JPS61117259U - - Google Patents

Info

Publication number
JPS61117259U
JPS61117259U JP30685U JP30685U JPS61117259U JP S61117259 U JPS61117259 U JP S61117259U JP 30685 U JP30685 U JP 30685U JP 30685 U JP30685 U JP 30685U JP S61117259 U JPS61117259 U JP S61117259U
Authority
JP
Japan
Prior art keywords
heat dissipation
semiconductor element
spring
thermoplastic resin
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30685U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP30685U priority Critical patent/JPS61117259U/ja
Publication of JPS61117259U publication Critical patent/JPS61117259U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例における半導体素子
放熱装置の要部断面側面図、第２図は同装置が異
常時に作動した様子を示す断面図、第３図、第４
図は従来例における半導体素子の放熱装置の側面
図である。 １……熱可塑性樹脂で作られたネジ、２……バ
ネ、３……放熱板。

Claims (1)

    【実用新案登録請求の範囲】
  1. 放熱板と半導体素子とをバネを介して熱可塑性
    樹脂で作られたネジによつて固定してなる半導体
    素子放熱装置。
JP30685U 1985-01-07 1985-01-07 Pending JPS61117259U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30685U JPS61117259U (ja) 1985-01-07 1985-01-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30685U JPS61117259U (ja) 1985-01-07 1985-01-07

Publications (1)

Publication Number Publication Date
JPS61117259U true JPS61117259U (ja) 1986-07-24

Family

ID=30472030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30685U Pending JPS61117259U (ja) 1985-01-07 1985-01-07

Country Status (1)

Country Link
JP (1) JPS61117259U (ja)

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