JPS6083339A - Breaking device for resin sealed semiconductor element - Google Patents

Abstract

PURPOSE:To prevent air pollution and water pollution by mounting an air current pump, a storage tank for a liquid, into which a resin is dissolved previously, and a vapor trap for the dissolving agent, changing a sucking section into an air current pump and considering a counterplan for environmental pollution. CONSTITUTION:When a semiconductor device 14 is placed on a sample base 13 and an air current pump 22 is operated, a dissolving agent 11 is sucked out in a path of a bottle 12 the sample base 13 a used liquid storage tank 17. A used liquid is stored in the storage tank 17, a dissolving liquid is not discharged to the outside of the device, and water is not polluted. The storage tank may be small because it stores only the dissolving liquid. Vapor or a cracked gas generated from the bottle 12 and the tank 17 is removed by the vapor mist-traps of a vapor trap 20, an exhaust gas trap 23 and a dissolved vapor trap 25, and air pollution is prevented. Glass beads or glass wool or the like is inserted into the traps as trapping materials 21, 24, and the efficiency of trapping is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a conventional resin-sealed semiconductor device unsealing device in which the suction section is replaced with an airflow pump to take measures against pollution.

<Prior Art> FIG. 1 shows a configuration diagram of a conventional resin-sealed semiconductor device unsealing device using a water pump.

In the figure, 1 is a 4&I fat-dissolving agent (for example, H2SO4°HNO3), is a bottle, 3 is a sample stage, 4 is a sample, 5 is a water pump (aspirator), 6H is a connecting pipe, 7 is a dissolving agent heater, 8 is water (city water, etc.) The principle of operation of this unsealing device is that when the resin-sealed semiconductor device 4fI, which is a sample, is placed on the sample stage in 3, water is run, and the water flow pump in 5 is activated, ■ The resin dissolving agent (liquid) (heating the liquid increases the reaction rate and shortens the dissolution time) is 1→3
It is sucked out via route -→5. At this time, the resin surface of the semiconductor device comes into contact with the solution at the sample stage 3, and as a result, the resin of the device is unsealed to the size of the hole in the sample stage.

However, this device has the following drawbacks.

(a) Since a water pump is used, a large amount of water is required to dissolve the resin.

(b) At point 5, the dissolved used liquid and pump water mix. This solution usually uses strong acids such as H2SO4 and HNO3, so the mixed solution becomes an acidic liquid, and in this state it cannot be easily discharged into the sewer, and a very large storage tank is required to store this mixed solution. Required 0 <Object of the Invention> An object of the present invention is to provide an opening device that eliminates the drawbacks of the conventional devices described above.

<Example> FIG. 2 shows a configuration diagram of an unsealing device for a resin-sealed semiconductor element according to the present invention.

In the figure, 11 is a resin dissolving agent, 12 is a bottle, 13 sample stands, 14 samples, 15 is a dissolving agent heater, 16 is a dissolving agent inlet, 17 is a used liquid storage tank, and 18 is a connecting pipe. , 19 is a used liquid outlet, 20 is a steam trap, 21 is a trap material (glass wool, glass beads), 2
2 is airflow pump, 23 is exhaust gas drag, '24I
i-trap material, 25 is a dissolving agent vapor trap, and 26 is a high-pressure gas (air, N2) cylinder.

The features of this device are: (a) The water pump has been replaced with an air pump (also called an air ejector or combum).

(b) Addition of a used liquid storage tank.

(c) Trap of vapor mist of dissolved liquid 10, 13° 15
The point added.

This is a resin melting device in which pollution is prevented by the above (a), (b), and (C).

The operating principle of this device is that when a semiconductor device is placed on a 13 sample stage and 22 airflow pumps are operated, the dissolving agent is
It is sucked out along the route 11 → 13 → 17. The used liquid is stored in 7 storage tanks. As a result, the dissolved solution does not leak out of the device and does not cause water pollution. Furthermore, since this storage tank stores only the solution, it can be a small tank.

In order to shorten the dissolution time, a method of heating the dissolution solution to a high temperature is generally used. When the solution is heated to a high temperature, the solution evaporates or decomposes and scatters into the atmosphere, causing air pollution. The location of the occurrence is
There are two locations: 17 dissolving liquid bottles and 17 used dissolving liquid storage tanks.

Therefore, the steam or decomposition gas generated in 12.17 above is removed by the steam mist trap 25 and 20.23 to prevent air pollution. In addition, in 21.24, insert a glass ball or glass wool cloth into the 3 trap,
Increases trap efficiency.

<Effects> As described in detail above, according to the present invention, it is possible to obtain an extremely useful resin-sealed semiconductor device puncture R that can eliminate all the drawbacks of conventional devices.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a conventional resin-sealed semiconductor element unsealing apparatus, and FIG. 2 is a block diagram of a resin-sealed semiconductor element unsealer according to the present invention. Explanation of symbols 11: Resin dissolving agent, 12: Bottle, 13: Sample stand, 14
: Sample, 15: Solving agent heater, 16: Solving agent inlet, 17
: Used liquid storage tank, 18 two-piece pipe, 19
: Used liquid outlet, 20': Steam drag, 21
: Trap material, 22: Air flow pump, 23: Exhaust/gas/
Trap, 24 Nidrap material, 25: Solvent vapor trap, 26: High pressure gas cylinder1. .

Claims (1)

[Claims] 1. An unsealing device for resin-sealed semiconductor devices, which is characterized by having an air flow pump, a storage tank for the resin-dissolved liquid, and a vapor trap for the dissolving agent, thereby preventing air pollution and water pollution.