JPS6082365A - Thermal print head - Google Patents
Thermal print headInfo
- Publication number
- JPS6082365A JPS6082365A JP58190136A JP19013683A JPS6082365A JP S6082365 A JPS6082365 A JP S6082365A JP 58190136 A JP58190136 A JP 58190136A JP 19013683 A JP19013683 A JP 19013683A JP S6082365 A JPS6082365 A JP S6082365A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- layer
- paste
- metal powder
- organic vehicle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】 この発明はサーマルプリントヘッドに関する。[Detailed description of the invention] The present invention relates to a thermal print head.
周知のようにサーマルプリントヘッドは、第１ｍのよう
にアルミナのよう方セラミック製の基板ｌの表面に突条
状のグレーズ層２を形成し一基板１からグレーズ層２Ｋ
またがって一対の導電層３を股行−グレーズ層２の頂面
Ｋか込で両溝電層８にまたがって発熱用の抵抗層４を設
けて構成され。As is well known, in a thermal print head, a protruding glaze layer 2 is formed on the surface of a ceramic substrate l made of alumina as shown in the first m, and a glaze layer 2K is formed from one substrate 1.
A pair of conductive layers 3 are straddled, and a heat generating resistance layer 4 is provided across both groove conductive layers 8 with the top surface K of the glaze layer 2 interposed therebetween.
る。抵抗層４をさ会に形成してかいてカニちその表面Ｖ
Ｃ導電層８を形成する場合もある。図では表面に設ける
保護層は省略１−である。Ru. The resistive layer 4 is formed on the surface V of the crab chisel.
A C conductive layer 8 may also be formed. In the figure, the protective layer provided on the surface is omitted by 1-.
ところでこのような構成のサーマルプリントヘッドでは
、導電層８と【−で可及的に薄−こと７５に望まれる。Incidentally, in a thermal print head having such a configuration, it is desired that the conductive layer 8 and the conductive layer 75 be as thin as possible.
導電層８け貴金属粉末を含む厚膜ペーストラスクリーン
印刷Ｌ−エツチングによって所要のパターンに形成中る
のが普通である。そのため導電層８が厚−ときは、使用
する厚膜ペーストの量本多く、１−たがって貴金属本多
量にいるととにカリ、製造価格が上がるようになる。又
厚いと六はエツチングに長時１ａＪを要し、かつｉ％
精１Ｍ（７） ｘ ツチングが期待で六たくなるし、導
電層の表面に他の層を印刷成形するとき一凹凸による大
女な段差が存在するととに１って印刷精度を損なうこと
もある。The conductive layer is typically formed into the desired pattern by screen printing and L-etching of a thick film paste containing noble metal powder. Therefore, when the conductive layer 8 is thick, a large amount of thick film paste is used, and therefore, if there is a large amount of noble metal paste, the production cost increases. Also, if it is thick, etching takes a long time of 1aJ, and i%
Precision 1M (7) .
これらにも増して致命的り欠陥＃−１ニー導電層３が厚
膜れは厚い程熱伝導廖が太き（なるので、抵抗層４に発
生した熱雀導電層８を経由ｌ−て放＃！ｉ、Ｌやすくな
ってＬｔうことである。抵抗層４の熱カ！感熱紙に伝導
されてプリントするのであるが、上記のように熱が他の
部分に逃げてしまうと温廣が低下してしまうので、鮮明
にプリントしようとするＫＦｉ、発熱量を高めるべ（印
加電圧を上げな叶ればならないようになる。 ′
このように導電層８としては薄すことが望ましｂのであ
るが、これが薄すぎると次のよう々問題が生じる。すな
わち第２図の拡大図にも示すようにグレーズ層２の段差
部に導電層８のための導電ペースト５を印刷したときそ
のペーストが流れてパターンの形７５！点線で示すよう
にくずれるようなことがある。もｊ〜ペーストが薄込七
きは、この形（ずれのためにペースト膜が途切れてしま
うことがある。途切れたまま焼結【−で導電層を形成す
れば、導電層と【−で使用に供１−得々ｂことけ明らか
である。Even more fatal than these is the defect #-1: The thicker the knee conductive layer 3 is, the thicker the heat conduction gap. #!i, L becomes easier and Lt.Thermal power of the resistor layer 4 is conducted to the thermal paper and prints, but if the heat escapes to other parts as mentioned above, the temperature will increase. Therefore, if you want to print clearly, you will have to increase the amount of heat generated (you will have to increase the applied voltage.' In this way, it is desirable for the conductive layer 8 to be thin. However, if this is too thin, the following problem will occur. Namely, when the conductive paste 5 for the conductive layer 8 is printed on the step part of the glaze layer 2, the paste will It may flow and the pattern shape 75! It may collapse as shown by the dotted line. If the paste is thinned, the pattern may be shaped like this (the paste film may break off due to misalignment. It is clear that if the conductive layer is formed by sintering, it can be used with the conductive layer.
この発明は形くずれの少な−厚膜ペーストによる薄い導
電層を備えたサーマＶプリントヘッドを提供するこ失を
目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a Therma-V printhead with a thin conductive layer made of thick film paste with less deformation.
この発明は貴金属粉末８７〜５９重量％、ガラスフリッ
ト１〜８重量％及び有機ビークル４０〜６０重量％から
なる厚膜ペーストにフィラーヲ８００〜ｓｏｏｐｐｍｆ
ｆｉ加１−た本のを印刷焼結して、抵抗層通電用の導電
層と１−たと唱を特徴）ニー＋る。In this invention, a thick film paste consisting of 87 to 59% by weight of noble metal powder, 1 to 8% by weight of glass frit, and 40 to 60% by weight of organic vehicle is coated with 800 to soop pm of filler.
By printing and sintering the fi-added book, the resistive layer is characterized by a conductive layer for energizing and a conductive layer for energizing (knee +).
貴金属粉末々１−では、金、銀、白金、バナジウム等が
蛍独又は混合して使用される。ガラスフリットとしてけ
た七えはホウケイ酸鉛ガラス粉末値（使用できる。有機
ビークＶけレジン及び溶剤−Ａ、Ｌナル。レジンとして
はた七えはエチルセルローズ−溶剤としてはターピネオ
ール、ブチルカＶビトールアセテート等が使用で＾る。In the noble metal powder 1-, gold, silver, platinum, vanadium, etc. are used alone or in combination. As a glass frit, Nanae is a lead borosilicate glass powder value (can be used.Organic beak V-ke resin and solvent - A, L Naru.As a resin, Nanae is ethyl cellulose -Solvents include terpineol, butylka V-bitol acetate, etc. is in use.
との厚膜ペーストでは有機ビークルを従来のものと比較
１−で数倍に増した点が顕著に相違する。The difference between the thick film paste and the conventional one is that the number of organic vehicles is increased by several times compared to the conventional one.
有機ビークルはペーストとしてのチクソトロピック性の
改善に有効であり−この改善によって印刷塗布時の形（
ずれを防止することができる。１−た≠；つて薄ｔｎ膜
にＬ−でも問題は生じな−ようになる。Organic vehicles are effective in improving the thixotropic properties of pastes - this improvement improves the shape during print application (
Misalignment can be prevented. If 1-ta≠; no problem will occur even if L- is applied to a thin tn film.
又焼結時有機ビークルは飛散して１．まり本のであるか
ち、これが多量に含まれてｂる程、焼結後に卦すて薄−
導電膜づＩ形成されるよりに々る。有機ビークルの添加
量が４０重量％未満ではチクソトロビツク性の改善には
不十分であるし、６０重量％をこえると、貴金属の添加
量が少な（なりすぎて導電性が損なわれるようになって
都合が悪ｂ０フィラーとしてはアルミナ（Ａ／？ｓ＋Ｏ
ａ ）セラミック、酸化チタン（Ｔ１．０＋ ）等ガ使
用できる。このようなフィラーを添加しておくと一焼結
時基板の表面或すはペースト内のガスがフィラーとペー
ストの境面を通って外部に放散しやすぐなる。本しガス
が放散せずに内部にとぢこめちれたとすると慨泡が発生
１〜、そのため膜にフクレや亀裂を生ずるととガある。Also, during sintering, the organic vehicle is scattered and causes 1. The more this is contained in a book, the thinner it becomes after sintering.
The more the conductive film is formed, the more it becomes active. If the amount of organic vehicle added is less than 40% by weight, it will not be sufficient to improve the thixotropic properties, and if it exceeds 60% by weight, the amount of precious metal added will be too small (too much, and the conductivity will be impaired). However, as a bad b0 filler, alumina (A/?s+O
a) Ceramics, titanium oxide (T1.0+), etc. can be used. Adding such a filler makes it easier for gas on the surface of the substrate or in the paste to dissipate to the outside through the interface between the filler and the paste during sintering. If the gas does not dissipate and instead collapses inside, bubbles will form, which can cause blisters and cracks in the film.
１−かしフィラーを混在してお叶は膜のフクレ、亀裂の
発生を確実に防止できるようになる。ｋか添加量がａｏ
ｏｐｐｍ未満ではガス抜去のためには不十分であり一又
ｓｏｏｐｐｍをこえると−フィラー自体が絶縁体である
かち一導電層と［−での導電性が損なわかれるようにな
って都合カｇｔｘｔ、−又エッチング時に邪魔な存在ト
ナッて高精度のエツφングが期待できなりようになる。1-By mixing the oak filler, it becomes possible to reliably prevent blistering and cracking of the leaf film. k or the amount added is ao
If it is less than soopm, it is insufficient for gas removal, and if it exceeds soopm, the filler itself is an insulator, and the conductivity between the conductive layer and [- is impaired, which may cause problems. In addition, high-precision etching cannot be expected due to the existence of obstacles during etching.
フィラーの粒径は０．１〜０．８５μｍ３を適当である
。The particle size of the filler is suitably 0.1 to 0.85 μm3.
貴金属と１．では他の添加物の添加＃シの関係かｃ−５
９〜８７重度％でよ−。従来ではこの添加量が８０〜９
０重ｆ！−％であるかムー これからして本使用貴金腐
量７５工少方（てすみ、それだけ製造価格ゴ低廉とガっ
て都合がより０
次にこの発明の実施例を謄明する。金５１電量％に鉛ガ
ラス２重量％を添加し、これを有機ビークル（エチルセ
ルロースとターピネオールとの混合体）４７重重景に分
散させて厚膜ペーストを得た。これにアルミナ５００ｐ
ｐｍを添加したものをスクリーン印刷して焼結１．た。Precious metals and 1. So, is it related to the addition of other additives?c-5
The severity is 9-87%. Conventionally, this addition amount was 80 to 9
0 weight f! Is it -%? From now on, the amount of precious metal used in this invention is 75 units less (I'm sorry, but it's convenient that the manufacturing price is that low. Next, I will explain the embodiments of this invention. Gold 51 A thick film paste was obtained by adding 2% by weight of lead glass to the amount of electricity and dispersing it in an organic vehicle (mixture of ethyl cellulose and terpineol) of 47% by weight.To this, 500p of alumina was added.
Screen printing and sintering of pm-added material 1. Ta.
得た導Ｎ層のシート抵抗ＦｉｇｇｍΩ／口であり、その
厚みを８μ（８回塗り）と１．た。この形成にあたり、
図に示すよう々段差部での形（ずれは皆無であった。又
膜の７クレ、亀裂は何ち生じたかった。々シ導電層の厚
みとしては２５μでも形くずれは生じなかった。The sheet resistance of the obtained conductive N layer is FigmΩ/hole, and its thickness is 8 μ (8 coats) and 1. Ta. In this formation,
As shown in the figure, there was no deviation of the shape at the stepped portion. There were no cracks or cracks in the film. Even when the thickness of the conductive layer was 25 μm, no deformation occurred.
【、たがってこの厚みとしては２．５〜８μであればよ
−ととり里理解で去る。[Therefore, I understand that the thickness should be 2.5 to 8μ.
ちなみに従来では、金８５ｇｔ％、鉛ガラス８重量％、
有機ピークｆｖ１２重量％によってペーストを得、これ
をスクリーン印刷してかＩＩ−，８５（１で焼結した。By the way, conventionally, gold is 85gt%, lead glass is 8wt%,
A paste was obtained with an organic peak fv of 12% by weight, which was screen printed and sintered with II-,85 (1).
得た導電層のシート抵抗は８ｍΩ／口の程度の圧入をも
って形成する七たけ段差部での形（ずれによっても途切
れは回避で去る。ｆｘ卦このように１−で得た導電層で
は１８０ｄ当りに８〜６個のフクレ及び亀裂の発生力ｎ
」れた。The sheet resistance of the conductive layer obtained is the shape of the seven-step step formed by press-fitting of about 8 mΩ/hole (discontinuity is avoided even if there is a shift. The force of generating 8 to 6 blisters and cracks n
”
以上詳述１．たよりＩＦこの発明によれば、発熱用の抵
抗層への通ＮＫ使用する導電層と）−で従来より本充分
薄（すること−ｈ；で六、１．≠１本このように薄に一
でも、導電層の段差部にかはる途切れを皆無と１１．１
−かも膜の７タレ、亀裂の発生を防止でき、そして何＾
支障な（導Ｎ層を薄（Ｆるこ七がで４゜ア１、Ｍ、ワ、
ヵヘ。別。９゜印刷、８、骨となり、かつ抵抗層から導
電層を経由して放散する熱量をも減少させることづ（で
き、本って熱の浪費を防止することがでｉ、Ｐ＃明なプ
リン） 、５ｇ可能となるといった効果を奏する。Detailed explanation above 1. According to this invention, the conductive layer used in the resistance layer for heat generation is thinner than the conventional one (6, 1.≠1). However, there is no discontinuity in the step part of the conductive layer.11.1
-It can prevent the occurrence of sagging and cracking of the seaweed film, and what ^^
Thin conductive N layer (4゜A1, M, Wa,
Kahe. another. 9゜Printing, 8. It is possible to reduce the amount of heat dissipated from the resistive layer via the conductive layer. ), 5g is possible.
第１図はサーマルプリンタヘッドの断面囮、第２図は一
部の拡大断面ｍである。FIG. 1 is a cross-sectional decoy of a thermal printer head, and FIG. 2 is a partially enlarged cross-section m.
Claims (1)
量％及び有機ビークル４０〜６０重量％かちなる厚膜ペ
ーストにフィラー８００〜８００ｐｐｍを添加したもの
をもって−厚みが８μ以下の発熱用の抵抗体の通電用の
導電層シして々るサーマルプリントヘッド。A thick film paste consisting of 87-59% by weight of noble metal powder, 1-8% by weight of glass frit, and 40-60% by weight of organic vehicle, with 800-800 ppm of filler added - for use in heat-generating resistors with a thickness of 8μ or less. A thermal print head with a conductive layer for electricity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58190136A JPS6082365A (en) | 1983-10-12 | 1983-10-12 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58190136A JPS6082365A (en) | 1983-10-12 | 1983-10-12 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6082365A true JPS6082365A (en) | 1985-05-10 |
| JPS643668B2 JPS643668B2 (en) | 1989-01-23 |
Family
ID=16252989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58190136A Granted JPS6082365A (en) | 1983-10-12 | 1983-10-12 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6082365A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0386559A (en) * | 1989-08-30 | 1991-04-11 | Matsushita Electric Ind Co Ltd | Thermal head and production thereof |
-
1983
- 1983-10-12 JP JP58190136A patent/JPS6082365A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0386559A (en) * | 1989-08-30 | 1991-04-11 | Matsushita Electric Ind Co Ltd | Thermal head and production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS643668B2 (en) | 1989-01-23 |
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