JPS61114886A - Printing material and production thereof - Google Patents

Abstract

PURPOSE:To contrive secure, easy and inexpensive correction of a printed part, by a method wherein the entire printing region is irradiated with laser light to eliminate a marked part, then a printing material is coated with the same material as the raw material of the printing material, and printing is newly conducted by laser marking. CONSTITUTION:To eliminate a laser-marked part 3 in the surface of a package 2 of a semiconductor device 1, the entire part of a printing surface 12 of the package 2 is irradiated with laser light 4 to remove a surface part, thereby eliminating the marked part 3 in the surface of the package 2. In irradiation with the laser light 4, since the package 2 part at the marked part 3 has been denatured by heat at the time of laser marking and has not been subjected to any processing after molding, the part is melted more easily than other surface parts which are neither denatured nor strained. Accordingly, the laser irradiation results in that the marked part 3 can not be distinguished from the surrounding part, namely, the marked part 3 is eliminated without leaving any trace.

Description

DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a printed body and a method for manufacturing the same, and particularly to a technique for correcting the printed surface of a laser-marked printed body.

[Background technology]

Conventionally, transfer stamping technology using ink has been known as a marking technology for articles such as electronic parts, but since this technology requires a lot of incidental work and has low productivity, recently laser marking using laser light irradiation has been used. The system has been adopted in some areas.

These laser marking techniques are applicable to metals, resins, ceramics, etc., as described in "Machine and Tools 4, April 1984 issue, April 1, 1984, pages 68 to 72," published by Kogyo Kenkyukai. It has been applied to many types of materials such as irradiation with laser light, but in all cases the printing mechanism is to partially melt the surface of the material using energy from laser beam irradiation and evaporate it to form the desired pattern of depressions. ing.

By the way, as mentioned above, laser marking performs marking (printing) by partially melting and evaporating the surface of the printed material, so the marking is difficult to erase, but on the other hand, it is difficult to correct marks printed by mistake. I know it's difficult.

In order to correct such printing errors, the present inventor investigated a method of coating the printing surface with a substance similar to the material that forms the printing body, and found that the method of directly coating the printing surface was I learned that this is not necessarily the best method for the following reasons. In other words, since the markings produced by laser beam irradiation are recessed as mentioned above, with a thin coating, the previous markings will stand out, making it necessary to recoat two or three times, resulting in low workability. As the cost increases, the cost of correction tends to increase. In addition, to improve workability, thick (coating)
It was found that the condition of the surface of the coating layer after drying was poor (it was found that if the surface of this coating layer was marked again, the marking condition would not necessarily be good).

[Purpose of the invention]

An object of the present invention is to provide a manufacturing technique that makes it possible to reliably and easily modify a marking part, particularly a laser marking part.

Another object of the present invention is to provide a manufacturing technique that allows printing correction suitable for mass production.

Another object of the present invention is to provide a manufacturing technique with low print correction costs.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

That is, in the present invention, when correcting markings on a printed material that has already been laser marked, the laser beam irradiation is performed after the entire printed surface is irradiated with a laser beam to scrape the entire printed surface and the marking portion is erased. The printed surface is coated with a material similar to the material that makes up the printed body, and new markings are printed on the surface of this coating layer using laser marking. Therefore, the present invention provides that laser light irradiation to the printed surface of the printed material can be performed in an extremely short time and that the previous printing can be reliably erased. Since it is simple and can be automated because it is simply applied uniformly to the surface, it is certainly easy and inexpensive to correct the printed portion of a printed material that has been laser marked.

〔Example〕

FIG. 1 is a schematic diagram showing the print correction principle of the present invention, FIG. 2 is a perspective view showing an outline of a laser marking device used in an embodiment of the present invention, and FIG. 3 is a semiconductor device according to an embodiment of the present invention. FIG.

In this embodiment, the printed surface (
The modification of the laser marking portion (mark) 3 consisting of the richness of the laser marking printed on the top surface (two upper surfaces) will be explained.

Essentially, the present invention only requires removing the printed portion provided on the printing surface of the printed material. That is, in the present invention, as shown in the principle diagram of FIG. By irradiating the light 4 and removing the surface layer portion of the package 2, the laser marking portion 3 dug into the surface of the package 2 to a depth of 5 to 10 IJm is removed. It should be noted that during the irradiation with the laser beam 4, the part of the package 2 forming the laser marking part 3 was altered by heat during laser marking, and as a result of no processing being added after molding, the laser beam is free from alteration or distortion. It is difficult to melt compared to the surface area other than the marking area 3. For this reason,
By the laser beam irradiation, the laser marking part 3 and its surrounding parts become indistinguishable, and as shown in FIG. 3, the laser marking part 3 disappears without leaving any trace. Further, the upper surface of the pan cage 2 after laser beam irradiation becomes a rough surface (pearl surface) as shown in FIG. Note that the leads 5 that protrude from both sides of the package 2 of the semiconductor device 1 and are bent downward from the middle are electrical terminals.

Such laser light irradiation is performed, for example, by a mask type laser marking device 6 as shown in FIG. This mask type laser marking device 6 has a C
O□The laser beam 4 oscillated from the laser oscillator 7 is reflected by a mirror 8. First condensing lens 9. Mask 10. The printing surface 12 of the package 2 of the semiconductor device 1 is irradiated with the light through an optical system consisting of a second condensing lens 11 .

Therefore, if the mask type laser marking device 6 is used to irradiate the printed surface 12 of the semiconductor device l whose printed surface is to be corrected with the laser beam 4 (see FIG. 1), the semiconductor device will be printed as shown in FIG. The entire surface layer of the printed surface 12 of the printed image 1 is removed by melting and evaporation by the laser beam 4.

As shown in FIG. 3, the semiconductor device 1 has a matte surface on the surface (printed surface 12) of the package 2, so that even in this state, the semiconductor device 1 shows the - display form of ``semiconductor device''. Therefore, the correction itself of the erroneously printed portion by laser beam irradiation does not simply serve as pre-processing prior to marking correction on the 12 printed surfaces, but also serves as marking correction.

In addition, as mentioned above, if the matte surface of the printing surface 12 alone does not display the semiconductor device l, as shown in FIG. A mark 14 indicating 10 types of semiconductor devices, 1 grade, etc. as shown in the figure may be provided.

〔effect〕

+1) According to the present invention, since the laser marking portion is corrected by irradiating the surface metal area including the corrected portion with laser light, the effect can be obtained that the correction can be performed reliably and easily.

(2) According to the above (11), according to the present invention, it is possible to correct the laser marking, which was difficult to correct in the conventional marking portion, and it is possible to achieve the effect that the manufacturing yield of semiconductor devices can be improved.

(3) According to the above (11), according to the present invention, the laser marking portion can be corrected by laser beam irradiation, which requires extremely short processing time, so that the number of correction work steps can be reduced, and the correction cost can be reduced. This effect can be obtained.

(4) From the above (1), according to the present invention, the modification of the laser marking part can be achieved by simply irradiating the surface metal area including the modification part with laser light, which facilitates mass production. is obtained.

(5) According to the present invention, the laser marking portion can be corrected by simply irradiating the surface metal area including the corrected portion with laser light or by newly printing ink on the corrected pear surface. Therefore, it is possible to simplify the correction work and to easily automate the processing work.

(6) According to the above (11 to (5)), according to the present invention, a synergistic effect can be obtained in that the repair cost can be reduced by improving the repair yield of the laser marking portion and reducing the number of man-hours for repair work.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. For example, as shown in FIG. 5, a coating layer 13 made of the same material as that of the package 2 is provided on the matte surface formed after laser beam irradiation, and marks are placed on this coating layer 13. Even if 14 is applied, the same effect as in the above embodiment can be obtained.

In this case, since the coating is applied to the satin surface, the surface of the coating N13 is flat. therefore,
For the marking performed on the surface of the coating layer 13, it is possible to use a laser marking method other than ink printing, which has good workability and high printing reliability, and also has the effect of reducing marking correction costs. . Further, in the above embodiment, a mask type laser marking device was used as the device for laser beam irradiation, but even if the laser beam irradiation is performed using a scanning type laser marking device, the same effect as in the above example can be obtained. can get.

[Application field]

The above explanation has mainly been about the application of the invention made by the present inventor to the technique for correcting the marking part of a laser-marked printed material, which is the background field of application, but the invention is not limited thereto. ,
For example, it can be applied to a technique for correcting a marking part by ink printing.

The present invention is applicable at least to techniques for modifying the surface condition of articles.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing the print correction principle of the present invention, FIG. 2 is a perspective view showing an outline of a laser marking device used in an embodiment of the present invention, and FIG. 3 is a semiconductor device according to an embodiment of the present invention. FIG. 4 is a perspective view of a semiconductor device according to another embodiment of the invention, and FIG. 5 is a partially sectional front view of a semiconductor device according to another embodiment of the invention. . DESCRIPTION OF SYMBOLS 1... Semiconductor device, 2... Package, 3... Laser marking part (mark), 4... Laser light, 5
... Lead, 6... Mask type laser marking device, 7... CO2 gas laser oscillator, 8... Reflection mirror, 9... First condensing lens, IO... Mask,
11... Second condensing lens, 12... Printing surface, 13...
... Knee Figure 1 Figure 3 Figure 5 Figure 2 Figure 4

Claims (1)

[Scope of Claims] 1. A printed material characterized in that the entire printed surface is subjected to laser light irradiation treatment. 2. The printed material according to claim 1, wherein a marking is provided on the treated surface irradiated with the laser beam. 3. The printed material according to claim 1, wherein a coating layer is provided on the treated surface irradiated with the laser beam. 4. The printed material according to claim 3, wherein the surface of the coating layer is printed. 5. The printed material according to claim 4, wherein the marking is formed by laser marking. 6. A step of irradiating the entire printed surface of the printed material with laser light, a step of forming a coating layer on the treated surface irradiated with the laser light, and a step of marking the surface of the coating layer. A method for producing a printed material, comprising: