which a hole corresponding to the electrode position of the electronic component is drilled so that the external lead is in contact with the electrode position, and solder is supplied from the back side of the mounted electronic component through the hole. A method for mounting an electronic component, comprising mounting the electronic component on the wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24100384A JPS61119095A (en) | 1984-11-15 | 1984-11-15 | Method of mounting electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24100384A JPS61119095A (en) | 1984-11-15 | 1984-11-15 | Method of mounting electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61119095A true JPS61119095A (en) | 1986-06-06 |
Family
ID=17067880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24100384A Pending JPS61119095A (en) | 1984-11-15 | 1984-11-15 | Method of mounting electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61119095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0394359U (en) * | 1990-01-19 | 1991-09-26 |
-
1984
- 1984-11-15 JP JP24100384A patent/JPS61119095A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0394359U (en) * | 1990-01-19 | 1991-09-26 |
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