JPS6086803A - Trimming device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an apparatus for trimming fine elements such as thick film and thin film resistors, and in particular, to inspecting the pattern of the object to be trimmed to determine whether it is good or bad. The present invention also relates to a trimming device suitable for visually recognizing the state during trimming to improve yield.

[Background of the invention]

Currently, for example, laser trimming equipment requires positioning during trimming and trimming operation.

Much of the co-supply and delivery of parts is automated.

However, the objects to be supplied to the trimming device are judged in advance by visual inspection by the operator.
The selected materials were supplied. In addition, the condition during trimming and the inspection after trimming were also sorted by visually inspecting the appearance of the trimming to determine whether it was good or bad.

Therefore, in order to increase the throughput in the inspection process, it is necessary to secure a large number of workers.And, as a result, there are disadvantages such as variations in inspection standards due to individual differences among workers, and abnormalities in the laser trimming equipment. ,
Even if trimming defects occur frequently, the trimming operation continues until inspection is performed, which has the disadvantage of lowering yield.

[Purpose of the invention]

The purpose of the present invention is to eliminate the drawbacks of the conventional method, to check the external appearance of the pattern of supplied parts using a sensor and image processing to determine whether they are good or bad, and to automatically inspect the selected parts using a laser (IJ). It is an object of the present invention to provide a trimming device having a function of automatically inspecting the trimming state after laser trimming using a sensor and image processing to determine the quality of parts.

[Summary of the invention]

In order to achieve the above-mentioned object, the present invention installs a sensor (such as a TV camera) in a part of a loader that supplies circuit components, converts the electric signal from the sensor into digital, and sends it to a digital image processing device. By comparing the captured image pattern with a normal pattern that has been input into the image processing device in advance, defects or abnormalities in the wiring pattern are detected and a quality judgment is made.
Based on this quality determination signal, only non-defective products are sent to the trimming station and trimming operation is performed. During this trimming operation, the trimming position is detected by a TV camera and an image processing device to determine whether the trimming position of the resistor is correct and trimming the b position.

Control the optimal position for trimming. The trimming position at this time is detected by utilizing the fact that when the resistor is being trimmed with a laser, that part emits bright light, which is extremely bright compared to the surrounding area. Then, the circuit components for which the trimming process has been completed are returned to the results of determining whether the trimming position is good or bad based on electrical measurements and image processing during the trimming operation, and are unloaded after selecting good products and defective products.

In this way, the present invention is characterized in that defect inspection of the circuit pattern of the component before trimming, control of the optimum trimming position during trimming, and defect inspection after trimming are automatically performed.

[Embodiments of the invention]

An embodiment of the present invention is shown in FIGS. 1 and 2 below.

This will be explained using Figure 3. As shown in FIG. 1, for example, a thick film circuit component 1a loaded onto a loader 2 is moved by a mechanical positioning mechanism (not shown) to a TV camera 4.
It is positioned so that it has a predetermined positional relationship with respect to.

Then, the circuit pattern of the positioned circuit component 1α is captured by the TV camera 4 into the image processing device 12 as an image 17 as shown in FIG. 2(A).

The captured video 17#l;t, ψ)K in FIG. Valued and binarized video signal 18 (see Fig. 2 (a))
get. This binary video signal 18 is then sent to a comparison circuit 21 for detecting pattern defects 3o. This defect detection is carried out by inputting a standard pattern (defective standard pattern) 31 shown in FIG. The contents of the standard pattern are read out using a memory read signal 23 synchronized with the synchronization signal of the TV camera 4 so that the memory 2o can be accessed in synchronization with the signal of the TV camera 4.
A standard pattern digital video signal 33 is output to the comparison circuit 21.

In the comparison circuit 21, the binarized video signal 1B from the TV camera 4 and the standard digital video signal 33 from the memo IJ 20 are input.
Compare and hate. Then, the portion that does not match as a result of the comparison is outputted as a defect detection signal 22.

By doing this, the input image 17 with the standard pattern 31 in FIG. 2(c) and the defect 30 in
The same result can be obtained by superimposing and detecting the above, and a defect detection pattern 32 shown in FIG. 2) is obtained, and defects in circuit patterns can be detected.

The above explanation is about a part of the pattern of the thick film circuit component, but all patterns of the thick film circuit component are stored in the memory 2.
By inputting 0 and controlling the timing of the input image and memory image, automatic inspection of all patterns is possible.

After pattern inspection, if the thick film circuit component 1a has a defect, the positioning mechanism (not shown) for positioning the thick film circuit component is released and the pusher 3 moves it to a defective product stocker (not shown). transported to. Furthermore, the thick film circuit components 1α having fx defects are set by the chucking arm 5 on a transport table 6 equipped with a positioning mechanism for transporting them to a laser trimming station.

At this time, the chucking arm 5 simultaneously takes out the thick film circuit component 1d, which has been trimmed and inspected after trimming at the trimming stage 1, from the transport table 6 with a positioning mechanism, and moves it to the next stage. It is supplied to a delivery mechanism 16 for delivery to a container. This sending mechanism 16
Of course, it is possible to automatically select a good product from a defective product by adding a mechanism to separate the good products from the defective products based on the pass/fail judgment test signal after trimming.

The thick film circuit component 1C supplied to the trimming stage in the above manner controls the XY table 8 by starting the XY table control device 7 with a command from the computer 15 based on predetermined design data. Figure 3 (4
The pattern image 24 shown in FIG.

Here, the input image 24 in FIG. 3(a) is a circuit pattern that is input to the TV camera 9 in order to inspect the position of the resistor pattern to be trimmed, the remaining trimming width after trimming, and the trimming position. It is a statue. First, before trimming, the resistor 26 to be trimmed
Recognize the position and area of a.

This resistor position recognition method involves inputting a predetermined image of the thick film circuit component 1c to the image input circuit 34 of the image processing device 12 using the TV camera 9, as shown in FIGS. 1 and 3 (c). , the digital image binarized at an appropriate binarization threshold level is stored in the memory of the image input circuit 34. Then, as shown in FIG. 3), the diagonal corner position Z* (x
l + Yt ) and z, (x, , y, ) from the input screen, calculate the matching pattern 28.2 with the calculator 15.
9 (see Figure 93 (b) and (0)) to detect the position.

These two points Z1 # Z! The area can be calculated from , and the center position and contour coordinates of the resistor can also be calculated.

This position detection method b is not limited to the method described above, and other methods may be used.

In this way, the position of the resistor is first detected, and then the trimming operation of the resistor 26a is performed. The trimming method shown in FIG. 1 is performed using a laser oscillator 10, but the trimming position at this time is determined by positioning based on position detected data. Either method of positioning based on this method may be used.

Then, the video being trimmed is input, the point A to be trimmed is detected from this video, and the locus of point A is recognized to see if the trimming is done correctly. From this recognized trajectory and the position information recognized before trimming, the calculator 15 is used to detect whether the trimming position is a normal position and whether the remaining width after trimming is as specified. Later good.

Determine defectiveness.

The method for detecting the trimming trajectory A at this time is that when the laser irradiates the resistor during trimming, that part burns and emits strong light, so the image of the trimmed part of the input image is ), the image at the trimming point Z0 becomes higher. Focusing on this, we can use a simple method to detect the position of the brightest point with the highest video level in the image.
Recognize the position of (Xo, Yo). And this Z
. Locus A can be found from the coordinate position of .

In this way, all the resistors of the thick film/circuit/circuit parts 1C have been trimmed and the trimming inspection has been completed.
As shown in FIG. 1, the transport table 6 is moved to a position where it can be taken out by the chucking arm 5, and the chucking arm 5 supplies the material to the delivery mechanism 16.

According to the implementation of the present invention, it is possible to simultaneously carry out the cross-turn inspection of thick film circuit components, trimming, and inspection during trimming, and there are advantages such as being able to eliminate the work of visual inspection.

Furthermore, since the condition inspection during laser trimming can be determined in real time, the yield of the product can be measured as well.

In FIG. 1, 15 is a laser control device, 11α.

11b is a wiring board connected to the thick film circuit component, and 14 is a resistance measuring circuit.

〔Effect of the invention〕

According to the present invention, pattern inspection of thick film circuit components, trimming point position control for resistor trimming, and quality determination of resistors after trimming can be performed automatically and non-contact. There is a similar effect.

1. Labor can be saved by automatically inspecting circuit patterns for defects.

2. By performing pattern inspection, it is possible to eliminate abnormal patterns and patterns of different types, thereby improving yield.

3. By reading the TV left camera model for pattern inspection, it becomes possible to produce a wide variety of products.

4 By automatically inspecting the laser trimming status in real time, it is possible to improve yield and save labor for inspection.

5. It is possible to improve product reliability and improve throughput.

[Brief explanation of drawings]

The drawings are all related to the present invention; FIG. 1 is an external perspective view of a trimming device that performs automatic pattern inspection and trimming inspection, and FIG. An example of the state, Fig. 2 @) is a block diagram of an example of the TV left camera image processing device used in Fig. 1, Fig. 2 0 is an example of a defect pattern, Fig. 2 ψ
) is an example of the 4 standard patterns, Figure 2 (A) is an example of defect detection (one example of a turn, Figure 3 0), ψ), (C) is an example of an input image for laser trimming inspection, FIG. 6 (to) is a block diagram of the trimming system used in FIG. 1. 1...Thick film circuit component 2...Loader 3...Button 49...TV camera 5...Chucking arm 6...Transport table 7...XY table control device 8...XYZ Table 10...Laser oscillator 12
...Image processing device 13...Laser control device 15.
...Computer 16...Sending mechanism 19...Binarization circuit 2o...Memory 21...Comparison circuit 3A...
・Image input circuit Waka 1 Zucha 2 times

Claims (1)

[Scope of Claims] 1. An imaging system for capturing an image of a circuit pattern of a component to be trimmed, and means for automatically inspecting the circuit pattern for defects by binarizing and image processing the image captured by the imaging system. , means for separating the parts to be trimmed into good and defective parts based on the results of automatic inspection, a trimming means for trimming only the non-defective parts to be trimmed, and a mechanism for positioning and moving the parts to be trimmed. Trimming equipment included. 2. The trimming means includes a laser oscillator for trimming, an imaging system that captures an image of the element to be trimmed, and an image processing system that automatically determines the position and shape of the element to be trimmed from the image captured by the imaging system. means for automatically detecting the trimming locus of the trimming element by the imaging system and the image processing during or after trimming the trimming element; the position and shape of the trimming element; 2. The trimming device according to claim 1, further comprising means for automatically determining whether the trimmed element has been properly trimmed or not, based on the trimming locus information.