JPS6091696A - Method of producing hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a method for manufacturing a hybrid integrated circuit device, and particularly relates to a method for manufacturing a hybrid integrated circuit device. This article relates to a method for manufacturing a hybrid integrated circuit device having the following.

[Prior art]

The structure and conventional manufacturing method of this type of hybrid integrated circuit device will be explained using a first perspective view and a side sectional view in FIG. First, a conductive paste such as silver palladium or gold, a resistive paste such as ruthenium oxide, or an insulating paste such as glass is printed in a predetermined shape using a screen printing method on both sides of an insulating substrate 1 made of ceramic or the like, and then fired. do. Next, chip capacitors 3, semiconductor elements 4, etc. are mounted on the printed conductor 2 formed by firing the conductive paste for half a day or using a conductive adhesive, and then the clip leads 5 are attached to the leads on the insulating substrate 1. Attach to the connection electrode 6. The electrical characteristics of the circuit are then inspected. At this time, depending on the product, the printed resistor 7 may be trimmed using a laser or other means to check the electrical characteristics. adjust. After that, cover the entire exterior resin 8 to cover any necessary leakage.

The clip lead 5 here not only has a role as an input/output terminal of the circuit, but also has a role as a through-hole wiring 9.
Similarly, it also has the role of electrically connecting the front wiring and the back wiring. This is intended to allow the clip lead 5 to play the same role as through-hole wiring, to minimize the number of through-hole wiring in the circuit, and to meet the needs of the market for all types of compact, high-density circuits.

However, since the role of through-hole wiring was added to the clip lead 5, a situation arose in which the electrical characteristics of the circuit could only be adjusted and inspected after the clip lead 5 was attached. Considering the yield of the manufacturing process, this situation is undesirable, and it is necessary to use clip leads of 5 tons.
- I would like to install clip leads only on products that have completed the adjustment and inspection of electrical characteristics before installation and have passed the inspection. Of course, it is not impossible to measure before attaching the clip lead 5 by applying the measurement probe needle to both sides of the fully insulated board 1 at the same time, but this type of inspection is not possible because it is easily necessary during the mass production process. is not appropriate.

[Summary of the invention]

The present invention has been made in view of the above-mentioned problems, and its object is to provide a hybrid integrated circuit having conductor distribution m on both sides of a substrate and electrically connecting the conductors on both sides with clip leads. During the device manufacturing process, electrical characteristics can be adjusted and adjusted very easily before clip leads are attached.
Is there a manufacturing method that allows full inspection? It depends on providing.

In order to achieve all of these objects, the present invention provides a first region for mounting semiconductor elements and the like and a second region for mounting through-hole wiring.
After completing the mounting and wiring, the board is divided into two regions, and the electrical characteristics are adjusted and inspected.The second region is then separated and removed, and a clip lead is attached to the first region.

[Embodiments of the invention]

The present invention will be described in detail below along with examples.

FIG. 3 is a plan view showing one process of the manufacturing method of the present invention, and FIG. 4 is a sectional view taken along the line AA'.

In addition, the same reference numerals are given to the same or similar elements as those in FIG. 1 or 2.

A cut groove 10 having a depth of about 1/2 to 1/3 of the substrate thickness is provided in an insulating substrate 1. After that, conductor paste 15. Resistance paste 16 or an insulating paste (not shown) is printed and fired. At this time, kerf 1
In one area 11 partitioned by 0, wiring is formed so that semiconductor elements etc. will be mounted in the future.
An electrode 6 for connecting a clip lead is formed near point 0. Further, in the other region 13, a wiring further extending from the electrode 6 is provided, and a through-hole wiring 17t is formed at the end portion 14 of the wiring.

Next, when a chip capacitor, a semiconductor element, etc. is mounted in the area 11 for half a day or with a conductive adhesive, the electrical connection between the conductor wiring formed on the drawing surface of the substrate 1 is already completed by the through-hole wiring 11. Therefore, the necessary circuit was finally completed. Therefore, at this stage, the electrical characteristics of the circuit can be measured simply by applying a measuring glove needle to one side.

After the measurement is completed, as shown in FIG. 5, the region 13 of the substrate 1 is mechanically separated from the region 11 using the cutting groove 10. At this time, the electrical connections between the conductors on the front and back sides of the substrate are temporarily cut off, but in the next step, the clip leads are attached in correspondence with all the electrodes 6, and conduction is established again. Thereafter, the hybrid integrated circuit device is completed by covering with an exterior resin as necessary.

In this embodiment, smooth cutting grooves are provided so that the through-hole wiring area can be easily removed, but it is of course possible to use other cutting means.

FIG. 6 is a plan view showing the second embodiment. Here, the insulating substrate 1 is partitioned into three areas 20 to 22 by grooves 23 and 24, and independent circuits are formed in each area, with the front and back sides integrated.

Each region 20 to 22 is divided into a mounting region A and a through-hole wiring region B by grooves 25 to 21, respectively, as in the first embodiment. area 20
The circuits formed in each of the circuits 22 to 22 may be of the same type or may be of different types.

After wiring such as conductors is provided on this substrate 1, work for mounting semiconductor elements and the like and work for measuring electrical characteristics are performed. After that, divide the cutting grooves 23 to 27 using all of them, and attach clip leads to each mounting area. Attach it to complete the hybrid integrated circuit device. In this way, handling time during work can be shortened and productivity can be improved.

In this embodiment, there are three circuits for simplicity, but it goes without saying that the number of circuits may be two or more as required.

FIG. 7 is a plan view showing the third embodiment. In this embodiment, the area 30 for mounting semiconductor elements and the like is the same as the first embodiment, or the wiring shape in the area 31 for forming the through-hole wiring 17 is different. That is, the through-hole wiring 1T is arranged in a staggered manner. A land 32 is provided around the through-hole wiring 17.
Therefore, it is necessary to take into consideration the minimum distance Si to guarantee the insulation between the conductors and provide a sufficient distance between the through-hole wiring. If the minimum distance between the through-hole wirings i at this time is t-L, the through-hole wiring 1 as shown in FIG.
When the T's are arranged in a straight line, the pitch P of the lead connection electrodes 6 will not be less than the minimum distance between the through-hole wirings. However, according to this embodiment, as shown in the partially enlarged view of FIG. 9, the center positions of the through-holes are alternately shifted by the dimension a, so that the minimum distance between the through-hole wirings can be ensured while still allowing for lead connection. The pitch of the electrodes 6 can be set to be equal to or less than the distance Pi. This allows the device to be made smaller and more dense.

〔Effect of the invention〕

As explained above, according to the present invention, in the process of manufacturing a hybrid integrated circuit device that has conductor wiring on both sides of a substrate and uses clip leads to electrically connect the conductors on both sides, To attach the clip lead to the location, wire the through-hole in front and connect the necessary element v.
After i-mounting, the electrical characteristics are adjusted and inspected, and then the through-hole wiring is removed and all the clip leads are attached, so the electrical characteristics can be adjusted and inspected very easily even before attaching the clip leads.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a hybrid integrated circuit device, FIG. 2 is a side sectional view of the device shown in FIG. 1, FIG. 3 is a plan view showing an embodiment of the present invention, and FIG. Fig. 6 is a plan view showing the second embodiment, and Fig. 7 is a plan view showing the third embodiment. FIG. 8 is a diagram for explaining the third embodiment,
Figure 9 is a partially enlarged view of Figure 7. 1.0. Fist insulation board, 5. ...Clip lead, 6.
...Lead connection electrode, 10,23°24.25.2
6.27.0...cut 9 grooves, 17...e'' through hole wiring agent Masuo Oiwa Figure 4 Figure 7 Figure 8 Figure 9 Procedure amendment (voluntary) ↑, 1-5' [Agency Commissioner 1. Display of =lG ↑1-Application No. 5B-201752 2. Title of invention Method for manufacturing a hybrid integrated circuit device: 3. Relationship with the case of the person making the amendment Patent applicant address Higashij; [Tokyo 2-2-3 Marunouchi, Chiyo IJJ-ku Name (601) Mitsubishi Electric Corporation Representative Katayuni Part 8 Section 4 Detailed description of the invention in the agent's specification Column 6 Contents of the amendment

Claims (1)

[Claims] (i) An insulating substrate is divided into a first region and a second region, conductive wiring is provided on the patterned surface of the insulating substrate, and an active element or a passive element is provided in the first region. The first step of mounting and forming a circuit by providing through-hole wiring in the second region, and the electrical characteristics of the circuit formed by this first step? a second step of adjusting or inspecting; a third step of separating and removing the second region from the first region after the second step;
and a fourth step of attaching a clip lead to the first region from which the second region has been removed. (2) The method for manufacturing a hybrid integrated circuit device according to claim 1, wherein the first region and the second region in the insulating substrate are separated by a cut groove. (3) The method for manufacturing a hybrid integrated circuit device according to claim 1, characterized in that the through-hole wiring provided in the second region of the insulating substrate is arranged in a staggered manner.