JPS6093756U - Sputtering equipment with a function to suppress the peeling of sputtering substances - Google Patents

Sputtering equipment with a function to suppress the peeling of sputtering substances

Info

Publication number
JPS6093756U
JPS6093756U JP18689283U JP18689283U JPS6093756U JP S6093756 U JPS6093756 U JP S6093756U JP 18689283 U JP18689283 U JP 18689283U JP 18689283 U JP18689283 U JP 18689283U JP S6093756 U JPS6093756 U JP S6093756U
Authority
JP
Japan
Prior art keywords
sputtering
peeling
function
suppress
substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18689283U
Other languages
Japanese (ja)
Other versions
JPH0126765Y2 (en
Inventor
小日向　久治
茂 高見
Original Assignee
日本真空技術株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本真空技術株式会社 filed Critical 日本真空技術株式会社
Priority to JP18689283U priority Critical patent/JPS6093756U/en
Publication of JPS6093756U publication Critical patent/JPS6093756U/en
Application granted granted Critical
Publication of JPH0126765Y2 publication Critical patent/JPH0126765Y2/ja
Granted legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例の截断平面図、第２図は第１図
の■−■線截線側断側面図る。 １・・・スパッタリング室、２−・・カソード、３・・
・ワークホルダ、４・・・ターゲット。FIG. 1 is a cross-sectional plan view of an embodiment of the present invention, and FIG. 2 is a cross-sectional side view taken along the line ■-■ in FIG. 1... Sputtering chamber, 2-... Cathode, 3...
- Work holder, 4...Target.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空のスパッタリング室１内に複数個のカソード２を設
けると共に各カソード２の前方を順次巡回するワークホ
ルダ３を設け、各カソード２の各前面に設けられるター
ゲット、４の少な（とも１個をＡＩ、Ａｕ等の柔らかい
金属材料で形成して成るスパッタ物質の剥離抑制機能を
備えたスパッタリング装置。A plurality of cathodes 2 are provided in a vacuum sputtering chamber 1, and a work holder 3 that sequentially circulates in front of each cathode 2 is provided. , a sputtering device that is made of a soft metal material such as Au and has a peeling suppressing function.
JP18689283U 1983-12-05 1983-12-05 Sputtering equipment with a function to suppress the peeling of sputtering substances Granted JPS6093756U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18689283U JPS6093756U (en) 1983-12-05 1983-12-05 Sputtering equipment with a function to suppress the peeling of sputtering substances

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18689283U JPS6093756U (en) 1983-12-05 1983-12-05 Sputtering equipment with a function to suppress the peeling of sputtering substances

Publications (2)

Publication Number Publication Date
JPS6093756U true JPS6093756U (en) 1985-06-26
JPH0126765Y2 JPH0126765Y2 (en) 1989-08-10

Family

ID=30403555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18689283U Granted JPS6093756U (en) 1983-12-05 1983-12-05 Sputtering equipment with a function to suppress the peeling of sputtering substances

Country Status (1)

Country Link
JP (1) JPS6093756U (en)

Also Published As

Publication number Publication date
JPH0126765Y2 (en) 1989-08-10

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