JPS6072663A - Connecting method of low melting metallic ball - Google Patents
Connecting method of low melting metallic ballInfo
- Publication number
- JPS6072663A JPS6072663A JP17807283A JP17807283A JPS6072663A JP S6072663 A JPS6072663 A JP S6072663A JP 17807283 A JP17807283 A JP 17807283A JP 17807283 A JP17807283 A JP 17807283A JP S6072663 A JPS6072663 A JP S6072663A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- balls
- wiring
- protective film
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
発明の技術分野
本発明は金属球の接続方法に係シ、特に配線パターンが
形成された基板に低融点金属球を接続する方法に関する
ものである。TECHNICAL FIELD OF THE INVENTION The present invention relates to a method for connecting metal balls, and more particularly to a method for connecting a low melting point metal ball to a substrate on which a wiring pattern is formed.
従来技術と問題点
従来、配線／ｆターンが形成された例えば第１のセラミ
ック基板上にぎ一ル状の導電体を接続し、更に該導電体
上に配線パターンを有する第２の基板を接続することに
よって配線ノ千ターンを有する２つの基板を接続する方
法がある。その方法の詳細を第１Ａ図から第１Ｄ図に示
す。第１図において配線パターン（図示せず）を有する
例えばセラミック基板１上に約３０〜５０μｍの厚さを
有するポリイミド樹脂からなる保論膜２が塗布され更に
、該保＠膜の上に約０．２〜０，３聴の厚さを有する例
えばステンレス製のメタルマスク３が配置されるＯ該保
護膜及びメタルマスクには、半田ボールを配置するため
の孔Ａが形成されている。Prior Art and Problems Conventionally, a coil-shaped conductor is connected to, for example, a first ceramic substrate on which wiring/f-turns are formed, and a second substrate having a wiring pattern is further connected to the conductor. There is a method of connecting two boards having 1,000 turns of wiring by doing this. Details of the method are shown in FIGS. 1A to 1D. In FIG. 1, a coating film 2 made of polyimide resin having a thickness of about 30 to 50 μm is coated on, for example, a ceramic substrate 1 having a wiring pattern (not shown). A metal mask 3 made of stainless steel, for example, having a thickness of 0.2 to 0.3 mm is disposed, and a hole A for disposing a solder ball is formed in the protective film and the metal mask.
次に第１Ｂ図に示すようにメタルマスク３を形成した後
約０．４ ｒｒａｎの径をする半田？−ル４を該メタル
マスクの孔Ａに配置し、セラミック基板１上の配線パタ
ーン上に搭載する。次に約２００℃の温度に加熱し半田
ゾール４を溶融し配線ノぐターンに溶着せしめる。Next, as shown in FIG. 1B, after forming a metal mask 3, a solder film having a diameter of about 0.4 rran is formed. - The metal mask 4 is placed in the hole A and mounted on the wiring pattern on the ceramic substrate 1. Next, the solder sol 4 is heated to a temperature of about 200° C. to melt it and weld it to the wiring nozzle.
次に第１Ｃ図に示すように、メタルマスク３を７１％し
その後配線パターンを有する第２のセラミック基板５を
該半田？−ル４上にセットし約２００℃に加熱し、第２
のセラミック基板上の配線ノ４ターと半田が一ル４を溶
着させる（第２Ｃ図）。Next, as shown in FIG. 1C, the metal mask 3 is covered by 71%, and then the second ceramic substrate 5 having a wiring pattern is bonded to the solder. - Set it on the 4th floor and heat it to about 200℃.
The wire 4 on the ceramic substrate and the solder weld together the 4 wires (Fig. 2C).
このようにして半田ボール４を介して２つのセラミック
基板が電気的に接続される。上記従来工程は工程が複雑
で生産能率が悪かった。In this way, the two ceramic substrates are electrically connected via the solder balls 4. The conventional process described above was complicated and had poor production efficiency.
本発明の目的
上記欠点を鑑み本発明は従来工程を簡略化し、生産能率
を向上させる半田ゴールの基板への接続方法を提供する
ととを目的とする。OBJECTS OF THE INVENTION In view of the above drawbacks, an object of the present invention is to provide a method for connecting a solder goal to a substrate, which simplifies the conventional process and improves production efficiency.
本発明の構成
本発明の目的は配線パターンが形成された基板上に、配
線用孔を有する平らな保護膜を配設し、次に前記保護膜
の厚さよシ大きな径を有する低融点金属球を前記配線用
孔内に配置し、次に該低融点金属球の融点温度以上に加
熱することを特徴とする低融点金属球を基板上に接続す
る方法によって達成される。Structure of the Present Invention The object of the present invention is to provide a flat protective film having wiring holes on a substrate on which a wiring pattern is formed, and then to form a low melting point metal ball having a diameter larger than the thickness of the protective film. This is achieved by a method of connecting a low melting point metal ball onto a substrate, which is characterized in that the metal ball is placed in the wiring hole and then heated to a temperature higher than the melting point temperature of the low melting point metal ball.
発明の実施例 以下本発明の１実施例を図面に基づいて説明する。Examples of the invention An embodiment of the present invention will be described below based on the drawings.
第２Ａ図から第２Ｃ図は本発明の１実施例を説明するた
めの概略工程断面図である。FIGS. 2A to 2C are schematic process cross-sectional views for explaining one embodiment of the present invention.
第２Ａ図に示すように配線パターンが形成された例えば
０．６〜０．７簡の厚さを有するセラミック基板１１上
に例えば約０．２ ｍｍの厚さを有する平らなシリコン
樹脂からなる保護膜１３をスクリーン印刷によって被着
形成する。該保護膜１３には直径が約０．３叫よりわず
かに大きい円柱状の孔Ｂが配線パターンに対応するツヤ
ターン化されて形成されている。As shown in FIG. 2A, a protection made of a flat silicone resin having a thickness of, for example, about 0.2 mm is placed on a ceramic substrate 11 having a thickness of, for example, 0.6 to 0.7 mm, on which a wiring pattern is formed. The membrane 13 is applied by screen printing. A cylindrical hole B having a diameter slightly larger than about 0.3 mm is formed in the protective film 13 in a glossy pattern corresponding to the wiring pattern.
次に第２Ｂ図に示すように該円柱状孔Ｂ内に直径が約０
．３ｍｊｎの半田ボール（例えば鉛３７チと錫６３襲合
金、融点１８３℃）を配置し、セラミック基板１１上に
搭載する。次に約２２０℃で加熱し、該半田？−ル１４
をセラミック基板１１上の配線ｚ４’ターンに溶着させ
る。この方法では従来使用したメタルマスクは不要とな
りその代わり厚い保護膜でその代用とした。Next, as shown in FIG. 2B, inside the cylindrical hole B a diameter of about 0.
．． 3mjn solder balls (for example, 37mm lead and 63mm tin alloy, melting point 183°C) are arranged and mounted on the ceramic substrate 11. Next, heat the solder at about 220°C. -Le 14
is welded to the wiring z4' turn on the ceramic substrate 11. This method eliminates the need for the conventional metal mask, and instead uses a thick protective film instead.
以下従来と同様に第２Ｃ図に示すように第２のセラミッ
ク基板１５を該半田ボール１４上にセリトン、第１のセ
ラミック基板１１と第２のセラミック基板を該半田ゾー
ル１４を介して導通させることが出来る。Thereafter, as in the conventional case, as shown in FIG. 2C, the second ceramic substrate 15 is placed on the solder balls 14, and the first ceramic substrate 11 and the second ceramic substrate are electrically connected through the solder sol 14. I can do it.
本発明では保護膜としては上記シリコン樹脂の他にエポ
キシ樹脂等も用いられ、該保護膜の厚さは低融点金属球
（半田ボール）の直径の約２／３程度が好ましい。本発
明で用いられる保護膜は抵抗、コンデンサ及び配線パタ
ーンの保設ばかシでなく金属球のコロガリを防止し電極
と半田ボールの位置合せを正確に実施し得るものである
。また本発明では低融点金属球として半田ボールを用い
たが半田メッキ、銀が一ル、半田メッキ、金ボール等も
用いられる。In the present invention, an epoxy resin or the like is used in addition to the above-mentioned silicone resin as the protective film, and the thickness of the protective film is preferably about 2/3 of the diameter of the low melting point metal ball (solder ball). The protective film used in the present invention not only protects resistors, capacitors, and wiring patterns, but also prevents the metal balls from rolling and allows accurate alignment of electrodes and solder balls. Further, in the present invention, solder balls are used as the low melting point metal balls, but solder plating, silver balls, solder plating, gold balls, etc. may also be used.
発明の詳細
な説明したように本発明によれば、従来使用していたメ
タルマスクが不要となるためメタルマスクのセットとメ
タルマスクの取シはずし工程が煮略され、金属球の基板
への接続工程が簡単化され、生産能率の向上に効果があ
る。DETAILED DESCRIPTION OF THE INVENTION As described in detail, according to the present invention, the metal mask used in the past is no longer necessary, so the process of setting and removing the metal mask is simplified, and the connection of the metal ball to the substrate is simplified. This simplifies the process and is effective in improving production efficiency.
第１Ａ図から第１Ｄ図迄は従来技術を説明するための概
略工程断面図であシ、第２Ａ図から第２Ｃ図迄は本発明
に係る１実施例を説明するための概略工程断面図である
。
１ｔ５ｔｌｌ、１５・・・セラミック基板、２・・・保
護膜、３・・・メタルマスク、４．１４・・・半田ｓｊ
−ル、１３・・・保護膜。
特許出願人
富士通株式会社
特許出願代理人
弁理士青水 朗
弁理士西舘和之
弁理士 内 １）幸 男
弁理士 山 口 昭 之
準］へ口１
第１Ｂ）司
第１Ｃ口
千 コＤ １り）
ｊａ
第２Ａ））ンｉ
粗危２Ｂ丘１
］４
率２Ｃ筐１1A to 1D are schematic process sectional views for explaining the prior art, and FIGS. 2A to 2C are schematic process sectional views for explaining one embodiment of the present invention. be. 1t5tll, 15... Ceramic substrate, 2... Protective film, 3... Metal mask, 4.14... Solder sj
-ru, 13...protective film. Patent Applicant Fujitsu Limited Patent Application Agent Patent Attorney Akio Aomi Patent Attorney Kazuyuki Nishidate Patent Attorney 1) Yukio Patent Attorney Akiyuki Yamaguchi] Heguchi 1 1B) Tsukasa 1C Kuchi 1 Ko D 1) ja 2nd A)
Claims (1)
厚さよシ大きな径を有する低融点金属球を前記配線用孔
内に配置し、次に該低融点金属球の融点温度以上に加熱
することを特徴とする低融点金属球を基板上に接続する
方法。[Claims] 1. Wiring on a substrate on which a wiring pattern is formed. A flat protective film having a wiring hole is disposed, then a low melting point metal ball having a diameter larger than the thickness of the protective film is placed in the wiring hole, and then the melting point temperature of the low melting point metal ball is A method of connecting a low-melting point metal ball onto a substrate, which is characterized by heating the ball to a temperature higher than 100.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17807283A JPS6072663A (en) | 1983-09-28 | 1983-09-28 | Connecting method of low melting metallic ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17807283A JPS6072663A (en) | 1983-09-28 | 1983-09-28 | Connecting method of low melting metallic ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6072663A true JPS6072663A (en) | 1985-04-24 |
Family
ID=16042125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17807283A Pending JPS6072663A (en) | 1983-09-28 | 1983-09-28 | Connecting method of low melting metallic ball |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6072663A (en) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871110A (en) * | 1987-09-14 | 1989-10-03 | Hitachi, Ltd. | Method and apparatus for aligning solder balls |
| US5127570A (en) * | 1990-06-28 | 1992-07-07 | Cray Research, Inc. | Flexible automated bonding method and apparatus |
| US5145104A (en) * | 1991-03-21 | 1992-09-08 | International Business Machines Corporation | Substrate soldering in a reducing atmosphere |
| US5341564A (en) * | 1992-03-24 | 1994-08-30 | Unisys Corporation | Method of fabricating integrated circuit module |
| US5456004A (en) * | 1994-01-04 | 1995-10-10 | Dell Usa, L.P. | Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards |
| US6024584A (en) * | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
| US6042389A (en) * | 1996-10-10 | 2000-03-28 | Berg Technology, Inc. | Low profile connector |
| US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
| US6139336A (en) * | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
| US6241535B1 (en) | 1996-10-10 | 2001-06-05 | Berg Technology, Inc. | Low profile connector |
| US6325644B1 (en) | 1996-10-10 | 2001-12-04 | Berg Technology, Inc. | High density connector and method of manufacture |
| USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
| USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
| USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
| USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
| US9048583B2 (en) | 2009-03-19 | 2015-06-02 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
| USD733662S1 (en) | 2013-01-25 | 2015-07-07 | Fci Americas Technology Llc | Connector housing for electrical connector |
| US9831605B2 (en) | 2012-04-13 | 2017-11-28 | Fci Americas Technology Llc | High speed electrical connector |
-
1983
- 1983-09-28 JP JP17807283A patent/JPS6072663A/en active Pending
Cited By (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871110A (en) * | 1987-09-14 | 1989-10-03 | Hitachi, Ltd. | Method and apparatus for aligning solder balls |
| US5127570A (en) * | 1990-06-28 | 1992-07-07 | Cray Research, Inc. | Flexible automated bonding method and apparatus |
| US5145104A (en) * | 1991-03-21 | 1992-09-08 | International Business Machines Corporation | Substrate soldering in a reducing atmosphere |
| US5341564A (en) * | 1992-03-24 | 1994-08-30 | Unisys Corporation | Method of fabricating integrated circuit module |
| US5456004A (en) * | 1994-01-04 | 1995-10-10 | Dell Usa, L.P. | Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards |
| US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
| US6042389A (en) * | 1996-10-10 | 2000-03-28 | Berg Technology, Inc. | Low profile connector |
| US6079991A (en) * | 1996-10-10 | 2000-06-27 | Berg Technology, Inc. | Method for placing contact on electrical connector |
| US6325644B1 (en) | 1996-10-10 | 2001-12-04 | Berg Technology, Inc. | High density connector and method of manufacture |
| US6358068B1 (en) | 1996-10-10 | 2002-03-19 | Fci Americas Technology, Inc. | Stress resistant connector and method for reducing stress in housing thereof |
| US6164983A (en) * | 1996-10-10 | 2000-12-26 | Berg Technology, Inc. | High density connector |
| US6241535B1 (en) | 1996-10-10 | 2001-06-05 | Berg Technology, Inc. | Low profile connector |
| US6024584A (en) * | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
| US6247635B1 (en) | 1996-11-14 | 2001-06-19 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
| US6139336A (en) * | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
| US9048583B2 (en) | 2009-03-19 | 2015-06-02 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
| US9461410B2 (en) | 2009-03-19 | 2016-10-04 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
| US10720721B2 (en) | 2009-03-19 | 2020-07-21 | Fci Usa Llc | Electrical connector having ribbed ground plate |
| USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
| USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
| USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
| US9831605B2 (en) | 2012-04-13 | 2017-11-28 | Fci Americas Technology Llc | High speed electrical connector |
| USD733662S1 (en) | 2013-01-25 | 2015-07-07 | Fci Americas Technology Llc | Connector housing for electrical connector |
| USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
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