JPS6085363A - 接合状態検出方法及びその装置 - Google Patents

接合状態検出方法及びその装置

Info

Publication number
JPS6085363A
JPS6085363A JP58192409A JP19240983A JPS6085363A JP S6085363 A JPS6085363 A JP S6085363A JP 58192409 A JP58192409 A JP 58192409A JP 19240983 A JP19240983 A JP 19240983A JP S6085363 A JPS6085363 A JP S6085363A
Authority
JP
Japan
Prior art keywords
vibration
laser
inspection
detecting
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58192409A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0252981B2 (https=
Inventor
Takashi Hiroi
高志 広井
Takanori Ninomiya
隆典 二宮
Yasuo Nakagawa
中川 泰夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58192409A priority Critical patent/JPS6085363A/ja
Publication of JPS6085363A publication Critical patent/JPS6085363A/ja
Publication of JPH0252981B2 publication Critical patent/JPH0252981B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2418Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/26Scanned objects
    • G01N2291/269Various geometry objects
    • G01N2291/2697Wafer or (micro)electronic parts

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP58192409A 1983-10-17 1983-10-17 接合状態検出方法及びその装置 Granted JPS6085363A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58192409A JPS6085363A (ja) 1983-10-17 1983-10-17 接合状態検出方法及びその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58192409A JPS6085363A (ja) 1983-10-17 1983-10-17 接合状態検出方法及びその装置

Publications (2)

Publication Number Publication Date
JPS6085363A true JPS6085363A (ja) 1985-05-14
JPH0252981B2 JPH0252981B2 (https=) 1990-11-15

Family

ID=16290833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58192409A Granted JPS6085363A (ja) 1983-10-17 1983-10-17 接合状態検出方法及びその装置

Country Status (1)

Country Link
JP (1) JPS6085363A (https=)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627200A (ja) * 1985-07-03 1987-01-14 株式会社日立製作所 接合状態検出装置
JPS62126346A (ja) * 1985-11-28 1987-06-08 Nippon Kokan Kk <Nkk> 非接触超音波探傷方法
JPS62133341A (ja) * 1985-12-06 1987-06-16 Hitachi Ltd はんだ付部検査装置
JPH01203966A (ja) * 1988-02-10 1989-08-16 Hitachi Constr Mach Co Ltd 微小部材接合部の接合状態検査方法およびその装置
JPH06242079A (ja) * 1993-02-19 1994-09-02 Hitachi Ltd 光音響信号検出方法及び装置
JPH06308095A (ja) * 1993-04-21 1994-11-04 Hitachi Ltd 光熱変位信号検出方法とその装置
WO2022157870A1 (ja) * 2021-01-21 2022-07-28 ヤマハロボティクスホールディングス株式会社 不良検出装置及び不良検出方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627200A (ja) * 1985-07-03 1987-01-14 株式会社日立製作所 接合状態検出装置
JPS62126346A (ja) * 1985-11-28 1987-06-08 Nippon Kokan Kk <Nkk> 非接触超音波探傷方法
JPS62133341A (ja) * 1985-12-06 1987-06-16 Hitachi Ltd はんだ付部検査装置
JPH01203966A (ja) * 1988-02-10 1989-08-16 Hitachi Constr Mach Co Ltd 微小部材接合部の接合状態検査方法およびその装置
JPH06242079A (ja) * 1993-02-19 1994-09-02 Hitachi Ltd 光音響信号検出方法及び装置
JPH06308095A (ja) * 1993-04-21 1994-11-04 Hitachi Ltd 光熱変位信号検出方法とその装置
WO2022157870A1 (ja) * 2021-01-21 2022-07-28 ヤマハロボティクスホールディングス株式会社 不良検出装置及び不良検出方法
JPWO2022157870A1 (https=) * 2021-01-21 2022-07-28
CN115769071A (zh) * 2021-01-21 2023-03-07 雅马哈智能机器控股株式会社 不良检测装置以及不良检测方法
TWI820581B (zh) * 2021-01-21 2023-11-01 日商雅馬哈智能機器控股股份有限公司 不良檢測裝置、不良檢測方法以及振動檢測裝置
US12487206B2 (en) 2021-01-21 2025-12-02 Yamaha Robotics Co., Ltd. Defect detection device and defect detection method

Also Published As

Publication number Publication date
JPH0252981B2 (https=) 1990-11-15

Similar Documents

Publication Publication Date Title
US4641527A (en) Inspection method and apparatus for joint junction states
JP2751435B2 (ja) 電子部品の半田付状態の検査方法
US7492449B2 (en) Inspection systems and methods
Liu et al. A novel approach for flip chip solder joint quality inspection: Laser ultrasound and interferometric system
US8860456B2 (en) Non-destructive tilt data measurement to detect defective bumps
JPS6085363A (ja) 接合状態検出方法及びその装置
Zhang et al. Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals
Liu et al. A novel method and device for solder joint quality inspection by using laser ultrasound
JPS6165175A (ja) 回路部品端子の接合状態検査方法とその装置
JPH01113638A (ja) 認識装置
JPH07117388B2 (ja) 外観検査方法
JPH09196625A (ja) コプラナリティ検査装置
JPS62133341A (ja) はんだ付部検査装置
Erdahl et al. Determination of measurement limit for open solder bumps on a flip-chip package using a laser ultrasonic inspection system
Ume et al. Laser ultrasonic inspection of solder bumps in flip-chip packages using virtual chip package as reference
JP4040777B2 (ja) 異物検査装置
JPH1194782A (ja) 非接触半田付け検査方法及びその装置
JPS627200A (ja) 接合状態検出装置
JPS60257227A (ja) 接合状態検出方法及び装置
JPS61240105A (ja) 接合状態検出方法
Schick et al. Inspection and process evaluation for flip chip bumping and CSP by scanning 3D confocal microscopy
JPS6336543A (ja) 半導体装置の自動検査方法及び検査装置
JPH03215704A (ja) バンプ検査装置
JPS59147206A (ja) 物体形状検査装置
JPS63177045A (ja) 実装済プリント基板自動検査装置における半田フヌレ検出方式