JPS6068071A - Atomizing pump - Google Patents
Atomizing pumpInfo
- Publication number
- JPS6068071A JPS6068071A JP17524683A JP17524683A JPS6068071A JP S6068071 A JPS6068071 A JP S6068071A JP 17524683 A JP17524683 A JP 17524683A JP 17524683 A JP17524683 A JP 17524683A JP S6068071 A JPS6068071 A JP S6068071A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- nozzle plate
- soldering
- thin film
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、打面などの液体燃料、水・薬液などの液体の
霧化ポンプに関するものであシ、さらに詳しくは、圧電
振動子などの電気振動子を利用しに構成されている。す
なわち電気振動子１の相対向する平滑面には、電極膜２
ａ、２ｂが形成され、電極膜２ｂとノズル板３とは半田
層４ａを介して接合がされていた。さらにノズル板３の
他方の面と、ボディー５は半田層４ｂＱ介して接合され
ていた。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a pump for atomizing liquids such as liquid fuel, water, and chemical liquids, such as hitting surfaces. Configured for use with children. That is, the electrode film 2 is placed on the opposing smooth surfaces of the electric vibrator 1.
a, 2b were formed, and the electrode film 2b and nozzle plate 3 were bonded via the solder layer 4a. Further, the other surface of the nozzle plate 3 and the body 5 were joined via a solder layer 4bQ.
電気振動子１は主成分がＰｂＯ，ＴｉＯ２，ＺｒＯ２゜
ＮｂＯ、ＭｇＯからなるセラミック体で、円形中央部に
開口部を設けたリング形状を有し、電極膜２ａ 、２ｂ
は、銀糸の厚膜用導電性ベーヌトの焼給体、ノヌ諏し板
３は厚さ約５０μｍ程度のステンレスやチタンなど、半
田付に不活性な金属板が選ばれ、その中央部には、ノズ
／Ｉ／６の貫通孔（孔径約７０〜１００ ｌ１ｍ ）が
、１つまたは複数個設けられている。尚、ノズル板３は
、各構成部層と半Ｉ’ｌｌで接合されるため、第２図に
示す様にノヌ諏し板９表面を、予め半田付に活性な、銅
、金、銀、洋白、コバールなどの金属薄膜層３１．３２
で形成されていた。この金属薄膜層３１は、電気振動子
１を接合する被着部であり、はぼ電気振動子１と同形状
の被着パターンからなっていた。被着パターンは、第３
図に示す様に、電気振動子１の加振により、ノズル板３
が、図中点線の様に振動運動する際、この振動特性の変
動の原因になる、接合部の半田流Ａｋ阻１１−シ、半田
層４ ａ ｆ定形化するものである。金属薄膜層３２は
、ボディー５を接合する被着部で、」−記と同様に被着
パターンが設けられている。金属薄膜層３１．３２の膜
厚は約０．５〜１．５／１ｍ程度で、この層とノズル板
３との間は、付着強度を高めるため、クロム、ニクロム
、チタン等の金属の薄膜による中間層（膜１９約０．５
μｍ前後）３１ａ、３２ａを設けるなどしている。The electric vibrator 1 is a ceramic body whose main components are PbO, TiO2, ZrO2゜NbO, and MgO, and has a ring shape with an opening in the center of the circle, and electrode films 2a and 2b.
is a conductive burner for a thick film made of silver thread, and the nonu board 3 is an inert metal plate for soldering, such as stainless steel or titanium, with a thickness of about 50 μm. One or more nozzle/I/6 through holes (hole diameter approximately 70 to 100 l1m) are provided. In addition, since the nozzle plate 3 is joined to each component layer half I'll, as shown in FIG. Metal thin film layer such as nickel silver or Kovar 31.32
It was formed of. This metal thin film layer 31 is an adhered portion to which the electric vibrator 1 is bonded, and has an adhered pattern having the same shape as the electric vibrator 1. The adhesion pattern is the third
As shown in the figure, due to the vibration of the electric vibrator 1, the nozzle plate 3
However, when it vibrates as shown by the dotted line in the figure, the solder flow at the joint portion, which causes fluctuations in vibration characteristics, is shaped. The metal thin film layer 32 is an adhesion part that joins the body 5, and is provided with an adhesion pattern similar to the one shown in "-". The thickness of the metal thin film layers 31 and 32 is about 0.5 to 1.5/1 m, and a thin film of metal such as chromium, nichrome, titanium, etc. is used between this layer and the nozzle plate 3 to increase the adhesion strength. intermediate layer (film 19 approximately 0.5
micrometers) 31a and 32a are provided.
次に電極膜２ａは、印加電源及び電気回路Ｃ図省略】か
らのリード線接続用電爆であシ、ボディー５には液体通
路７および液体室８が設けられ、この様にして霧化ポン
プは＋１“４成されていた。Next, the electrode film 2a is connected to an electric source for connecting a lead wire from an applied power source and an electric circuit (not shown), and the body 5 is provided with a liquid passage 7 and a liquid chamber 8, and in this way, was made +1"4.
この構成では、ノズル板３と電気振動子１を接合する際
、ノス諏し板３の表面に設けられた、金属薄膜層３１が
、電気振動子１とほぼ同形状からなるため、半田付する
半田量をかなり精度良く管理する必要があった。また、
過剰の半田が供給された場合は、半田層４ａの接合端部
（電気振動子とノズル板との界面端部？に余剰の半田９
が球状に残り、振動特性を変動させるなどの問題があっ
た。In this configuration, when joining the nozzle plate 3 and the electric vibrator 1, the metal thin film layer 31 provided on the surface of the nozzle plate 3 has almost the same shape as the electric vibrator 1, so it is not necessary to solder it. It was necessary to control the amount of solder with great precision. Also,
If excessive solder is supplied, excess solder 9 may be applied to the joint end of the solder layer 4a (the interface end between the electric vibrator and the nozzle plate).
There were problems such as remaining in a spherical shape and causing fluctuations in vibration characteristics.
発明の目的
本発明は、かかる従来の欠点を除去するもので、霧化ポ
ンプの構成において、各構成部材の接合を容易にし、特
性の信頼性を高め、生産性の良い霧化ボンデを提供する
ことを目的とする。OBJECTS OF THE INVENTION The present invention eliminates such conventional drawbacks, and provides an atomization bonder that facilitates joining of each component in the construction of an atomization pump, improves reliability of characteristics, and has good productivity. The purpose is to
発明の構成
この目的を達成するために本発明に、電気振動子とノズ
ル板と、これらを支持するボディーとが、それぞれＦ１
１１層で接合された構成からなり、前記のノズル板の表
面には、前記電気振動子を接合するだめの敲着部と、２
１′田溜のための被着部を、相互に連結した構成で゛１
′、田被着パターンを設け、この半田被着パターンは、
半田付に活性な金属薄膜層を形成したものである。Structure of the Invention In order to achieve this object, the present invention includes an electric vibrator, a nozzle plate, and a body supporting these, each of which is F1.
The nozzle plate has a structure in which 11 layers are bonded together, and the surface of the nozzle plate has a glued portion for bonding the electric vibrator, and 2
1' A configuration in which the attachment parts for the rice fields are connected to each other.
′, a solder deposition pattern is provided, and this solder deposition pattern is
A thin metal film layer that is active for soldering is formed.
この構成によって、ノズル板と電気振動子との接合界面
の余乗半田は、振動系の影響の少ない半田溜部へ流れ吸
収される。従って、ノズル板と電気振動子との接合界面
の半田層は形状的に均一化できる。ノズル板中央部を中
心とした振動系の、半田層を均一化することにより、振
動特性の安定化が図れるものである。With this configuration, the cogonometric solder at the bonding interface between the nozzle plate and the electric vibrator flows into the solder reservoir where it is less affected by the vibration system and is absorbed. Therefore, the solder layer at the bonding interface between the nozzle plate and the electric vibrator can be made uniform in shape. By making the solder layer of the vibration system centered around the center of the nozzle plate uniform, the vibration characteristics can be stabilized.
実施例のＩ脱明
以下、本発明の一実施例を、第４図、第５１ン１を用い
て６兄明する。尚、これらの図において、第１図〜第３
図と同じものについては、同一番号を付している。I Clarification of the Embodiment Hereinafter, one embodiment of the present invention will be explained in six steps using FIG. 4 and Figure 51. In addition, in these figures, Figures 1 to 3
Components that are the same as those in the figure are given the same numbers.
第４図において、電気振動子１は外径φ１０ｍｍ開口径
φ３．５胴、厚さ約１０ｍのリング状で、従来例と同様
のもので、電極膜２ａ、２ｂが形成されている。ノズル
板３は、半田付に不活性なステンレス、チタンなどの金
属薄板で、従来と同様のものを選んだ。ノズル板３の両
面の一部には、半田付に活性な銅、金、銀、洋白、コバ
ール等の金属簿膜層３３．３４が、真空蒸着法、スバ・
フタ法、メッキ法、溶射法などにより形成されている。In FIG. 4, the electric vibrator 1 has a ring shape with an outer diameter of 10 mm, an opening diameter of 3.5 mm, and a thickness of about 10 m, and is similar to the conventional example, and has electrode films 2a and 2b formed thereon. The nozzle plate 3 is a thin metal plate made of stainless steel, titanium, or the like that is inert to soldering, and is the same as the conventional one. On a part of both sides of the nozzle plate 3, metal film layers 33 and 34 made of copper, gold, silver, nickel silver, Kovar, etc., which are active for soldering, are formed by vacuum evaporation, Suba, etc.
It is formed by the lid method, plating method, thermal spraying method, etc.
この金属薄膜層３３．３４の形状は、ノズル板３而」−
で、電気振動子１ならびにボディー５との接合ヲ及す部
分のみに、被着部としてパターン形成がなさｎている。The shape of this metal thin film layer 33, 34 is the shape of the nozzle plate 3.
In this case, a pattern is formed as an adherent part only in the part where the electric vibrator 1 and the body 5 are to be bonded.
尚、金属薄膜層３３を形成したノズル板３面」二には、
第５図に示す様な振動系への影響の少ない外周部位置に
、半田溜を目的とした金属薄膜層３５が設けられ、金属
薄膜層３３と相互に連結した半田被着パターンから構成
されている。Furthermore, the three surfaces of the nozzle plate on which the metal thin film layer 33 is formed are as follows:
As shown in FIG. 5, a metal thin film layer 35 for the purpose of a solder reservoir is provided at an outer circumferential position that has little influence on the vibration system, and is composed of a solder adhesion pattern interconnected with the metal thin film layer 33. There is.
ついで、電気振動子１の電極膜２ｂと、ノズル板３の金
属薄膜層３３、ならびにノズル板３の金属薄ＩＢ’ｊ
Ｉ＝ｊ ３４とボディー５ｉｄ、半田層４ａおよび半Ｉ
ＩＩ層４ｂを介して接合される。また、ボディー５の液
体通路７、液体室８などは、従来と同じ構造にしている
。Next, the electrode film 2b of the electric vibrator 1, the metal thin film layer 33 of the nozzle plate 3, and the metal thin IB'j of the nozzle plate 3
I=j 34 and body 5id, solder layer 4a and half I
They are bonded via the II layer 4b. Further, the liquid passage 7, liquid chamber 8, etc. of the body 5 have the same structure as the conventional one.
」ユ記構成において、発振回路Ｃ図省略）からの電圧印
加により、電気振動子１は発振され、半田層４ｂ全介し
て、ノズル板３を加振する。ノズル板３は、第３図の点
線で示した様に、振動運動をする。その結果、液体室９
に充填された液体は加圧され、ノズル孔ｅ１ヲ介して噴
霧化される。In the structure described in U, the electric vibrator 1 is oscillated by applying a voltage from an oscillation circuit C (not shown), and vibrates the nozzle plate 3 through the entire solder layer 4b. The nozzle plate 3 makes an oscillating motion as shown by the dotted line in FIG. As a result, liquid chamber 9
The liquid filled in is pressurized and atomized through the nozzle hole e1.
噴霧化は振動特性に依存されるため、ノズル板３の振動
運動を安定にすることが必要であった。Since atomization depends on vibration characteristics, it was necessary to stabilize the vibration movement of the nozzle plate 3.
従って、本発明の構成では、ノズル板３の表面に、半田
に活性な金属薄膜層３３．３５の（［１互を連結した被
着パターンを形成しているため、電気振動子１を接合時
、金属薄膜層３３の余剰−′１′田は、金属薄膜層３５
へ流れ、振動系の影響の少ないこの部分で、冷却後、固
着される。その結果、金属薄膜層３３からなる被着部の
半田層４ａ界面は、定形化できる。そのため、ノズル板
３の振動運動を、安定にすることが出来る。また、」二
連の様に、接合に不必要な余剰の半田は、金属薄膜層３
５で、その量に比例し吸収することができるため、従来
の様な精度の良い半田量の管理が不要とできる。Therefore, in the configuration of the present invention, the solder-active metal thin film layers 33, 35 are formed on the surface of the nozzle plate 3 in a bonded pattern in which the electric vibrator 1 is bonded. , the surplus -'1' field of the metal thin film layer 33 is the metal thin film layer 35.
After cooling, it is fixed in this part, which is less affected by the vibration system. As a result, the interface of the solder layer 4a of the adhered portion made of the metal thin film layer 33 can be shaped. Therefore, the vibration motion of the nozzle plate 3 can be made stable. In addition, as in the case of "double solder", excess solder unnecessary for bonding is removed from the metal thin film layer 3.
5, the amount of solder can be absorbed in proportion to the amount, so there is no need to manage the amount of solder with high precision as in the past.
発明の効果
以上のように、本発明の霧化ポンプによれば、ノズル板
の表面に、電気振動子を接合するための被着部と、半田
溜のための被着部を、相互に連結した構成で半田破着パ
ターンを形成しているため、半田接合時、前者の被着部
に対し余剰の半田は、後者の被着部で相当量を吸収でき
る。結果として、前者の被着部の半Ｉｎ界面は、定形化
できる。従って、ノズル板の振動運動を安定化する効果
が得られ、また、半田の供給量を精度良く管理すること
が不要となる効果が得られる。Effects of the Invention As described above, according to the atomizing pump of the present invention, the adhesion part for bonding the electric vibrator and the adhesion part for the solder reservoir are interconnected to the surface of the nozzle plate. Since a solder breakage pattern is formed with this configuration, during solder bonding, a considerable amount of excess solder with respect to the former adhered part can be absorbed by the latter adhered part. As a result, the semi-In interface of the former adhered portion can be defined. Therefore, the effect of stabilizing the vibration motion of the nozzle plate is obtained, and the effect that it is not necessary to precisely control the amount of solder supplied is obtained.
第１図は従来の構成による霧化ポンプを示す断面図、’
５２ ｌ”Ｘｉ ａ 、 ｂは従来の構成による要部の
平面図及び断面図、第３図は霧化ポンプ基本動作を説明
する断面図、第４図は本発明の一実施例を示す霧化ポン
プの断面ν１、第５図ａ、ｂは本発明のｆｉ’？）Ｉｉ
すによる要部の平面図及び断面図である。
１・・・・・’１１Ｊ、気振動子、２ａ・・・・・・電
極膜、２ｂ・・・・・・電極膜、３・・・・・ノズル板
、４ａ・・・・・・半日１層、４ｂ・・・・・半田層、
５・・・・・・ボディー、６・・・・・・ノズル孔、７
・・・・・・液体通路、８・・・・・・液体室、３１，
３２゜３３．３４．３５−−−・金属薄膜層、３ ｉ
ａ 、３２ａ・・・・・・中間層。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
ａ
第３図
第４図Figure 1 is a sectional view showing a conventional atomizing pump;
52 l"Xia, b are a plan view and a sectional view of the main parts according to the conventional configuration, FIG. 3 is a sectional view explaining the basic operation of the atomizing pump, and FIG. 4 is an atomizing pump showing an embodiment of the present invention. Cross section ν1 of the pump, Fig. 5 a and b are fi'?)Ii of the present invention
FIG. 3 is a plan view and a cross-sectional view of main parts. 1...'11J, air vibrator, 2a...electrode film, 2b...electrode film, 3...nozzle plate, 4a...half day 1st layer, 4b...Solder layer,
5...Body, 6...Nozzle hole, 7
...Liquid passage, 8...Liquid chamber, 31,
32゜33.34.35---・Metal thin film layer, 3 i
a, 32a... middle class. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2a Figure 3 Figure 4
Claims (1)
気振動子と、この電気振動子によって加振されるノズル
板と、これらを支持するボディーとが、それぞれ半田層
で接合された構成からな９、前記ノズル板の表面には、
前記電気振動子を接合するための被着部と、半田溜のた
めの被着部を、相互に連結した構成で半田被着パターン
を設け、この半田被着パターンは、半田付に活性な金属
薄膜層で形成した霧化ポンプ。 （２） ノス諏し板は、半田付に不活性なステンレス、
チタンなどの金属薄板である特許請求の範囲第１項記戦
の霧化ポンプ。 （３）半田付に活性な金属薄膜層は、銅、金、銀、洋白
、コバールなどの金属から成る特許請求の範囲第１項記
載の霧化ポンプ。 （４半田溜のための被着部は、ノズノ１）板が電気振動
子により加振され振動する際、ノズル板の振動を抑えた
部分に設けた特許請求の範囲第１項記載の霧化ポンプ。[Scope of Claims] +1) An electric vibrator having an electrode film provided on substantially smooth surfaces facing each other, a nozzle plate excited by this electric vibrator, and a body supporting these, respectively. 9. The surface of the nozzle plate has a structure that is joined with a solder layer.
A soldering pattern is provided in which a soldering part for joining the electric vibrator and a soldering part for a solder reservoir are interconnected, and this soldering pattern is made of a metal active for soldering. Atomization pump made of thin film layer. (2) Nosed board is made of stainless steel, which is inactive for soldering.
The atomizing pump according to claim 1, which is made of a thin metal plate such as titanium. (3) The atomizing pump according to claim 1, wherein the metal thin film layer active for soldering is made of a metal such as copper, gold, silver, nickel silver, or kovar. (4) The adhesion part for the solder reservoir is the nozzle 1. The atomization according to claim 1 is provided in a part where the vibration of the nozzle plate is suppressed when the plate is vibrated by an electric vibrator. pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17524683A JPS6068071A (en) | 1983-09-21 | 1983-09-21 | Atomizing pump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17524683A JPS6068071A (en) | 1983-09-21 | 1983-09-21 | Atomizing pump |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6068071A true JPS6068071A (en) | 1985-04-18 |
| JPS648590B2 JPS648590B2 (en) | 1989-02-14 |
Family
ID=15992812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17524683A Granted JPS6068071A (en) | 1983-09-21 | 1983-09-21 | Atomizing pump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6068071A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012689A1 (en) * | 1995-09-20 | 1997-04-10 | The Board Of Trustees Of The Leland Stanford Junior University | Fluid drop ejector and method |
| WO2006116915A1 (en) * | 2005-05-02 | 2006-11-09 | Hong Kong Piezo Co. Ltd. | Piezoelectric fluid atomizer apparatuses and methods |
| WO2010090169A1 (en) * | 2009-02-09 | 2010-08-12 | 株式会社村田製作所 | Atomizing member and atomizer equipped with same |
| CN102527565A (en) * | 2011-12-27 | 2012-07-04 | 重庆科技学院 | Atomizing plate of high speed centrifugal type atomizer |
| EP4032619A1 (en) * | 2021-01-25 | 2022-07-27 | Korea Institute of Science and Technology | Mesh type atomizer using porous thin film and method for manufacturing the same |
-
1983
- 1983-09-21 JP JP17524683A patent/JPS6068071A/en active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997012689A1 (en) * | 1995-09-20 | 1997-04-10 | The Board Of Trustees Of The Leland Stanford Junior University | Fluid drop ejector and method |
| US5828394A (en) * | 1995-09-20 | 1998-10-27 | The Board Of Trustees Of The Leland Stanford Junior University | Fluid drop ejector and method |
| US6291927B1 (en) | 1995-09-20 | 2001-09-18 | Board Of Trustees Of The Leland Stanford Junior University | Micromachined two dimensional array of piezoelectrically actuated flextensional transducers |
| US6445109B2 (en) | 1995-09-20 | 2002-09-03 | The Board Of Trustees Of The Leland Stanford Junior University | Micromachined two dimensional array of piezoelectrically actuated flextensional transducers |
| GB2440891B (en) * | 2005-05-02 | 2009-11-18 | Hong Kong Piezo Co Ltd | Piezoelectric fluid atomizer apparatuses and methods |
| GB2440891A (en) * | 2005-05-02 | 2008-02-13 | Hong Kong Piezo Co Ltd | Piezoelectric fluid atomizer apparatuses and methods |
| WO2006116915A1 (en) * | 2005-05-02 | 2006-11-09 | Hong Kong Piezo Co. Ltd. | Piezoelectric fluid atomizer apparatuses and methods |
| US7954730B2 (en) | 2005-05-02 | 2011-06-07 | Hong Kong Piezo Co. Ltd. | Piezoelectric fluid atomizer apparatuses and methods |
| WO2010090169A1 (en) * | 2009-02-09 | 2010-08-12 | 株式会社村田製作所 | Atomizing member and atomizer equipped with same |
| US8540169B2 (en) | 2009-02-09 | 2013-09-24 | Murata Manufacturing Co., Ltd. | Atomizing member and atomizer including the same |
| JP5382004B2 (en) * | 2009-02-09 | 2014-01-08 | 株式会社村田製作所 | Atomizing member and atomizer provided with the same |
| CN102527565A (en) * | 2011-12-27 | 2012-07-04 | 重庆科技学院 | Atomizing plate of high speed centrifugal type atomizer |
| EP4032619A1 (en) * | 2021-01-25 | 2022-07-27 | Korea Institute of Science and Technology | Mesh type atomizer using porous thin film and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS648590B2 (en) | 1989-02-14 |
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