JPS6082283A - レ−ザ切屑切断装置 - Google Patents

レ−ザ切屑切断装置

Info

Publication number
JPS6082283A
JPS6082283A JP58185082A JP18508283A JPS6082283A JP S6082283 A JPS6082283 A JP S6082283A JP 58185082 A JP58185082 A JP 58185082A JP 18508283 A JP18508283 A JP 18508283A JP S6082283 A JPS6082283 A JP S6082283A
Authority
JP
Japan
Prior art keywords
laser
fiber
chip
cutting
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58185082A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242719B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Miura
宏 三浦
Hideo Furushima
古嶋 英男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP58185082A priority Critical patent/JPS6082283A/ja
Publication of JPS6082283A publication Critical patent/JPS6082283A/ja
Publication of JPS6242719B2 publication Critical patent/JPS6242719B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP58185082A 1983-10-05 1983-10-05 レ−ザ切屑切断装置 Granted JPS6082283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58185082A JPS6082283A (ja) 1983-10-05 1983-10-05 レ−ザ切屑切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58185082A JPS6082283A (ja) 1983-10-05 1983-10-05 レ−ザ切屑切断装置

Publications (2)

Publication Number Publication Date
JPS6082283A true JPS6082283A (ja) 1985-05-10
JPS6242719B2 JPS6242719B2 (enrdf_load_stackoverflow) 1987-09-09

Family

ID=16164504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58185082A Granted JPS6082283A (ja) 1983-10-05 1983-10-05 レ−ザ切屑切断装置

Country Status (1)

Country Link
JP (1) JPS6082283A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6242719B2 (enrdf_load_stackoverflow) 1987-09-09

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