JPS61117298A - Treatment of surface - Google Patents
Treatment of surfaceInfo
- Publication number
- JPS61117298A JPS61117298A JP23678184A JP23678184A JPS61117298A JP S61117298 A JPS61117298 A JP S61117298A JP 23678184 A JP23678184 A JP 23678184A JP 23678184 A JP23678184 A JP 23678184A JP S61117298 A JPS61117298 A JP S61117298A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- bath
- positive integer
- polyoxyethylene
- bronze
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
本発明は、硫酸酸性浴を用いて電気青銅めっきを施す金
属材料の表面処理方法において後述する添加剤を用いる
ことKより優れた品質の青銅めっき皮膜を得ることを特
徴とする金属材料の表面処理方法に関する。[Detailed Description of the Invention] [Object of the Invention] The present invention provides a method for surface treatment of metal materials in which electrolytic bronze plating is applied using a sulfuric acid acidic bath using additives described below. The present invention relates to a method for surface treatment of metal materials, characterized in that
従来、金属材料に銅−錫合金すなわち青銅を電気めっき
する方法としては。Conventionally, the method of electroplating a copper-tin alloy, that is, bronze, on a metal material is as follows.
1)シアン化鋼−錫層塩浴
2)シアン化銅−ピロシん酸錫浴
5)ピロシん酸塩浴
4)硫酸塩浴
等を用いる方法が知られている。これらの浴は目的とす
る皮膜の品質や1作業性等によって使い分けられる。低
公害性の浴、特に硫酸浴はならしか不要であり、得られ
る青銅電着物は半光沢でかつ容易につや出しできる等の
性質があシ。Methods using 1) cyanide steel-tin layer salt bath, 2) copper cyanide-tin pyrosinate bath, 5) pyrosinate bath, 4) sulfate bath, etc. are known. These baths are selectively used depending on the quality of the desired film, workability, etc. Low-pollution baths, especially sulfuric acid baths, require only smoothing, and the resulting bronze electrodeposit has properties such as semi-gloss and easy polishing.
推奨できる。Can be recommended.
従来の硫酸酸性青銅めつき条件は、下記の様なものであ
る。Conventional sulfuric acid acid bronze plating conditions are as follows.
硫酸鋼 auso4e sa、o 50〜50
f/を硫酸第一錫 Elu日04 50〜50
t/を硫 酸 H,SO25G 〜100 f
/lフェノール 5〜1op/lゼラ
チン 1.5〜St/Lチオ尿素
α005P/lカソード及びアノー
ド電流密度 15〜I A/di温 度
18〜25℃〔発明が消失
しようとする問題点〕
しかし、この様な浴においては、複合添加されてbる各
有機物を個別に定量管理することはできない。そこでハ
ルセル試験によって浴の電着能等を把握するわけである
が、安定した品質の青銅皮膜を得るには多くの経験と労
力が必要とされた。Sulfuric acid steel auso4e sa, o 50~50
f/ stannous sulfate Elu Day 04 50-50
t/ to sulfuric acid H, SO25G ~100 f
/l Phenol 5-1 op/l Gelatin 1.5-St/L Thiourea
α005P/l cathode and anode current density 15~I A/di temperature
18-25[deg.]C [Problem where the invention is about to disappear] However, in such a bath, it is not possible to individually quantitatively control each organic substance that is added in combination. Therefore, the Hull cell test was used to determine the electrodeposition ability of the bath, but it required a lot of experience and effort to obtain a bronze film of stable quality.
本発明者はこれらの状況を考慮し、安定して高品質の皮
膜が得られる生産性及び作業性の高いめっき条件にりい
て研究を重ねたところ、下記の非イオン界面活性剤を添
加剤として、またはさらにホルマリンを添加剤として混
合した錫めっき浴を用いること忙よ勺高品質の皮膜、す
なわち均一な半光沢の外観を有しピンホールが少なh青
銅皮膜が得られることを見出したものである。Taking these circumstances into consideration, the present inventor conducted extensive research on plating conditions with high productivity and workability that would allow a stable high-quality film to be obtained, and found that the following nonionic surfactant was used as an additive. It has been found that using a tin plating bath mixed with formalin, or in addition formalin as an additive, results in a high quality coating, i.e. a bronze coating with a uniform semi-gloss appearance and few pinholes. be.
前記非イオン界面活性剤は (1)式 %式%) 〔式中a+cは2〜350の正の整数であシ。The nonionic surfactant is (1) Formula %formula%) [In the formula, a+c must be a positive integer from 2 to 350.
bは11〜66の正の整数である〕
で表わされるポリオキシエチレン−ポリオキシプロピレ
ン縮合物
(2)式
〔式中mは1〜320の正の整数であり、nは8〜60
の正の整数である〕
で表わされるポリオキシエチレンーポリオキシグロビレ
ンジイミン化合物
(3)式
〔式中pは8〜60の正の整数であシ、qは1〜520
の正の整数である〕
で表わされるポリオキシエチレン−ポリオキシプロピレ
ンジイミン化合物
である。b is a positive integer of 11 to 66] Polyoxyethylene-polyoxypropylene condensate represented by formula (2) [wherein m is a positive integer of 1 to 320, n is 8 to 60]
is a positive integer of 8 to 60, and q is a positive integer of 1 to 520.
is a positive integer] is a polyoxyethylene-polyoxypropylene diimine compound represented by the following.
この錫めっき浴中の非イオン界面活性剤の濃度はレベリ
ング効果を十分にあげ、良好な外観を得るために121
71以上が必要であシ、また3 0 f/lを越えると
効果が飽和してそれ以上の添加は不経済である。The concentration of nonionic surfactant in this tin plating bath is set at 121% in order to sufficiently increase the leveling effect and obtain a good appearance.
71 or more is required, and if it exceeds 30 f/l, the effect will be saturated and it is uneconomical to add more than that.
これらの非イオン界面活性剤は単独で硫酸酸性青銅めり
き浴に添加しても十分圧レベリング機能があるが、浴中
の2価の錫イオンは酸化され易く液が4価の錫塩によシ
白濁し易くなる。These nonionic surfactants have a sufficient pressure leveling function even when added alone to a sulfuric acid acidic bronze plating bath, but the divalent tin ions in the bath are easily oxidized and the liquid is formed by tetravalent tin salts. It becomes cloudy easily.
ホルマリンは非イオン界性剤と共にレベリングに寄与す
ると共に錫の酸化を抑え、不溶性の4価の錫塩によるめ
っき品質への悪影響1例えばピンホールの増化や光沢の
低下等を軽減する。Formalin contributes to leveling together with a nonionic surfactant, suppresses the oxidation of tin, and reduces the adverse effects of insoluble tetravalent tin salts on plating quality, such as increase in pinholes and reduction in gloss.
添加量は4−/を未満では、めっき品質は無添加の場合
と差は認められず、また20rd/lを越えると効果が
飽和し、それ以上の添加は不経済である。If the amount added is less than 4 rd/l, there is no difference in plating quality compared to the case without the addition, and if it exceeds 20 rd/l, the effect is saturated, and adding more than that is uneconomical.
被めっき材料である金属材料の種類には特に制限はなく
、いずれの材料にも適用できる。また材料の形状すなわ
ち条材、加工品等の種類を問わない。There are no particular restrictions on the type of metal material to be plated, and any material can be used. Moreover, the shape of the material, ie, the type of strip, processed product, etc., does not matter.
この被めっき金属材料はアルカリ脱脂、電解脱脂、活性
化処理等の通常の前処理を施して電気めっきに適した表
面に調整した後9本発明の前記非イオン界面活性剤、ま
たはホルマリンを添加した硫酸酸性めっき浴を用いて錫
めっきを施しその後水洗、乾燥する。This metal material to be plated was subjected to normal pretreatment such as alkaline degreasing, electrolytic degreasing, and activation treatment to adjust the surface to be suitable for electroplating, and then the nonionic surfactant of the present invention or formalin was added. Tin plating is applied using a sulfuric acid acid plating bath, followed by washing and drying.
この様にして得られた背鋼めつき材料は均一な半光沢面
を有し、ピンホールの少ない良好な皮膜であった。また
添加剤は非イオン界面活性剤とホルマリンのみであ〕公
知の方法で定量分析が可能である。The back steel plating material thus obtained had a uniform semi-glossy surface and a good film with few pinholes. Furthermore, the only additives are a nonionic surfactant and formalin, and quantitative analysis is possible using a known method.
次に実施例および比較例について説明する。Next, Examples and Comparative Examples will be described.
シん青銅条をアルカリ脱脂、電解脱脂、セして酸洗、中
和後1μmの青銅めっきを下記の硫酸酸性浴よシ施した
。After the thin bronze strip was alkaline degreased, electrolytically degreased, washed with acid, and neutralized, it was plated with 1 μm bronze in the following sulfuric acid acid bath.
硫酸前銅浴およびめっき条件は下記のものを共通とする
。The copper bath before sulfuric acid and plating conditions are as follows.
0u80.−5H4o s
o t7’t8nS0. 50 f/L
a、so、 1 a o
tit浴 温 25℃
電流密度 3A/d/
次に(11〜(3)式で示す非イオン界面活性剤及びこ
の処理材にさらにホルマリンを複合添加したものと、従
来の添加剤を添加した浴から得られた青銅めっき皮膜を
試験した結果を表1に示す。0u80. -5H4os
o t7't8nS0. 50 f/L
a, so, 1 ao
Tit bath Temperature: 25°C Current density: 3A/d/Next, from a bath containing a nonionic surfactant represented by formulas 11 to (3) and a mixture of formalin added to this treated material, and a bath containing conventional additives, Table 1 shows the results of testing the bronze plating film obtained.
添加剤(1) 式 %式%) 〔式中a+cは26の正の整数であシ。Additive (1) formula %formula%) [In the formula, a+c must be a positive integer of 26.
bは30の正の整数である〕
で表わされるポリオキンエチレン−ポリオキ7プロピレ
ン縮合物
添加剤(2) 式
〔式中mは60の正の整数であシ、nは71の正の整数
である〕
で表わされるポリオキシエチレン−ポリオキシプロピレ
ンジイミン化合物
添加剤(3) 式
〔式中pは71の正の整数であり、qは60の正の整数
である〕
で表わされるポリオキクエチレン−ポリオキシプロビレ
/ジイミン化合物
表 1
空孔度は1−またシの慣通ピンホールの数を表わす。b is a positive integer of 30] Polyoxine ethylene-polyoxy7-propylene condensate additive (2) represented by the formula [where m is a positive integer of 60, n is a positive integer of 71] ] Polyoxyethylene-polyoxypropylene diimine compound additive (3) represented by the formula [wherein p is a positive integer of 71 and q is a positive integer of 60] Polyoxyethylene represented by the formula -Polyoxypropylene/Diimine Compound Table 1 Porosity represents the number of pinholes in 1-Also.
以上1本発明は非イオン界面活性剤、そしてさらにホル
マリンを前記青銅めっき浴に添加することにより、良好
な外観と空孔率の少ない優れた表面性状をもつ表面処理
材が作業性良く得られるようになった。As mentioned above, the present invention is capable of obtaining a surface-treated material with good appearance and excellent surface properties with low porosity with good workability by adding a nonionic surfactant and further formalin to the bronze plating bath. Became.
Claims (3)
料の表面処理方法において、下記(イ)〜(ハ)式に示
す非イオン界面活性剤の1種又は2種以上を添加した硫
酸酸性浴を用いて青銅めっきを行うことを特徴とする表
面処理方法。 (イ)式 HO(C_2H_4O)_a−(C_3H_6O)_b
−(C_2H_4O)_c−H〔式中a+cは2〜35
0の正の整数であ り、bは11〜66の正の整数である〕 で表わされるポリオキシエチレン−ポリオ キシプロピレン縮合物。 (ロ)式 ▲数式、化学式、表等があります▼ 〔式中mは1〜320の正の整数であり、nは8〜60
の正の整数である〕 で表わされるポリオキシエチレン−ポリオ キシプロピレンジイミン化合物。 (ハ)式 ▲数式、化学式、表等があります▼ 〔式中pは8〜60の正の整数であり、q は1〜320の正の整数である〕 で表わされるポリオキシエチレン−ポリオ キシプロピレンジイミン化合物。(1) In a surface treatment method for metal materials in which electrolytic bronze plating is applied using a sulfuric acid acidic bath, one or more of the nonionic surfactants shown in formulas (a) to (c) below are added to the sulfuric acid acidic bath. A surface treatment method characterized by performing bronze plating using a bath. (A) Formula HO (C_2H_4O)_a-(C_3H_6O)_b
-(C_2H_4O)_c-H [in the formula, a+c is 2 to 35
a positive integer of 0, and b is a positive integer of 11 to 66.] A polyoxyethylene-polyoxypropylene condensate represented by: (b) Formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [In the formula, m is a positive integer from 1 to 320, and n is from 8 to 60.
is a positive integer] A polyoxyethylene-polyoxypropylene diimine compound represented by: (C) Formula ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ [In the formula, p is a positive integer of 8 to 60, and q is a positive integer of 1 to 320] Polyoxyethylene-polyoxy Propylene diimine compound.
性剤を用いる特許請求の範囲第(1)項記載の表面処理
方法。(2) The surface treatment method according to claim (1), using the nonionic surfactant in an amount of 0.2 g/l to 30 g/l.
ンを添加した硫酸酸性浴を用いて青銅めっきを行う特許
請求の範囲第(1)項記載の表面処理方法。(3) The surface treatment method according to claim (1), wherein bronze plating is performed using a sulfuric acid acid bath to which 4 ml to 20 ml/l of formalin is further added.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23678184A JPS61117298A (en) | 1984-11-12 | 1984-11-12 | Treatment of surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23678184A JPS61117298A (en) | 1984-11-12 | 1984-11-12 | Treatment of surface |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61117298A true JPS61117298A (en) | 1986-06-04 |
Family
ID=17005696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23678184A Pending JPS61117298A (en) | 1984-11-12 | 1984-11-12 | Treatment of surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61117298A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0787834A1 (en) * | 1996-01-30 | 1997-08-06 | Nkk Corporation | Acidic tinplating bath and additve therefor |
JP2009161804A (en) * | 2007-12-28 | 2009-07-23 | Shimizu:Kk | Copper-tin alloy plating film, non-cyanogen-based copper-tin alloy plating bath, and plating method using the same |
WO2018180192A1 (en) * | 2017-03-27 | 2018-10-04 | 三菱マテリアル株式会社 | Plating liquid |
JP2018162512A (en) * | 2017-03-27 | 2018-10-18 | 三菱マテリアル株式会社 | Plating solution |
-
1984
- 1984-11-12 JP JP23678184A patent/JPS61117298A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0787834A1 (en) * | 1996-01-30 | 1997-08-06 | Nkk Corporation | Acidic tinplating bath and additve therefor |
JP2009161804A (en) * | 2007-12-28 | 2009-07-23 | Shimizu:Kk | Copper-tin alloy plating film, non-cyanogen-based copper-tin alloy plating bath, and plating method using the same |
WO2018180192A1 (en) * | 2017-03-27 | 2018-10-04 | 三菱マテリアル株式会社 | Plating liquid |
JP2018162512A (en) * | 2017-03-27 | 2018-10-18 | 三菱マテリアル株式会社 | Plating solution |
CN110462108A (en) * | 2017-03-27 | 2019-11-15 | 三菱综合材料株式会社 | Electroplate liquid |
US11174565B2 (en) | 2017-03-27 | 2021-11-16 | Mitsubishi Materials Corporation | Plating liquid |
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