JPS61100147U - - Google Patents
Info
- Publication number
- JPS61100147U JPS61100147U JP18570884U JP18570884U JPS61100147U JP S61100147 U JPS61100147 U JP S61100147U JP 18570884 U JP18570884 U JP 18570884U JP 18570884 U JP18570884 U JP 18570884U JP S61100147 U JPS61100147 U JP S61100147U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead terminal
- semiconductor device
- heat sink
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18570884U JPS61100147U (no) | 1984-12-07 | 1984-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18570884U JPS61100147U (no) | 1984-12-07 | 1984-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61100147U true JPS61100147U (no) | 1986-06-26 |
Family
ID=30743174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18570884U Pending JPS61100147U (no) | 1984-12-07 | 1984-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61100147U (no) |
-
1984
- 1984-12-07 JP JP18570884U patent/JPS61100147U/ja active Pending