JPS6086854A - 突起電極形成用基板及びその製造方法 - Google Patents

突起電極形成用基板及びその製造方法

Info

Publication number
JPS6086854A
JPS6086854A JP58195643A JP19564383A JPS6086854A JP S6086854 A JPS6086854 A JP S6086854A JP 58195643 A JP58195643 A JP 58195643A JP 19564383 A JP19564383 A JP 19564383A JP S6086854 A JPS6086854 A JP S6086854A
Authority
JP
Japan
Prior art keywords
substrate
forming
insulating layer
electrode
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58195643A
Other languages
English (en)
Japanese (ja)
Other versions
JPH031834B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Takahashi
弘 高橋
Isamu Kitahiro
北広　勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58195643A priority Critical patent/JPS6086854A/ja
Publication of JPS6086854A publication Critical patent/JPS6086854A/ja
Publication of JPH031834B2 publication Critical patent/JPH031834B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58195643A 1983-10-19 1983-10-19 突起電極形成用基板及びその製造方法 Granted JPS6086854A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58195643A JPS6086854A (ja) 1983-10-19 1983-10-19 突起電極形成用基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58195643A JPS6086854A (ja) 1983-10-19 1983-10-19 突起電極形成用基板及びその製造方法

Publications (2)

Publication Number Publication Date
JPS6086854A true JPS6086854A (ja) 1985-05-16
JPH031834B2 JPH031834B2 (enrdf_load_stackoverflow) 1991-01-11

Family

ID=16344579

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58195643A Granted JPS6086854A (ja) 1983-10-19 1983-10-19 突起電極形成用基板及びその製造方法

Country Status (1)

Country Link
JP (1) JPS6086854A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201916A3 (en) * 1985-05-15 1988-08-24 Matsushita Electric Industrial Co., Ltd. Bonding method of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0201916A3 (en) * 1985-05-15 1988-08-24 Matsushita Electric Industrial Co., Ltd. Bonding method of semiconductor device

Also Published As

Publication number Publication date
JPH031834B2 (enrdf_load_stackoverflow) 1991-01-11

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