JPS61101001A - Resistance construction of hybrid ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to improvements in the structure of membrane resistors in hybrid integrated circuits.

The resistance of a hybrid integrated circuit is created by forming a resistive film on the surface of the substrate.
Generally, trimming is performed by irradiating a laser beam to obtain a desired resistance value.

In this trimming, it is necessary to take into account measurement error caused by variation in contact resistance of the resistance measurement probe.

[Conventional technology]

FIG. 3 is a perspective view of essential parts of a conventional hybrid integrated circuit.

In FIG. 3, a resistive film 2 is formed by printing a thick film of, for example, ruthenium oxide in a rectangular shape at a desired position on the surface of a substrate (eg, an alumina substrate) l.

On both side edges of the resistive film 2, conductive patterns 4A and 4B of, for example, a heg-Pd system are connected and formed, respectively, and the respective conductive patterns 4A and 4B extend to the side edges of the substrate 1. A square land 5 to which a lead terminal 7 is soldered is formed at the end of the conductor pattern 4A, and a square land 6 to which another lead terminal 7 is soldered is formed at the end of the conductor pattern 4B. It is formed in parallel to the land 5.

The tip of each lead terminal 7 has two parallel fixed pieces 7a and one fixed piece 7b so as to sandwich the board l.
The lead terminal 7 is branched into two parts by abutting and sandwiching the fixing piece 7b on the top surface of each land 5.6 and the fixing piece 7a on the back side of the board 1, and soldering them. It is configured to be adhered to the substrate 1.

Note that the resistive film 2 has a resistance value that is lower than the desired resistance value in advance.
The lead terminal 7 is formed small and the lead terminal 7 is connected to each land 5.6.
Before connecting to the resistive film 2, the resistive film 2 is irradiated with a laser beam to form a trimming slit 3 and adjusted to a desired resistance value. .

At this time, the tips of the probes 8 connected to the measuring device are pressed against the lands 5 and 6 to establish contact, and the resistance values (resistance value of the resistive film 2, conductor patterns 4A, 4B, runt 5, 6 resistance value) before trimming.

Note that the desired resistance value of the resistive film 2 is: lead terminal 7 - land 5 - conductor pattern 48 - resistive film 2 - conductor pattern 4
A resistance value such that the total resistance value when B, land 6, and lead terminal 7 are connected in series is a predetermined design value.

When the probe 8 is brought into contact with a land, there is a relationship between the contact resistance and the pressing force of the probe as shown by a curve C shown in FIG.

□ In Figure 4, the vertical axis shows contact resistance and the horizontal axis shows probe pressing force. Curve C is a downwardly convex curve. 'Therefore, as the probe pressing force increases, the contact resistance decreases. It is shown that when the pressing force exceeds a certain level, the contact resistance increases again.

Therefore, the resistive film 2 is trimmed so that the value obtained by subtracting this contact resistance value from the value displayed on the measuring device becomes the desired resistance value.

[Problem that the invention seeks to solve]

However, when trimming, always use constant pressure and force.
It is very difficult to bring the probe into contact with the land.

Therefore, in the resistance structure of the conventional hybrid integrated circuit described above, when the resistance value of the resistive film is relatively small, the instability of the contact resistance value during trimming has a large effect, making it difficult to obtain the desired resistance value. , there is a problem that accuracy decreases.

[Means for solving problems]

The above conventional problem is that the lands to which the lead terminals are soldered are connected to the ends of the resistive film, and each land has a slit in its center that is parallel to the fixed piece of the lead terminal. This problem is solved by the resistance structure of the hybrid integrated circuit of the present invention, in which two land portions divided by the slit are connected in parallel to the lead terminal.

[Effect]

According to the above means of the present invention, each land is divided by a slit, and the resistors of the separated land portions are connected in parallel. By touching the probe to one of the divided land portions and measuring the resistance value, and trimming the resistive film, the influence of fluctuations in contact resistance due to instability of the probe pressing force can be reduced by almost half. It becomes possible to measure the

That is, the accuracy of the resistance value of the resistor of the hybrid integrated circuit is improved.

〔Example〕

The gist of the present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals refer to the same objects throughout the plan.

FIG. 1 is a perspective view of a main part of an embodiment of the present invention, and FIG. 2 is a plan view of a main part.

In FIG. 1, land 1 to which lead terminal 7 is soldered
5.16, lands 15a', 15b and lands 16a, 1 are formed by slits 10 parallel to the fixing pieces 7a, 7b of the lead terminal 7 in the central part of each of the leads 15 and 16.
It is divided into 6b parts.

These lands 15a and 15b are both soldered to the fixed piece 7a of the same lead terminal 7, and the land 16
a and 16b are fixed piece parts 7 of other identical lead terminals 7.
It is configured to be soldered to a.

When trimming the resistive film 2, the tip of the probe 8 is brought into contact with one of the divided land parts, for example, land 15a and land 16a, and the resistance value (of the resistive film 2) is adjusted to the desired resistance value. Resistance value and land 1'
5a, 15b, land 16a, 16a.

Trimming is performed while measuring the resistance values of the conductor patterns 4A and 4B.

The resistance value R displayed on the measuring instrument during this trimming is as shown in Figure 2,
O--'--Resistance value r+ of conductor patterns 4A and 4B
"'-"-~Resistance value r of land 15a and land 16a
2 '-"'-'-Resistance value r of land 15b and land 16b -------Resistance value r of land 15 and land 16 when there is no slit 10 = r++rz r is, for example, 50 mΩ/mouth r+=r
It is g.

Therefore, due to the instability of the pressing force of the probe 8,
The measurement error of the resistance value of land 15a and run F16a is ±1
Even if there is 0%, it is Rand 1 in the entire Rand 15.16
Land 15b for resistance r1 of 5a, 16a,
By inserting the resistor r2 of 16b in parallel, the resistance can be reduced by almost half.

Therefore, the land 5.6 without the conventional slit lO
The measurement error of the resistance value of 15.16 with the slit 10 of the present invention affects the measurement error by ±10%.
The measurement error in the resistance value is approximately half that of ±5%, which improves the accuracy of the resistance value of the resistor in the hybrid integrated circuit.

Note that in the case of the present invention and in the case of the conventional structure as well, by similarly soldering the lead terminals 7, the total resistance value including the lead terminals 7 is reduced from the value measured at the land portion. However, since this amount of decrease is approximately constant and stable, it is easy to correct it when trimming the resistive film 2.

〔Effect of the invention〕

As explained above, the present invention has excellent practical advantages in that by providing a slit in the land, the influence of unstable contact resistance of the probe is reduced, and the accuracy of the resistance value of the resistor of a hybrid integrated circuit is improved. effective.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of the main part of an embodiment of the present invention, Fig. 2 is a plan view of the main part, Fig. 3 is a perspective view of the main part of a conventional hybrid integrated circuit, and Fig. 4 shows contact resistance and probe push. It is a figure showing the relationship with pressure. In the figure, ■ is the substrate, 2 is the resistive film, 3 is the trimming slit, 4A, 4B are the conductor patterns, 5, 6, 15, 16 are the lands, 7 is the lead terminal, ? a and 7b are fixed pieces, 8 is a probe, 10 is a slit, and 15a, 15b, 16a, and 16b are lands, respectively. W-1 drunken ze 1θ 10

Claims (1)

[Claims] The lands to which the lead terminals are soldered are each connected to the ends of the resistive film, and each land is provided with a slit in its center parallel to the fixed piece of the lead terminal, and is divided by the slit. A resistor structure for a hybrid integrated circuit, characterized in that two land portions are connected in parallel to the lead terminal.