JPS6127333U - Wafer holder for sputter - Google Patents
Wafer holder for sputterInfo
- Publication number
- JPS6127333U JPS6127333U JP11295384U JP11295384U JPS6127333U JP S6127333 U JPS6127333 U JP S6127333U JP 11295384 U JP11295384 U JP 11295384U JP 11295384 U JP11295384 U JP 11295384U JP S6127333 U JPS6127333 U JP S6127333U
- Authority
- JP
- Japan
- Prior art keywords
- wafer holder
- sputter
- tray
- wafer
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Physical Vapour Deposition (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例でウエーハを保持ずる部分を
拡大した側断面図、第２図は従来のスパツタ装置の一例
を示す図、第２図ａは装置の側断−面図、第２図ｂはウ
エーハを保持する部分を拡大した側断面図、である。
図において１はウエーハ、２は受け皿、３はバネ、４は
トレイ、５，８は電極、６はターゲット、７はシャッタ
ー、９はスパッタ室、１０はチューブ、１１は断熱層、
をそれぞれ表す。Fig. 1 is an enlarged side cross-sectional view of a portion that holds a wafer in an embodiment of the present invention, Fig. 2 is a view showing an example of a conventional sputtering device, Fig. 2a is a side cross-sectional view of the device, FIG. 2b is an enlarged side sectional view of the portion that holds the wafer. In the figure, 1 is a wafer, 2 is a saucer, 3 is a spring, 4 is a tray, 5 and 8 are electrodes, 6 is a target, 7 is a shutter, 9 is a sputtering chamber, 10 is a tube, 11 is a heat insulating layer,
respectively.
Claims (1)
バネおよび受け皿よりなるスパツタ用ウエーハホルグに
おいて、 トレイのバネを受ける部分に熱を伝え難い断熱層を設け
たことを特徴とするスパツタ用ウエーハホルダ。[Claims for Utility Model Registration] A tray for fixing a wafer to a cooling electrode of a sputtering device;
A wafer holder for sputters consisting of a spring and a receiving tray, characterized in that a heat insulating layer that makes it difficult to transmit heat is provided in a portion of the tray that receives the spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11295384U JPS6127333U (en) | 1984-07-25 | 1984-07-25 | Wafer holder for sputter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11295384U JPS6127333U (en) | 1984-07-25 | 1984-07-25 | Wafer holder for sputter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6127333U true JPS6127333U (en) | 1986-02-18 |
Family
ID=30671988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11295384U Pending JPS6127333U (en) | 1984-07-25 | 1984-07-25 | Wafer holder for sputter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6127333U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62271481A (en) * | 1986-05-20 | 1987-11-25 | Mitsubishi Electric Corp | Controller for output from laser |
| JPH0487178A (en) * | 1990-07-27 | 1992-03-19 | Ngk Insulators Ltd | Heating device for semiconductor wafer |
-
1984
- 1984-07-25 JP JP11295384U patent/JPS6127333U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62271481A (en) * | 1986-05-20 | 1987-11-25 | Mitsubishi Electric Corp | Controller for output from laser |
| JPH0487178A (en) * | 1990-07-27 | 1992-03-19 | Ngk Insulators Ltd | Heating device for semiconductor wafer |
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