JPS58113767U - sputtering equipment - Google Patents

sputtering equipment

Info

Publication number
JPS58113767U
JPS58113767U JP18612782U JP18612782U JPS58113767U JP S58113767 U JPS58113767 U JP S58113767U JP 18612782 U JP18612782 U JP 18612782U JP 18612782 U JP18612782 U JP 18612782U JP S58113767 U JPS58113767 U JP S58113767U
Authority
JP
Japan
Prior art keywords
target
anode
sputtering equipment
shield plate
sputtering apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18612782U
Other languages
Japanese (ja)
Other versions
JPS6011093Y2 (en
Inventor
藤田　一朗
敏彦 小野
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP18612782U priority Critical patent/JPS6011093Y2/en
Publication of JPS58113767U publication Critical patent/JPS58113767U/en
Application granted granted Critical
Publication of JPS6011093Y2 publication Critical patent/JPS6011093Y2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案め実施例を示す要部正面断面図である。 １・・・・・・ターゲット、２・・・・・・陽極、４・
・・・・・シールド板、６・・・・・・保護カバー。FIG. 1 is a front sectional view of a main part showing an embodiment of the present invention. 1...Target, 2...Anode, 4...
... Shield plate, 6... Protective cover.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 真空処理内に陽極と負電位のターゲットを対設すると共
に、該ターゲットの該陽極に対向する面に近接しぞシー
ルド板が設けられてなるスパッタリング装置において、
前記シールド板の少なくとも前記ターゲットに対向する
面を被覆する帽子状ステンレス保護カバーを着脱可能に
取付けたことを特徴とするスパッタリング装置。In a sputtering apparatus, an anode and a target with a negative potential are disposed opposite to each other in a vacuum process, and a shield plate is disposed adjacent to the surface of the target facing the anode,
A sputtering apparatus characterized in that a cap-shaped stainless steel protective cover is removably attached to cover at least the surface of the shield plate facing the target.
JP18612782U 1982-12-09 1982-12-09 sputtering equipment Expired JPS6011093Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18612782U JPS6011093Y2 (en) 1982-12-09 1982-12-09 sputtering equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18612782U JPS6011093Y2 (en) 1982-12-09 1982-12-09 sputtering equipment

Publications (2)

Publication Number Publication Date
JPS58113767U true JPS58113767U (en) 1983-08-03
JPS6011093Y2 JPS6011093Y2 (en) 1985-04-13

Family

ID=30102650

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18612782U Expired JPS6011093Y2 (en) 1982-12-09 1982-12-09 sputtering equipment

Country Status (1)

Country Link
JP (1) JPS6011093Y2 (en)

Also Published As

Publication number Publication date
JPS6011093Y2 (en) 1985-04-13

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