JPS61107108A - Profile meter - Google Patents

Abstract

PURPOSE:To enable short-time proofreading at each necessary measuring time other than fundamental proofreading, by successively performing simple proofreading by using the data of the fundamental proof reading. CONSTITUTION:When a simple proofreading order is imparted, a three-point set plate thickness coarser than fundamental proofreading is inputted within the input range of the seven-point set plate thickness of the fundamental proofreading by a keyboard 228 to be stored in RAM223. Next, CPU224 calculates three proofreading points on the basis of the calculation formula of ROM222 and imparts simple proofreading processing at one proofreading point to CPU of plate thickness converting units 21a-21c from CPU224. A reference plate driving part 227 is operated by the order of CPU224 and selects the reference plate 13 corresponding to one proofreading point and sets the same to the front surface side of each of radiation generators 12, ... to irradiate each of fanwise radiation beams 14, .... The units 21a-21c calculate the detection voltages of all channels by inverse operation on the basis of sensitivity coefficient between channels preliminarily calculated by fundamental proofreading and calculates a proofreading curve to use the same in the proofreading of the profile measurement of an article 10 to be measured.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to an improvement in a profile meter that measures the profile (cross-sectional shape) of, for example, a plate-shaped object to be measured.

[Technical background of the invention]

Conventionally, as a means for measuring a copper plate being rolled using a profile meter, a plurality of X-ray generators are mounted on the upper frame of a CG frame formed to sandwich an object to be measured such as a steel plate at a required interval. A reference plate that can be moved forward and backward individually is placed on the front side of the X-ray generator, while the lower frame corresponds to the fan-shaped X-ray beam emitted from each X-ray generator. A plurality of multi-channel X-ray detectors are installed in such a manner as to receive the same.

Furthermore, this C-type 7 frame is provided with a data collection section that collects data obtained for each channel of each X-ray detector, and the data collected here is sent to a signal processing section outside the Cm frame. .

This signal processing section includes a system controller that centrally controls the entire system, and each X
a plurality of X-ray control units provided for each X-ray generator that provides drive signals to the ray generator; and a plate thickness conversion unit that receives data from the data collection unit, converts it into a plate thickness signal, and provides it to the system controller. Part and 1. Based on the data from the system controller, calculate the thickness measurement position of each multi-channel X-ray detector on the object to be measured from the arrangement relationship of the X-ray generator, the object to be measured, the multi-channel X-ray detector, etc.,
It is comprised of a display processing section that sends the relationship between the thickness measurement position and the thickness to a display device and displays it two-dimensionally.

[Problems with background technology]

By the way, in this type of profile meter, in order to obtain the relationship between the detected voltage and the plate thickness, as mentioned above, the reference plate is sequentially inserted into the front side of each X-ray generator, and the corresponding reference plate is inserted from each X-ray generator. A calibration signal is obtained by detecting the transmitted X-ray beam incident through the reference plate with each X-ray detector, and calibration is performed using this calibration signal. Furthermore, the generation of X-rays emitted from the X-ray generator remains unstable over the long term, and therefore calibration is frequently performed to remove the influence of drift. In particular, in the case of a profinil meter, each channel can be thought of as one X-ray thickness meter, but if each channel is calibrated independently, highly accurate calibration data can be obtained, but the calibration time is long. The drawback is that it requires time. That is, the calibration time is required to be twice as long as the number of channels compared to a single X-ray thickness meter, and the time required is the time in addition to the increase in statistical noise. Moreover,
The amount of statistical noise is determined by the volume ratio in the case of an ionization chamber type xwA detector, but the volume for one channel of each multi-channel X-ray detector is smaller than the conventional X#! Compared to the ionization chamber type X-ray detector used in thickness gauges, it is smaller at approximately 17□(4), and as a result, the statistical noise increases approximately 10 times, resulting in a problem that requires additional calibration time. be.

[Purpose of the invention]

The present invention has been made with attention to the above points, and provides a profile meter that performs simple calibration when necessary in each measurement in addition to the original basic calibration, thereby reducing the calibration time to a single line. There is a particular thing.

[Summary of the invention]

In addition to a basic calibration process in which reference plates of a plurality of different plate thicknesses are sequentially set to obtain a highly accurate calibration curve and an inter-channel sensitivity coefficient, the present invention also includes At this time, the average detection voltage is calculated for each block of multiple channels from the detection voltage obtained from the multi-channel detector, and the average detection voltage and the sensitivity coefficient between channels are calculated backwards to calculate the average detection voltage for all channels. This is a profile meter that performs calibration in a single time by adding a simple calibration process that calculates the detected voltage and creates a calibration curve.

[Embodiments of the invention]

Next, an embodiment of the present invention will be described with reference to FIGS. 1 to 7. Fig. 1 is a block diagram of the entire profile meter, Fig. 2 is a block diagram of the data collection section shown in Fig. 1, Fig. 3 is a block diagram of the system shown in Fig. 1; The configuration diagram of the plate thickness conversion unit shown in the figure,
5 and 6 are a flowchart of the basic calibration process, which is part of the gist of the present invention, and a calibration curve diagram obtained by the basic calibration process, and FIG. 7 is a simple diagram, which is also part of the gist of the present invention. It is a flow chart of proofreading processing.

First, the overall configuration of the profile meter will be explained with reference to FIG. 1 and FIG. M2. In these figures, reference numeral 10 denotes an object to be measured, such as a steel plate being rolled, for example, which is intermittently stopped or continuously transported in a direction perpendicular to the plane of the paper.

Reference numeral 11 is a lit frame formed to sandwich the object to be measured 10 at a required interval, and the upper frame l1m includes a plurality of radiation generators 12, . . . and these radiation generators 12, . . . A reference plate 13... is provided on the front side of the frame so as to be able to move forward and backward individually.On the other hand, a fan-shaped radial beam 14... emitted from each radiation generator 12... is provided on the lower frame llb. A plurality of multi-channel detectors 15 are provided which receive radiation from each radiation generator 12, . . . . The incident radiation detected by these multi-channel detectors 15 . The electrical signal proportional to the intensity is also C deaf frame 1)
The data is sent to the data collection unit 16 installed in the.

This data acquisition section 16 includes a multi-channel detector 15.・
A number of data collection units equal to the number of: '! t1ea
~16c, each multi-channel detector 15. The detection signals from ... are collected and digitized, and the signal processing unit 20
Each data collection unit has the function of transmitting data to
6a to 16a are preamplifiers 1 for amplifying each channel detection signal of the multi-channel detector 15 as shown in FIG.
61, a transmission control unit 162, and a transmission control unit 162 that transmits each channel detection signal amplified by the preamplifier 161.
A multiplexer f163 that sequentially captures and outputs the same position in the width direction using a high-speed timing signal from the
A human/D converter circuit 164 that digitizes the detection signal for each channel output from the multiplexer f16S and a timing signal from a transmission control section 162 collectively digitize the multiple channels of the multichannel detector 15. A transmission driver 165 sends the detection data in the width direction of the position to the plate thickness conversion unit section 21 of the signal processing section 20.
It is composed of. Note that the transmission control unit 162 supplies required timing signals to each of the components 163 to 165 in accordance with instructions from the signal processing unit 20.

The signal processing unit 20 is provided corresponding to a system controller 22 that centrally controls the entire system, and each radiation generator 12 that provides a drive signal to each radiation generator 12 based on a command from this controller 22. a plurality of radiation control units 23 and a plurality of plate thickness conversion units) 21a to 21
The plate thickness conversion unit section 2 with a and the display processing section 24
The thickness measurement position and the thickness signal processed by the display processing section 24 are displayed on the display device 25.

Next, FIG. 3 is a diagram showing the internal configuration of the system; controller 222, which transmits data processing programs, calibration processing programs, and data such as calculation formulas and fixed coefficients to the system bus 221. In addition to a ROM (read-only memory IJ) 222 for storing data and a RAM (random access memory) 223 for storing arithmetic processing data and other necessary data, programs and necessary data stored in the ROM 222 and ROM2f4 are stored. A central processing unit (hereinafter referred to as CPU) 224, etc., which reads data and executes calculations, is connected. The system bus 221 also includes an interface 22.
Transmission drive 165 of the data collection unit 16 via 5
and a line 22 whose one end is connected to the transmission control unit 162
6 is connected. 227 is a reference plate drive unit, 228 is a keyboard, and 229 is an interface. In addition,
Although not shown, the display processing section 24 is connected to the system bus 221.

Furthermore, FIG. 4 is a diagram showing a specific configuration example of the plate thickness conversion unit section 21, in which a common R is connected to the system bus 221, for example.
It has an internal bus 212 via AM21Z, and this bus 212 has a CPU 213゜ROM 2f4 and RA.
MJ Z 5 is connected 0 Next, the operation of the profile meter configured as above will be explained.

(1) Plate Thickness Data Measuring Operation As shown in the first factor, it is assumed that the object to be measured 10 is being conveyed on the line from the depth direction of the page toward you at a predetermined conveyance speed. In this state, if a data measurement start command is given manually or according to a program, the system controller 2
2 sends drive start control data to the radiation control unit 23. Here, the radiation control section 23 controls each radiation generator 12.・
For example, each radiation generator 12 is continuously driven and controlled.
．． The fan-shaped radiation beam 14 is directed from ... to the object to be measured lo.
Irradiate to the side. At this time, each reference plate 13. . . , drive coils (not shown) are demagnetized in response to signals from each reference plate drive unit 227, and the radiation generators 12 . ... is set back from the front side.

Each radiation generator 12. Radiation beam irradiated from 14. The intensity of each multi-channel detector 15. is attenuated according to the thickness of the object to be measured 10. It is incident on... Each multi-channel detector 15. Each channel detects an incident radiation beam, converts it into an electrical signal proportional to the radiation intensity, and then sends the signal to a corresponding data collection unit 16a to 16c of the data collection section 16. As shown in FIG. 2, each data acquisition unit 16a to 16c individually amplifies the detection signal for each channel of the corresponding multi-channel detector 15 using a preamplifier 16, and then uses a multiplexer f163 to amplify the detection signal for each channel of the corresponding multi-channel detector 15, and then uses a multiplexer f163 to follow the detection signal for each channel at the same position in the width direction. The detection signal for each channel is selected and sent to the A/D conversion circuit 164, where it is digitized and then sent to the transmission drive 165.
The signal is transmitted to the signal processing unit 20 side.

In the signal processing section 20, the data from the data collection section 16 is sent to the line 226 and the interface 2 as shown in FIG.
25 and the system bus 221, and stored in the common RAM 211 of the board thickness conversion unit section 21 (see FIG. 4). Each plate thickness conversion unit 21a to 21a of the plate thickness conversion unit section 2 has a ROM 214 in the CPU 213.
Common RAM, according to the program? After reading the data stored in J1 and determining the plate thickness data in the width direction at the same position based on a predetermined calculation formula, for example, the common R
Store in AM211. Then, this plate thickness data is read by the CPU 224 shown in FIG. 3 according to the program in the ROM 222, and is spliced into the object
Obtain plate thickness data for the entire width direction of o, and use this to create profile data for 1° of the object to be measured. (2) Basic calibration processing operation This calibration processing operation can be performed according to the flowchart shown in Fig. 5. . That is, when a basic calibration command is given in step S1 either manually or according to a program, the operator inputs a measurement range within a predetermined range from the object to be measured 10. For example, the minimum value is 1.0 m, the maximum value is 3.0 m.
Input one set of data, such as 0 M (step S, ?). The measurement range input from this keyboard 228 is RAM, ? It is stored in 23. On the other hand, R.O.
Predetermined calibration point combination data is stored in M222. For example, as shown in Figure 6, Tel, 'rC
,,..., Tea (.

Next, in step S3, the CPU 224 uses the ROM 222
The calibration point is calculated based on the calculation formula of the program 2. That is, to calculate this calibration point, since the measurement range is input in step S2 and the calibration combination data is stored in the ROM 222, the CPU 224 reads out the set plate thickness and selects a calibration point that sufficiently covers the measurement range. Pick up the set plate thickness and reference plate combination data. Therefore, through this step S3, the number of calibration points can be known. In step S4,
For example, if you enter a measurement range of 1.0, 3.0, the set plate thickness that sufficiently covers this range will be from 0.51 to 0.
, SU will be elected for up to 3.5 terms. Seven calibration points are calculated, and among them, the one with the smallest set plate thickness is 0.
This shows that the calibration process is performed with 5tt-n=1.

Next, in step S5, the reference plate driving section 227 operates according to a command from the CPU 224, selects the reference plate 13 corresponding to O, S t, and selects the reference plate 13 corresponding to each radiation generator 12. ...
Set it on the front side.

After that, a drive control signal is given to the radiation control unit 23 based on the same command from the CPU 224, and the radiation generator 12.
. . . fan-shaped radiation beam 14. ...is irradiated. At this time, it is assumed that the object to be measured 10 is not set between the C-shaped frames 11. In this way, the radiation generator 12. ... from the reference plate 13. The radiation beam output through each multi-channel detector 15.・・・
It is detected by each channel detection element of ・, where it is converted into a voltage signal proportional to the radiation intensity, and as mentioned above, it is sent to the signal processing section 20 through the data acquisition section 16 and . Channel detector 15
The information is collected by each of the plate thickness conversion units 21a to 21a of the plate thickness conversion unit section 2) corresponding to the plate thickness conversion unit section 2) (step s6).

In each plate thickness conversion unit 213 to 21c, the CPU 2
Based on the program in the ROM 214, the JJ performs all CH// for the 0.5t reference plate 13, that is, Tc shown in FIG.
Find the detection voltage of the channel (#3 is referred to as ve), and calculate R
AM, 'Store in 15 or 211 (step 8y
).

Subsequently, each plate thickness conversion unit 21a to 21a divides all channels into a plurality of groups in step S8, and calculates an inter-channel sensitivity coefficient based on the following formula. In the above equation, R1jk is the inter-channel sensitivity coefficient, 1 is the channel number seen from the multiple multi-channel detectors 15, ..., and j is the calibration point number (Te1 in Fig. 6.
, ”, ), k is the block number (for example, 16 channels are one block), the denominator of the above equation is the detection voltage of each channel when the reference plate 13 of each thickness is inserted, and the numerator of the above equation is the This is the average detection voltage of, for example, 16 channels belonging to the denominator block when each block is considered as one radiation detector.

After completing the calculation of the inter-channel sensitivity coefficient at the plate thickness Tc in this way, the process returns to step 85 and the reference plates 13, . . . having the plate thickness Tcg are inserted.
Process. Therefore, the detection voltages Vel to Van for the plate thicknesses Tc1 to Ten are obtained, and the calibration curve shown in FIG. 6 is obtained, which is applied to the common RAM, ? 11 and store it in a table. Note that the calibration curve is obtained using a multi-item approximation formula, an interpolation method, or other appropriate calculation formula.

(3) Simple calibration processing operation This calibration processing operation is performed when necessary between one plate thickness data measurement and the next plate thickness data measurement, and is carried out according to the flowchart shown in FIG. That is, when a wire calibration command is given in step 811 either manually or according to a program, the operator enters a rougher set plate thickness than the basic calibration on the keyboard 228 within the input range of the set plate thickness for the basic calibration.
Input by. In the basic calibration, 1.- As an example, it was stated that 7 points are input, but in this simple calibration, for example, the set plate thickness of 3 points is input (step 812) o The set plate thickness input using this keyboard 228 is RAMj
23.

Next, in step Sτ3, 1. CPU224 is ROM2
For example, three calibration points are calculated based on the calculation formula of No. 22 program. Thereafter, in step SJ4, simple calibration processing for one calibration point (n=1) is provided to the CPU 213 of each plate thickness conversion unit 21a to 21a from the cpσ 224.

Next, in step 815, the substrate drive unit 227 operates according to the command from the cptr 224, selects the reference plate 13 corresponding to one calibration point, and selects the reference plate 13 corresponding to one calibration point, and selects the reference plate 13 for each radiation generator 12.
Set it on the front side of... After that, the same (CPU
,? A drive control signal is given to the radiation control unit 23 based on the command of the radiation generator 12. . . . fan-shaped radiation beam 14. ...is irradiated. At this time, it is assumed that the object to be measured IO is not set between the C-frames 11. In this way, the radiation generator 12. The radiation beams output from the reference plates 13, . . . are sent to the respective multi-channel detectors 15, . ... is detected by each channel detection element, where it is converted into a voltage signal proportional to the radiation intensity, and as described above, it is sent to the signal processing section 2o through the data acquisition section 16 and the interface 25, and is used for multi-channel detection. The average detected voltage for each block is obtained by dividing the detected voltage of the plurality of channels for each block by the number of channels of the block. (step 816).

Furthermore, each plate thickness conversion unit 21a to 21c is connected to the CPU 2.
13 is ROM,? 1 based on 14 programs
Since the inter-channel sensitivity coefficient (this is referred to as Ri) has been determined in advance in the standard calibration for the reference plate 13 at each of the two calibration points, the detected voltages of all channels are determined by back calculation based on this sensitivity coefficient (step 817). .

■ This equation can be transformed into Vt
can be estimated from the sensitivity coefficients between all channels by basic calibration, and since V was determined in step S16, the detected voltages of all channels can be immediately calculated backward from the average voltage (2) for each block. Therefore, for example, if steps 815 to S17 are repeated for the reference plate 13 at three calibration points, step S
At step 18, a calibration curve as shown in FIG. 6 can be calculated, which is used for the calibration of the next profile measurement of the object to be measured 10.

Therefore, according to the above configuration, in the long term, basic calibration is performed for each set plate thickness for each channel to obtain a calibration curve, and the influence of drift, etc. that occurs during these basic calibrations can be considered. The calibration curve was calculated by using fewer reference plates than in the basic calibration and by back calculating the detection voltage of all channels using the data of the basic calibration and the average detection voltage of each block.
Calibration can be performed in a short time between data measurement of the object to be measured 1o and the next data measurement. Therefore, it is very useful for applications where calibration time is limited, such as rolling lines.

In addition, although the above embodiment has one system controller 22, the system controller 22 is provided in a number corresponding to the number of radiation generators I2,
The radiation control unit 23 and the plate thickness conversion unit may correspond to each other with 1=1. In this case, each system controller 22 will individually control its operation based on instructions from the display processing section 24 or the keyboard. Further, although a transmission control section 162 is provided for each data collection unit of the data collection section 16, this is provided for each multi-channel detector 15. May be used in common with... Similarly, the transmission drive 165 can also be shared. Further, although the calibration curve was obtained by the plate thickness conversion unit 21, it may be obtained by the system controller 22 side. In addition, the present invention can be implemented with moderate modifications without departing from the gist thereof.

〔Effect of the invention〕

As described in detail above, according to the present invention, simple calibration is performed sequentially using basic calibration data, so calibration can be performed in a single time when necessary between each measurement. For example, if the calibration time is determined during rolling, It is possible to provide a profile meter that can sufficiently cope with such cases, and in particular, when drift occurs, the influence can be easily removed and accurate measurement data can be obtained.

[Brief explanation of the drawing]

1 to 7 are shown to explain one embodiment of the profile meter according to the present invention, FIG. 1 is a configuration diagram of the entire profile meter, and FIG. 2 is a data collection section of FIG. 1. , Figure 3 is a hardware configuration diagram of the system controller in Figure 1, Figure 4 is an internal configuration diagram of the plate thickness conversion unit in Figure 1, and Figures 5 and 6 are basic diagrams of the system controller. Calibration processing operation and its calibration curve diagram, Fig. 7 shows simple calibration processing operation ^1o...Object to be measured, 12...Radiation radiation generator, 13...Reference plate, No.5
...Multi-channel/channel detector, 16...Data acquisition section,
20... Shinku processing section, 2... Board thickness conversion unit section, 22... System controller, 23... Radiation control section, 24... Display control section, 211... Common memory, 213...CPU, 214...ROM, 216
...RAM, 222...ROM. 223...RAM, 224...CPU, 227...
・Reference plate drive unit. Applicant's agent Patent attorney Takehiko Suzue Figure 1 2
゜go b 2nd EJ Fig. 5

Claims (1)

[Claims] Reference plates of different thicknesses are set in the radiation irradiation path of the radiation generator, and the radiation incident from the radiation generator through the reference plates is detected by a multi-channel detector, and this detected data is used to create a calibration curve. In the desired profile meter, a plurality of set plate thicknesses are specified within a range expected in advance according to the object to be measured, and the reference plate corresponding to these set plate thicknesses is set, and at this time, the multi-channel detector A basic calibration processing means that collects the detection voltages of all channels obtained from the above to obtain a calibration curve and inter-channel sensitivity coefficient, and a set plate thickness for simple calibration that is smaller than the plurality of set plate thicknesses by this basic calibration processing means. At the same time, the reference plate corresponding to each set plate thickness for simple calibration is set, and at this time, the average detection voltage of a plurality of channels that have been divided into blocks in advance is obtained from the detection voltage of all channels obtained from the multi-channel detector. A profile meter characterized in that it has simple calibration processing means for determining a calibration curve for simple calibration from the average detected voltage for each block and the inter-channel sensitivity coefficient, and is configured to perform calibration in a short time.