JPS6110231A - Method of producing electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing electronic components, and more particularly to a method for preventing exposure of a capacitor element from a resin material in a solid electrolytic capacitor.

[Prior art]

In general, this type of solid electrolytic capacitor is made of a capacitor element A made by press-molding metal powder having a valve action into a prismatic shape and sintering it, and a metal wire having a valve action in advance as an anode lead B, as shown in FIG. The anode lead BV is welded to the plate-shaped first external lead member C, and the plate-shaped second external lead member is conductively bonded to the electrode lead layer E of the capacitor element A. The capacitor element A is connected using a resin material F, and the entire circumferential surface of the capacitor element A is molded and coated with a resin material G.

By the way, this capacitor has external dimensions (LXWXH) of 6. Since the capacitor element A is formed in a small size such as OX 3.2 x 2.5■, the average coating thickness of the resin material G on the circumferential surface of the capacitor element A is 02 to 0,4 ++
It is extremely thin at m.

Therefore, for example, as shown in FIG. 9, after placing the capacitor element A and the anode lead B on the eleventh and second external lead members C and D, the anode lead B is placed on the first external lead member C. When welding to the capacitor element A, if the anode lead B is erected non-parallel (at an angle) to the axis of the capacitor element A, the capacitor element A will move in the direction of the arrow shown in the figure. For this purpose, a conductive adhesive F is applied between the electrode lead layer E of the capacitor element A and the second external lead member. There is a problem in that not only mechanical connectivity is impaired, but also a portion of the capacitor A is exposed from the resin material G, and moisture resistance is also impaired.

Therefore, in order to solve this problem, the present applicant previously proposed in Utility Application No. 1983-6369 that a capacitor element is placed above the mounting portion of the second external lead member. We have proposed a solid electrolytic capacitor that has an L-shaped protrusion that restricts movement.

[Problem that the invention seeks to solve]

According to the above proposal, the upward movement of the capacitor element placed on the mounting part is restricted by the retention of the protrusion, which prevents the capacitor element from being exposed from the resin material, and also improves moisture resistance. This can also be improved.

However, because the protruding part is pre-cut and formed into an L shape in the lead frame state, when mounting the capacitor element on the lead frame, the capacitor element is placed between the mounting part and the protruding part. Since it has to be inserted, there is a problem that not only is mass productivity impaired, but also movement in the lateral direction cannot be prevented.

SUMMARY OF THE INVENTION Therefore, it is an object of the present invention to provide a method of manufacturing an electronic component that can improve mass productivity with a simple configuration and that can reliably control the position of the component body with respect to the external lead member.

[Failure to solve the problem]

Therefore, in order to achieve the above-mentioned objects, the present invention has the following objectives.
It has a second external lead member, forms a mounting part for the component main body at the end of the second row lead member, and integrally forms one side vcfl-up piece of the mounting part. After placing a component body having a lead terminal portion on a lead frame consisting of The upper part of the piece is bent into an L shape so that it is located on the upper part of the component body.

[Effect]

According to this invention, after the component body is placed on the placement part of the second external lead member in the lead frame, a part of the rising piece extending upward from one side of the placement part is placed on the upper part of the component body. By bending it into an L shape, the component body is held by the U-shaped portion of the mounting portion and the rising piece. For this reason, the movement of the component main body in three directions among the left and right under L is restricted, and exposure from the resin material can be effectively prevented, and mass productivity can also be improved.

〔Example〕

Next, an example of application of the present invention to a solid electrolytic capacitor will be described with reference to FIGS. 1 to 7.

First, as shown in Fig. 1, a metal wire having a valve action is attached to the anode lead (lead terminal) to a capacitor element (component main body) l, which is made by press-molding metal powder having a valve action into a prismatic shape and sintering it. Part) 2 is planted and fixed to a holder 3 made of a metal plate at a constant pitch. Then, an oxide layer and a semiconductor layer are interposed on the 10 sides of the capacitor.
- to form the electrode extraction layer 4. Next, this holder 3
The anode lead 2 is attached to the lead frame 5 shown in FIG. Polymerize to position. Note that this lead frame 5 includes, for example, frame portions 5a and 5b extending in parallel, a tie bar 5C connecting the frame portions 5a and 5b, and a first tie bar 5C formed on the frame portions 5a and 5b. a second external lead member 6.7, an L-shaped placing portion 8 formed at the end of the second external lead member 7, and a placing portion 8;
and a rising piece 9 extending upward from one side of the first side. It is composed of a notch portion 10 that separates second rising pieces 9i7 and 9bK, and a conductive adhesive 11 is applied to the placement portion 8 prior to placement of the capacitor element 1. Next, as shown in FIGS. 4 and 5, the anode lead 2 and the first external lead member 6 are welded, and the electrode lead layer 4 and the second external lead member 7 are bonded using a conductive adhesive. Connect at 11. In this state, of the rising pieces 9, the second standing piece 9b is bent LfK from the notch portion 10 so as to be positioned above the capacitor element l. Incidentally, this second rising piece 9b can be easily bent by, for example, moving a tool from the left side to the right side in the figure. Then, only the anode lead 2 is cut from the XX portion. Next, as shown in FIG. 6, the entire circumferential surface of the capacitor element 1 is covered with a resin material 12 by molding. After that, as shown in FIG. A solid electrolytic capacitor is obtained by cutting the second external lead members 6 and 7 and bending them along the side and bottom surfaces of the resin material 12.

〔Effect of the invention〕

As described above, according to the present invention, since the upright piece of the lead frame is configured in an L shape with respect to the mounting section, the component body can be mounted on the mounting section simply by lowering it. For this reason, the mounting work can be facilitated. Moreover, by bending the upper part of the upright piece into an L shape, the movement of the component body can be restricted to the extent that it can hold the component body, and exposure from the resin material can be prevented.

In addition, in the present invention, the electronic component can be applied not only to a solid electrolytic capacitor but also to a general capacitor, a semi-conductive capacitor, a resistor, and the like.

[Brief explanation of drawings]

1 to 7 are explanatory diagrams of the method of the present invention, in which FIG. 1 is a front cross-sectional view showing a state in which a capacitor element is suspended by a holder, FIG. 2 is a perspective view of a lead frame, and FIG. FIG. 4 is a plan view showing the connection of the capacitor element to the lead frame; FIG. 5 is a sectional view of the main part of FIG. 4;
Fig. 6 is a cross-sectional view showing the exterior state made of resin material, Fig. 7 is a side sectional view showing the completed state, Fig. 8 is a side sectional view of the conventional example, and Fig. 9 is a cross-sectional view showing the external lead member of the anode lead. It is a side sectional view for explaining a welding method. In the figure, l is the component body (capacitor element), 2 is the lead terminal part (anode lead), 5 is the lead frame, and 6.
7 is the first. In the second external lead member, 8 is a mounting portion, 9 is a rising piece, and 9a and 96 are first and second rising pieces. Figure 1 Cause 3 Figure 5 Figure 6 Cause D Figure 7 b9+) 7

Claims (2)

[Claims] (1) It has a first and a second external lead member, a mounting part for the component body is formed at the end of the second external lead member, and a rising piece is integrated on one side of the mounting part. A component main body having a lead terminal is placed on a lead frame formed by a conventional method such that the lead terminal portion is located on the first external lead member and the main body portion is located on the placement portion of the second external lead member. rear,
A method of manufacturing an electronic component, comprising bending the upper part of the rising piece into an L shape so that the upper part is located at the upper part of the component body. (2) Prior to placing the component body on the placing part of the second external lead member, a conductive adhesive is applied to the placing part. manufacturing method for electronic components.