JPS6074448A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS6074448A
JPS6074448A JP59182618A JP18261884A JPS6074448A JP S6074448 A JPS6074448 A JP S6074448A JP 59182618 A JP59182618 A JP 59182618A JP 18261884 A JP18261884 A JP 18261884A JP S6074448 A JPS6074448 A JP S6074448A
Authority
JP
Japan
Prior art keywords
wire
spool
gold wire
gold
turns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59182618A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242377B2 (OSRAM
Inventor
Michio Okamoto
道夫 岡本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP59182618A priority Critical patent/JPS6074448A/ja
Publication of JPS6074448A publication Critical patent/JPS6074448A/ja
Publication of JPS6242377B2 publication Critical patent/JPS6242377B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H63/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package
    • B65H63/08—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package responsive to delivery of a measured length of material, completion of winding of a package, or filling of a receptacle
    • B65H63/086—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package responsive to delivery of a measured length of material, completion of winding of a package, or filling of a receptacle responsive to completion of unwinding of a package
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H63/00—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package
    • B65H63/08—Warning or safety devices, e.g. automatic fault detectors, stop-motions ; Quality control of the package responsive to delivery of a measured length of material, completion of winding of a package, or filling of a receptacle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/30—Handled filamentary material
    • B65H2701/36—Wires
    • B65H2701/361—Semiconductor bonding wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]

Landscapes

  • Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
JP59182618A 1984-09-03 1984-09-03 ワイヤボンデイング装置 Granted JPS6074448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59182618A JPS6074448A (ja) 1984-09-03 1984-09-03 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59182618A JPS6074448A (ja) 1984-09-03 1984-09-03 ワイヤボンデイング装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP51113119A Division JPS6013303B2 (ja) 1976-09-22 1976-09-22 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPS6074448A true JPS6074448A (ja) 1985-04-26
JPS6242377B2 JPS6242377B2 (OSRAM) 1987-09-08

Family

ID=16121435

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59182618A Granted JPS6074448A (ja) 1984-09-03 1984-09-03 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6074448A (OSRAM)

Also Published As

Publication number Publication date
JPS6242377B2 (OSRAM) 1987-09-08

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