JPS6068668U - Ceramic substrate for hybrid integrated circuit - Google Patents
Ceramic substrate for hybrid integrated circuitInfo
- Publication number
- JPS6068668U JPS6068668U JP15941683U JP15941683U JPS6068668U JP S6068668 U JPS6068668 U JP S6068668U JP 15941683 U JP15941683 U JP 15941683U JP 15941683 U JP15941683 U JP 15941683U JP S6068668 U JPS6068668 U JP S6068668U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- hybrid integrated
- integrated circuit
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の混成集積回路用セラミック基板の断面図
、第2図は第1図のセラ;ツク基板の平面図、第3図は
本考案の一実施例による混成集積回路用セラミック基板
の平面図である。
1・・・・・・セラミック基板、2,4,6・・・・・
・スルー1ホール!、fffi、3.5. 7・・・・
・・スルーホール、A・・・・・・原点。なお図中、同
一符号は同−又は相当部分を示す。FIG. 1 is a sectional view of a conventional ceramic substrate for hybrid integrated circuits, FIG. 2 is a plan view of the ceramic substrate of FIG. 1, and FIG. 3 is a diagram of a ceramic substrate for hybrid integrated circuits according to an embodiment of the present invention. FIG. 1... Ceramic substrate, 2, 4, 6...
・Through 1 hole! , fffi, 3.5. 7...
...Through hole, A...Origin. In the drawings, the same reference numerals indicate the same or equivalent parts.
Claims (1)
おいて、基板表面および裏面におけるスルーホール電極
が、スルーホール開口時の基板原点と各スルーホール点
とを結ぶ線の方向に長手形状となるように形成されてい
ることを特徴とする混成集積回路用セラミック基板。In a ceramic substrate for a hybrid integrated circuit having through-holes, through-hole electrodes on the front and back surfaces of the substrate are formed to have a longitudinal shape in the direction of a line connecting the substrate origin and each through-hole point when the through-hole is opened. A ceramic substrate for hybrid integrated circuits characterized by:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15941683U JPS6068668U (en) | 1983-10-15 | 1983-10-15 | Ceramic substrate for hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15941683U JPS6068668U (en) | 1983-10-15 | 1983-10-15 | Ceramic substrate for hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6068668U true JPS6068668U (en) | 1985-05-15 |
Family
ID=30350929
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15941683U Pending JPS6068668U (en) | 1983-10-15 | 1983-10-15 | Ceramic substrate for hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6068668U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750808A (en) * | 1980-09-08 | 1982-03-25 | Iseki Agricult Mach | Alarming device for empty of nursery plant of rice transplanter |
-
1983
- 1983-10-15 JP JP15941683U patent/JPS6068668U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5750808A (en) * | 1980-09-08 | 1982-03-25 | Iseki Agricult Mach | Alarming device for empty of nursery plant of rice transplanter |
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