JPS61109147U - - Google Patents

Info

Publication number
JPS61109147U
JPS61109147U JP19370984U JP19370984U JPS61109147U JP S61109147 U JPS61109147 U JP S61109147U JP 19370984 U JP19370984 U JP 19370984U JP 19370984 U JP19370984 U JP 19370984U JP S61109147 U JPS61109147 U JP S61109147U
Authority
JP
Japan
Prior art keywords
frame
positioning
mold
feeding
knockout
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19370984U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP19370984U priority Critical patent/JPS61109147U/ja
Publication of JPS61109147U publication Critical patent/JPS61109147U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の概略構成図、第2
図は本考案に用いられる制御装置の概要を説明す
るための概念図、第3図は従来の成型装置の一例
の概略構成図、第4図は第3図に示す装置に用い
られる制御回路の回路図である。 11……プレツシヤ、12……フレームストツ
パ、13……プレス、14……フレームノツクア
ウト、15……フレーム。
Figure 1 is a schematic configuration diagram of one embodiment of the present invention;
The figure is a conceptual diagram for explaining the outline of the control device used in the present invention, FIG. 3 is a schematic configuration diagram of an example of a conventional molding device, and FIG. 4 is a diagram of the control circuit used in the device shown in FIG. It is a circuit diagram. 11...Pressure, 12...Frame stopper, 13...Press, 14...Frame knock out, 15...Frame.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] マガジン内に収納されたフレームを金型内に送
り込む送出手段と、前記フレームの金型内におけ
る位置を固定する位置決め手段と、前記フレーム
の位置決め後にこのフレームを押圧して所定の変
形を加えるノツクアウト手段と、前記送出手段、
位置決め手段およびノツクアウト手段を制御する
制御手段とを備える半導体装置用フレーム成型装
置。
A feeding means for feeding a frame stored in a magazine into a mold, a positioning means for fixing the position of the frame in the mold, and a knockout means for pressing the frame to apply a predetermined deformation after positioning the frame. and the sending means,
A frame molding apparatus for a semiconductor device, comprising a positioning means and a control means for controlling a knockout means.
JP19370984U 1984-12-21 1984-12-21 Pending JPS61109147U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19370984U JPS61109147U (en) 1984-12-21 1984-12-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19370984U JPS61109147U (en) 1984-12-21 1984-12-21

Publications (1)

Publication Number Publication Date
JPS61109147U true JPS61109147U (en) 1986-07-10

Family

ID=30751134

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19370984U Pending JPS61109147U (en) 1984-12-21 1984-12-21

Country Status (1)

Country Link
JP (1) JPS61109147U (en)

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