JPS61116702A - 車輛用灯具 - Google Patents

車輛用灯具

Info

Publication number
JPS61116702A
JPS61116702A JP59236690A JP23669084A JPS61116702A JP S61116702 A JPS61116702 A JP S61116702A JP 59236690 A JP59236690 A JP 59236690A JP 23669084 A JP23669084 A JP 23669084A JP S61116702 A JPS61116702 A JP S61116702A
Authority
JP
Japan
Prior art keywords
light
light emitting
light guide
front lens
emitting diode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59236690A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0374441B2 (enExample
Inventor
仁野　直日
芹澤　啓之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP59236690A priority Critical patent/JPS61116702A/ja
Publication of JPS61116702A publication Critical patent/JPS61116702A/ja
Publication of JPH0374441B2 publication Critical patent/JPH0374441B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
JP59236690A 1984-11-12 1984-11-12 車輛用灯具 Granted JPS61116702A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59236690A JPS61116702A (ja) 1984-11-12 1984-11-12 車輛用灯具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59236690A JPS61116702A (ja) 1984-11-12 1984-11-12 車輛用灯具

Publications (2)

Publication Number Publication Date
JPS61116702A true JPS61116702A (ja) 1986-06-04
JPH0374441B2 JPH0374441B2 (enExample) 1991-11-27

Family

ID=17004324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59236690A Granted JPS61116702A (ja) 1984-11-12 1984-11-12 車輛用灯具

Country Status (1)

Country Link
JP (1) JPS61116702A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335089U (enExample) * 1986-08-25 1988-03-07
JP2002140908A (ja) * 2000-08-28 2002-05-17 Valeo Vision 簡略された光学的構造体を備えた表示ランプ
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage
EP1635403A1 (de) * 2004-09-08 2006-03-15 Asetronics AG Isoliertes Metallsubstrat mit mehreren Leuchtdioden
JP2007109656A (ja) * 2005-10-12 2007-04-26 Samsung Electro-Mechanics Co Ltd Ｌｅｄバックライトユニット
US9818921B2 (en) 2010-06-24 2017-11-14 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6335089U (enExample) * 1986-08-25 1988-03-07
JP2002140908A (ja) * 2000-08-28 2002-05-17 Valeo Vision 簡略された光学的構造体を備えた表示ランプ
WO2003049207A1 (fr) * 2001-11-16 2003-06-12 Toyoda Gosei Co., Ltd. Diode electroluminescente, eclairage a diode et dispositif d'eclairage
US7781787B2 (en) 2001-11-16 2010-08-24 Toyoda Gosei, Co., Ltd. Light-emitting diode, led light, and light apparatus
JP2003158302A (ja) * 2001-11-21 2003-05-30 Toyoda Gosei Co Ltd 発光ダイオード
EP1635403A1 (de) * 2004-09-08 2006-03-15 Asetronics AG Isoliertes Metallsubstrat mit mehreren Leuchtdioden
JP2007109656A (ja) * 2005-10-12 2007-04-26 Samsung Electro-Mechanics Co Ltd Ｌｅｄバックライトユニット
US9818921B2 (en) 2010-06-24 2017-11-14 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component
US10217915B2 (en) 2010-06-24 2019-02-26 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor component

Also Published As

Publication number Publication date
JPH0374441B2 (enExample) 1991-11-27

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