JPS6098696A - Method of producing thick film conductor pattern - Google Patents
Method of producing thick film conductor patternInfo
- Publication number
- JPS6098696A JPS6098696A JP20662983A JP20662983A JPS6098696A JP S6098696 A JPS6098696 A JP S6098696A JP 20662983 A JP20662983 A JP 20662983A JP 20662983 A JP20662983 A JP 20662983A JP S6098696 A JPS6098696 A JP S6098696A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- thick film
- film conductor
- producing thick
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、高占積率、商イぽ軸性のルＩＦ”、ｙ導体パ
ターンの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a y-conductor pattern with a high space factor and a commercial axis.
ｊｖ喚導体パタ７ンは、Ｉｉ’＋、ｂ’＋を値を請求さ
れる小匹リコイル、Ａ 密３コネクター、スピーカのボ
イスコイル等への利用が考えられている。この厚ＩＪｆ
ｉ ；、Ｉｊ導体パターン彊造方法は大別すると二袖類
である。JV conductor pattern 7 is considered for use in small recoils that require Ii'+ and b'+ values, A-close 3 connectors, speaker voice coils, etc. This thickness IJf
I;, Ij Conductor pattern forming methods can be broadly classified into two types.
一つはｆｌ’ｉ Ｌｉ！＋などをエツチングにしてパタ
ーンを形成するものであるが、ザイドエノチの間’Ｊｆ
１がらＳ）体の間隔を小さくすることが難しい。導体の
間隔を小さくすると、断面積も小さくなるので導体パタ
ーンの抵抗が増加する。例えば１５０μｍの間隔の導体
パターンを３５μｍの錦箔で形成した場合５〜８Ω／ｍ
程度でアシ、この上に更に銅を１゛ねたとしても２〜４
Ω／ｍよシ小さくすることは不可能である。One is fl'i Li! Patterns are formed by etching + etc.
1) S) It is difficult to reduce the distance between the bodies. When the spacing between the conductors is reduced, the cross-sectional area is also reduced, which increases the resistance of the conductor pattern. For example, if a conductor pattern with an interval of 150 μm is formed with 35 μm tinsel foil, it will be 5 to 8 Ω/m.
Even if you add 1 inch of copper on top of this, it will still be 2 to 4.
It is impossible to make it smaller than Ω/m.
そこで、メッキによって導体パターンを形成する方法も
考えられている。これは、予め形成した導体パターンの
上に金れを電解メンキして所定の厚みの橋、体層を形成
しようとするものであるが、必ずしも十分な占積率を廟
する導体パターンが確実に形成できるものではない。ま
た、工程が複雑となったシする点でも６：７層足できる
ものではない。Therefore, a method of forming a conductor pattern by plating has also been considered. This attempts to form a bridge or body layer of a predetermined thickness by electroplating gold on a pre-formed conductor pattern, but it is not always possible to form a conductor pattern with a sufficient space factor. It is not something that can be formed. Further, the process is complicated, and it is not possible to add 6:7 layers.
本発明は、上記のような問題を）リイ決して、高占積率
でかつ高（Ｏ頼性の厚１漠導亀パターンを得ることを目
的とする。An object of the present invention is to avoid the above-mentioned problems and obtain a 1-thickness pattern with a high space factor and high reliability.
また、ｍｊ牢な工程によって苗産性にも浸れた厚ｌｉｄ
Ｎ、体パターンの製造方法を提供することを目的とす
る。In addition, the thick lid is also imbued with seedling production through a rigorous process.
N. An object of the present invention is to provide a method for manufacturing a body pattern.
本発明による厚膜導体パターンの製造方法は、凹）η１
（に金属を充填することによって上記の目的を達成する
もので、プレス成型−無？ｊｌ： Ｖ’（メツキー電解
メッキのエイ￥から成ることに牛’１１％’Ｖを有する
。The method for manufacturing a thick film conductor pattern according to the present invention is a concave) η1
(The above object is achieved by filling metal into the press-molded material.) V' (Metsky electrolytic plated rays have a V' of 11%).
すなわち、プレス成型によって・導体パターンに応じた
凹ｆｆ１Ｘを形成し、匍、π２．岸（メッキによって金
縞層を形成したｆ＆ ％τ’：４： ’Ｉ’ｌ（メッキ
によって凹部内にのみ金Ｆ４層を形成して１１３１．中
“氷シ体パターンを形成するものである。That is, by press molding, a concave ff1X corresponding to the conductor pattern is formed, and a concavity ff1X is formed according to the conductor pattern. (A gold striped layer is formed by plating.) A gold F4 layer is formed only in the recessed portions by plating to form an ice strip pattern.
以下、１号ｌ ［Ｉｌｉに従って、本発明の実施１り１
１について説明する。Hereinafter, No. 1 l [According to Ili, implementation 1 of the present invention
1 will be explained.
；ｊ’ｓ ｌ ｌ”Ｋ１−へ’ ６ ＋−杓は本発明の
−ＩＳ ｈ’ｔ１１′／１１の各工程を示す正面断面１
ツ１である。;j's l l"K1-" 6 +-Ladle is -IS h't11'/11 front cross section 1 showing each step of the present invention
It is 1.
先ず、第１ト）１のように、熱■１Ｊ９４゛速（′１伺
１１ｉ’ｉ ｌ Ｏに金型Ｌ１を用いて凹１’；Ｋ １
２ ｆ Ｊｌｔ ｂｋする。＜ｐｉＩすｌ ｌ ｕ２外
体パターンに従った形状の雄型となっておシ、これによ
って四部１２も導体パターンに応じた形状となる。First, as in 1), heat 1J94゛ speed ('1
2 f Jlt bk. <piIsu l u2 It becomes a male shape having a shape according to the outer body pattern, and thereby the four parts 12 also have a shape according to the conductor pattern.
次に、２１３２図のように、熱司！Ｉｉり性何１１ｉｉ
１０の表面にりｌ１１１３を無電（ｆ＋：メッキする
。このｊ船台、対、弓に代えてニッケル等を用いても良
い。Next, as shown in Figure 2132, Netsuji! Ii Risexual What 11ii
Electroless (f+: plating) 1113 is applied to the surface of 10. Nickel or the like may be used in place of this j-spin, pair, and bow.
表面に名・ｊの膜が形成された熱可塑性樹脂１０の凹部
１２が形成されていない表面にレジスト膜１４を形成す
る。このレジストｒｔｔ＜は、後の？ざ解メッキのレジ
ストとなるもので、フォトエツチングまたは印刷によっ
て形成すると良い。これによって、第３図のように、凹
部１２の表面の飼：、ｊのみが露出し、その１１ハの銅
の表面はレジスト１漢１４によって争われた状態となる
。A resist film 14 is formed on the surface of the thermoplastic resin 10 on which the recess 12 is not formed. This register rtt< is the later? It serves as a resist for rough plating, and is preferably formed by photoetching or printing. As a result, as shown in FIG. 3, only the areas 1 and 1 of the surface of the recess 12 are exposed, and the copper surface of the 11 areas is contested by the resists 1 and 14.
この状態で１回の電解メッキを行うと、第４図のＩ
ように、露出した詳ｊの表面にのみ釘１１５が析出され
る。この７ａ解メツキのメッキ液としてはビロリン酸浴
または硫酸呵浴が好ましく、電流密度は工Ｏ〜２０ Ａ
Ａｌｎ？程鹿の条件で行うと良い。When electrolytic plating is performed once in this state, nails 115 are deposited only on the exposed surface of detail J, as shown in FIG. The plating solution for this 7a plating is preferably a birophosphoric acid bath or a sulfuric acid bath, and the current density is 0 to 20 A.
Aln? It is best to do it under fair conditions.
なお、銅に代えて銀を用いれば、よシ抵ノーＣ値を小さ
くすることができる。Note that if silver is used instead of copper, the resistance NOC value can be made much smaller.
続いて、第５図のようにＶジス） ｌｊ４．％を除去し
、°？Ｓ６図のように表面の鉤のｌｉ４．ｉを除去して
、ｈへ可塑性樹脂の中に埋め込まれた４’＋’ｉ造の厚
膜導体パターンが得られる。なお、表面のφ８の除去は
、様様的、化学的のいずれの方法でも良い。Then, as shown in Figure 5, Vjis) lj4. Remove % °? As shown in figure S6, the surface hook li4. By removing i, a 4'+'i thick film conductor pattern embedded in a plastic resin is obtained. Note that the φ8 on the surface may be removed by any method, either mechanical or chemical.
本発明により製放された厚膜ｉｊｊ、体パターンは、一
定の導体の断面積が確保できるので、抵抗を大幅に（λ
Ｉ１、少させることがでさる。１５０μＩｌ１間隔の導
体パターンで０，５〜２．０Ω／ｍと従来の１早眸バタ
ー／よシ大＋１’ｆ６に減少した抵抗が実現できた。The thick film ijj and body pattern produced by the present invention can ensure a constant cross-sectional area of the conductor, so the resistance can be significantly reduced (λ
I1, it is possible to reduce it. With conductor patterns spaced at intervals of 150μIl1, we were able to achieve a resistance of 0.5 to 2.0Ω/m, which was reduced to the conventional value of 1 short butter/width + 1'f6.
また、プレス成型によシ凹部を連続的に形成できるなど
、＋：１“産１生の面でも例れている。その上、鞘゛密
なエツチングのエイ鳥゛が不安になるなど、コストの面
でもイｊ利となる。In addition, press molding allows continuous formation of concave portions, making it an excellent example in terms of +:1 production.In addition, it is costly, such as the fact that the rays with densely etched scabbards become anxious. It is also advantageous in terms of
４．１ンｉ Ｉ＋ｌｌのｆｆｊ中、な、す、“明：”す
１１ネ１乃至”＋Ｓ ６１メ１は本・１１−明の実ｈ１
−・１−・りを示ず１１ミ曲ド１１曲図である。4.1 in I+ll's ffj, na, su, "light:" s11ne1 to"+S 61me1 is the book, 11-mei's actual h1
-・1-・ri are not shown, and it is a diagram of 11 songs.
１０・・・・・・熱可塑性樹脂、１２・・・・・・凹部
１３．１５・・・・・・金Ｎｉ）９勺（笛）’ｌ＆許出
ｔｙ１人
東光株氏会社10...Thermoplastic resin, 12...Concavity 13.15...Gold Ni) 9.
Claims (1)
し、核熱可塑性樹脂板の四部を含む表面に無電解メッキ
によシ金ｌ・１層を形成し、該表面の凹部のみを露出さ
せてレジスト１１弘を形成し、電解ガＴ メッキによって金属を祈出させて該凹部を充填する４７
体層を形成することを特徴とする厚ψ’Ｘ ｄ％導体パ
ターントす遣方法。[Claims] A concave portion is formed on the surface of a thermoplastic resin plate by press molding, and one layer of gold is formed by electroless plating on the surface including the four parts of the core thermoplastic resin plate. 47. A resist 11 is formed by exposing only the recesses, and metal is applied by electrolytic plating to fill the recesses.
A method for forming a conductor pattern with a thickness of ψ'X d%, characterized by forming a conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20662983A JPS6098696A (en) | 1983-11-02 | 1983-11-02 | Method of producing thick film conductor pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20662983A JPS6098696A (en) | 1983-11-02 | 1983-11-02 | Method of producing thick film conductor pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6098696A true JPS6098696A (en) | 1985-06-01 |
Family
ID=16526528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20662983A Pending JPS6098696A (en) | 1983-11-02 | 1983-11-02 | Method of producing thick film conductor pattern |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6098696A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191408A (en) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | Coil conductor, method for manufacturing the same, and electronic component using the same |
| JP2008166391A (en) * | 2006-12-27 | 2008-07-17 | Tdk Corp | Method of forming conductor pattern and electronic component |
| JP2014103419A (en) * | 2006-10-18 | 2014-06-05 | 3M Innovative Properties Co | Method for forming pattern of deposit metal on polymeric substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587898A (en) * | 1981-07-06 | 1983-01-17 | シャープ株式会社 | Method of producing dircuit wire |
-
1983
- 1983-11-02 JP JP20662983A patent/JPS6098696A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587898A (en) * | 1981-07-06 | 1983-01-17 | シャープ株式会社 | Method of producing dircuit wire |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005191408A (en) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | Coil conductor, method for manufacturing the same, and electronic component using the same |
| JP2014103419A (en) * | 2006-10-18 | 2014-06-05 | 3M Innovative Properties Co | Method for forming pattern of deposit metal on polymeric substrate |
| JP2008166391A (en) * | 2006-12-27 | 2008-07-17 | Tdk Corp | Method of forming conductor pattern and electronic component |
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