JPS61108488A - Laser beam machine - Google Patents

Abstract

PURPOSE:To execute with a high efficiency a laser beam machining which has matched a pattern by providing a means for aligning automatically the following work, on a work loading position of an automatic supply device. CONSTITUTION:A work 4 drawn out of a loading device 6 is fixed onto a work placing base 10 by a loading device 2 on a turntable 5. A data of a pattern of the surface of the work 4 which has been measured by a camera 8, etc. is sent to an image data processor 9, and a position relation of a reference position and the pattern is derived. Based on this data, a shift from the reference position is corrected by the placing base 10 provided with a movement correcting means. During this time, a laser beam machining of the preceding work 4 is being executed, and after its machining has been ended, the following work 4 whose movement has been corrected is carried to a machining position 20. By taking into consideration the shift quantity which has been derived in said alignment process, a condensing device 2 of a laser beam is corrected and moved by a moving mechanism 3.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a highly efficient laser processing machine that fully automates the supply and alignment of workpieces to be laser processed.

As with general cutting machines, automation has progressed significantly in laser processing machines as well. - For example, in a hybrid IC laser processing machine, it is common to install a workpiece automatic supply device to continuously supply the workpiece to the processing section where laser processing is performed. The problem with such automated equipment is that the pattern on the surface of the hybrid IC, which is the workpiece, is formed with individual deviations from the end face of the substrate, so it is difficult to position the workpiece based on mechanical end face references. An example of this is that the pattern is processed at a position that is shifted from the pattern. To avoid such a situation, the pattern on the substrate is recognized, the deviation from the normal position is detected, and the angle and position are corrected and processed. Automatic alignment devices using so-called pattern recognition are being installed. This automatic alignment device uses a camera to read the pattern image and processes it with a computer to detect deviations from the normal position, but this usually takes a non-negligible amount of time due to the processing process. .

In conventional fully automated equipment for laser processing machines, the workpiece is placed in the loading position of the automatic feeding device, and one workpiece is pulled out from the loading position and transported to the processing position of the main body of the processing machine.
At this processing position, automatic alignment is performed using pattern recognition. For this reason, the time required for alignment is added to the subsequent processing time, making it impossible to shorten the overall processing time, which hinders efficiency improvement in laser processing.

The present invention was made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a laser processing machine that can perform laser processing according to a pattern with complete automation (high efficiency).

The gist of the present invention is to install an automatic positioning device at a workpiece loading position of an automatic workpiece supply device, and use the time when the preceding workpiece is being processed to align the subsequent workpiece. More specifically, at the workpiece loading position, the workpiece is placed on a variable-position workpiece and is moved along with the workpiece to a predetermined position using a pattern recognition device. In addition, by moving the entire stage to the processing position using a conveyance device and mechanically setting it at a fixed position, processing can be performed in accordance with the original pattern.

In an embodiment of the present invention, instead of using such a stage, the automatic alignment device may be configured to simply measure the amount of deviation from a specified position, and then perform processing by correcting this amount of deviation. . Alternatively, the above two forms may be partially used together.

Embodiments of the present invention will be described below with reference to the drawings. The following embodiment is an example in which the above-mentioned deviation amount is corrected by moving the stage only after the rotation angle is known, and the positional deviation is corrected during processing.

The accompanying drawing is a plan view of the laser processing machine according to the above embodiment. In the figure, reference numeral 1 is a laser oscillator, 2 is a condensing device for condensing and irradiating the workpiece 4 with the laser output 30 of the laser processing machine 1, and 3 is a condensing device for irradiating the workpiece 4 with the laser output 30 of the laser processing machine 1. A moving mechanism 5 for relatively moving the workpiece 4 pulled out from the loading device 6 and placed at the loading position 21 to the processing position 2
7 is a device for discharging and storing the workpiece 4 conveyed to the discharge position 22, and 8 is a turntable constituting a part of the automatic feeding device for moving the workpiece 4 to the loading position 21. 4 a camera constituting a part of an alignment device using pattern recognition to detect positions; 9 is an image data processing device that processes image data obtained by the camera 8 and derives a deviation from a reference position; 10; This is [
This stage is equipped with means for moving and correcting the workpiece 4 to a reference position based on the amount of deviation obtained. Processing position 20° Loading position 21. The discharge position 22 is located around the center 0 of the turntable 5, and the central angle of each of the positions with respect to the center OK is determined by a predetermined angle. In the illustrated embodiment, the positions are located at an angle of 120° together.

In such a configuration, the operations from supplying the workpiece to laser processing and ejection will be explained as follows. First, the workpiece 4 is pulled out by an appropriate means (not shown) from the loading device 6, which is a part of the automatic feeding device, and placed at the loading position 21 on the turntable 5, which is also a part of the automatic feeding device. Then, it is placed and fixed on the stage 10. Next, a part of the pattern formed on the surface of the workpiece 4 is observed by a camera 8 fixed on a strong frame (not shown) that constitutes a part of the pattern recognition device, and the obtained data is The image data is sent to the image data processing device 9, where the positional relationship between the predetermined reference position and the pattern is derived. The data obtained is the amount of translation and rotation angle from the reference position. In order to detect the rotation angle, two locations on the pattern may be observed if necessary. Based on the data obtained in this way, the deviation from the standard position is corrected using the stage 10 equipped with a movement correction means composed of a motor (not shown), but in this embodiment, only the rotational deviation is corrected. It has been corrected. During this time, the preceding workpiece 4 is being laser-processed, and immediately after the processing is completed, the subsequent workpiece 4, which has been moved to the reference position and corrected, is transported to the processing position 20 by the turntable 5, and the laser oscillator is immediately activated. A condensing device 2 that condenses the laser output 30 oscillated from the condenser 1 is driven by the moving mechanism 3, and processing is started while the laser beam is moving.

In this case, the workpiece 400 is
The position is shifted in parallel from the reference position that should be correct, but this amount of shift is derived during the alignment process.

The moving mechanism 3 that drives the light condensing device 2 takes this into account and moves the light condensing device 2 in a corrective manner.

Of course, the amount of parallel movement may be corrected by using the stage 10 equipped with the movement 1 - positive means, or conversely, the amount of parallel movement and rotation angle obtained by the alignment device without this means may be corrected. It may also be possible for the moving mechanism 3 of the condensing device 2 to take corrective action directly, taking all these into account.

The workpiece 4 processed in accordance with the pattern in this manner is conveyed from the turntable 5Vc to the discharge position 22, and is stored in the discharge storage device 7 by a means (not shown), thus completing one cycle. Needless to say, the subsequent workpiece 4 is supplied and processed during this discharge.

As explained above, the laser processing machine of the present invention can completely automatically and highly efficiently process a pattern (alignment) by disposing an automatic positioning device at the workpiece loading position on the automatic feeding device. Laser processing can be performed.

It should be noted that the present invention is not limited to the configurations shown in the embodiments and drawings described above, and that various modifications and changes may be made within the scope of the claimed configurations (within the scope of the described configurations, and these do not constitute the scope of the present invention. It is included in the scope.

[Brief explanation of drawings]

The drawing is a schematic plan view of a laser processing machine according to an embodiment of the present invention. l...Laser dust generator, 2...Light condensing device. 3... Moving mechanism, 4... Workpiece, 5...
・Turntable, 6... Loading device. 7... Discharge and storage device, 8... Camera of pattern recognition device, 9... Image data processing device, 10... Workpiece stand, 20... Processing position,
21... Loading position, 22... Discharging position, 3
0...Laser output.

Claims (1)

[Claims] a laser oscillator, a condensing device that condenses the laser output of the laser oscillator, a moving mechanism that moves the target workpiece relative to the focal point of the condensing device, and a moving mechanism that moves the target workpiece at a fixed position of the moving mechanism. What is claimed is: 1. A laser processing machine having an automatic feeding device for conveying and placing objects, characterized in that an automatic positioning device is disposed at a target workpiece loading position on the automatic feeding device.