JPS609241Y2 - Vacuum deposition equipment - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a wafer holding jig for a vacuum evaporation apparatus for forming a thin film on a semiconductor wafer.

Usually, on the back side of the wafer, a metal (for example, gold, gold alloy, etc.) with good thermocompression bondability is vapor-deposited for post-processing.

If this is an optical display element, the thin film must be deposited on the back surface of the wafer in spots rather than on the entire surface in order to increase the efficiency of the amount of light to the front surface of the wafer.

Conventional jigs use two rings, in which the wafer and metal mask are sandwiched and fixed with screws, etc., and placed side by side in a vacuum chamber to deposit a film to a predetermined thickness.

This method requires time and effort to attach and detach the wafer, is difficult to automate because it is a resistance heating method that vaporizes from top to bottom, and has the disadvantages that the film thickness distribution is poor and the number of wafers processed cannot be increased. The electron beam evaporation method, which is easy to automate, has come to be used, and as a wafer holding jig, a revolving jig that has a good film thickness distribution and can increase the number of wafers processed is being used.

However, when using this revolving jig, the side of the wafer is fixed with a spring or a holding plate.
When stacking masks, the side fixing method cannot be used, so there was no suitable fixing method.

The present invention has been made to eliminate the above-mentioned drawbacks in vacuum evaporation equipment.

Hereinafter, the present invention will be explained with reference to the drawings. FIG. 1 is a schematic diagram showing the internal structure of an electron beam evaporation apparatus equipped with a wafer holding jig according to the present invention, and includes an electron beam source 3, a shutter 4, A wafer rotating holder 2 with a wafer holding jig 1 attached thereto rotates and revolves, and deposited metal is deposited on the surface of the wafer housed in the wafer holding jig 1.

FIG. 2 is a sectional view showing the wafer holding jig of the present invention.

The jig of the present invention is made entirely of stainless steel, and first, a pedestal 5 having a recess shallower than the thickness of the wafer is welded to the wafer rotation holder 2, and a wafer 6 is placed in the recess.
Furthermore, mask 7 is put on.

Since the wafer rotating holder 2 rotates downward, a perforated cap 8 for preventing falling is fitted onto the pedestal 5, and the wafer 6 and mask 7 are fixed.

This perforated cap 8 is formed in a size that fits onto the base 5 at the top, and can be detachably fitted.

According to the present invention, wafers can be easily attached and detached, and the film thickness distribution and the number of wafers processed can also be improved.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing the internal structure of a vacuum evaporation apparatus equipped with a wafer holding jig of the present invention, and FIG. 2 is a sectional view of the wafer holding jig of the present invention. 1... Wafer holding jig, 2... Wafer rotating holder, 3... Electron beam source, 4...
...Shutter, 5...Pedestal, 6...
...Wafer 7...Mask, 8...
・Perforated cap.

Claims (1)

[Scope of utility model registration request] In a vacuum evaporation apparatus equipped with a rotating holder that holds a semiconductor wafer on its inner surface and rotates around its axis, a plurality of pedestals are provided on the inner surface of the rotating holder, and a perforated cap that is removably fitted onto the pedestals and the pedestals are provided. A vacuum evaporation apparatus characterized by holding a wafer and a mask.