JPS648584B2 - - Google Patents
Info
- Publication number
- JPS648584B2 JPS648584B2 JP22425882A JP22425882A JPS648584B2 JP S648584 B2 JPS648584 B2 JP S648584B2 JP 22425882 A JP22425882 A JP 22425882A JP 22425882 A JP22425882 A JP 22425882A JP S648584 B2 JPS648584 B2 JP S648584B2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- nozzle plate
- joint
- soft solder
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 26
- 230000008018 melting Effects 0.000 claims description 21
- 238000002844 melting Methods 0.000 claims description 21
- 238000000889 atomisation Methods 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000003595 mist Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Special Spraying Apparatus (AREA)
- Electrostatic Spraying Apparatus (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、灯油などの液体燃料、水・薬液など
の液体の霧化ポンプに関するものであり、さらに
詳しくは、圧電振動子などの電気振動子を利用し
た霧化ポンプに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an atomizing pump for liquid fuels such as kerosene and liquids such as water and chemical solutions. This relates to the atomization pump used.
従来例の構成とその問題点
従来この種の霧化ポンプは、１図に示すように
構成されている。すなわち電気振動子１の相対向
する平滑面には、電極膜２ａ，２ｂが形成され電
極膜２ｂとノズル板３とは軟鑞４ａを介して接合
がされていた。また、ノズル板３の他方の面とボ
デイー５は、軟鑞４ｂを介して接合されていた。Configuration of Conventional Example and its Problems Conventionally, this type of atomizing pump has been configured as shown in FIG. That is, electrode films 2a and 2b were formed on opposing smooth surfaces of the electric vibrator 1, and the electrode film 2b and the nozzle plate 3 were joined via a soft solder 4a. Further, the other surface of the nozzle plate 3 and the body 5 were joined via soft solder 4b.
電気振動子１は、主成分がPbO、TiO2、ZrO2
などからなるセラミツク体で、円形中央部に開口
部を設けたリイング形状を有し、電極膜２ａ，２
ｂは銀系の厚膜用導電性ペーストの焼結体、ある
いは金属などの蒸着膜が用いられ、ノズル板３は
厚さ約50μm程度の金属板がデイスク状に加工さ
れ、その中央部にはノズル孔６の貫通孔（孔径約
70〜100μm）が複数個設けられていた。接合部の
軟鑞４ａ，４ｂには、溶融点が約180℃の共晶半
田が用いられていた。電極膜２ａは外部リード線
接続用電極であり、ボデイー５には液体通路７お
よび液体室８が設けられていた。 The main components of the electric vibrator 1 are PbO, TiO 2 , and ZrO 2
It has a ring shape with an opening in the center of the circle, and has electrode films 2a, 2.
b is a sintered body of silver-based conductive paste for thick films or a vapor-deposited film of metal, etc., and the nozzle plate 3 is a metal plate with a thickness of about 50 μm processed into a disk shape, with a metal plate in the center. Through hole of nozzle hole 6 (hole diameter approx.
70 to 100 μm) were provided. Eutectic solder having a melting point of about 180° C. was used for the soft solders 4a and 4b at the joints. The electrode film 2a was an electrode for connecting an external lead wire, and the body 5 was provided with a liquid passage 7 and a liquid chamber 8.
この構成では、２ケ所の接合部（軟鑞４ａ，４
ｂ）に、同じ溶融点の共晶半田を用いるため、先
の接合部（軟鑞４ａ）が、次の半田付（軟鑞４
ｂ）時の熱的影響を受け、接合層の一部が再溶融
し易くなり接合層の変化（空隙部や厚み変化な
ど）で、特性が不安定になるという問題を有して
いた。 In this configuration, there are two joints (soft solder 4a, 4
Since eutectic solder with the same melting point is used for b), the previous joint (soft solder 4a) is the same as the next solder (soft solder 4a).
Under the thermal influence of (b), a part of the bonding layer tends to re-melt, resulting in changes in the bonding layer (such as voids and thickness changes), resulting in unstable properties.
発明の目的
本発明はかかる従来の問題を解消するもので、
接合層が熱的影響を受け難い構成とし、接合層の
変化ならびに特性の不安定さを抑制することを目
的とする。Purpose of the invention The present invention solves such conventional problems,
The purpose is to have a structure in which the bonding layer is not easily affected by heat, and to suppress changes in the bonding layer and instability of characteristics.
発明の構成
この目的を達成するために本発明は、電気振動
子―ノズル板、ノズル板―ボデイーとの接合にお
いて、融点の異なつた軟鑞を用いた接合構造をし
たものである。すなわち一方の接合部には高融点
軟鑞、他方の接合部には一方の固相点以下の融点
を有す低融点軟鑞により接合をするものである。
この構成によつて、前者の接合部は、後者の接合
時の熱的影響を受けても、接合層に空隙部や層厚
さなどの変化を生じることなく、特性も安定化が
図れるという作用を有する。Structure of the Invention In order to achieve this object, the present invention has a joint structure in which soft solders having different melting points are used to join an electric vibrator to a nozzle plate and a nozzle plate to a body. That is, one joint is made using a high melting point soft solder, and the other joint is made using a low melting point soft solder having a melting point lower than the solidus point of the one.
With this configuration, even if the former joint is subjected to thermal effects during the latter joint, there will be no voids or changes in the layer thickness in the joint layer, and the characteristics can be stabilized. has.
実施例の説明
以下、本発明の一実施例について説明をする。
図において、電気振動子１は、リング状（寸法：
外径10mm×内径４mm厚さ１mm）からなる圧電素子
で、振動子１の両平滑面側には電極膜２ａ，２ｂ
がパターン形成されている。この電極膜２ｂとノ
ズル板３とは、溶融点約180〜200℃の軟鑞４ａを
介して接合されている。次いでノズル板３の他方
の面をボデイー５が、溶融点約130〜150℃の軟鑞
４ｂを用いて接合されている。ボデイー５には、
液体通路７および液体室８が設けられている。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below.
In the figure, the electric vibrator 1 has a ring shape (dimensions:
It is a piezoelectric element with an outer diameter of 10 mm, an inner diameter of 4 mm, and a thickness of 1 mm), and electrode films 2a and 2b are placed on both smooth surfaces of the vibrator 1.
is formed into a pattern. The electrode film 2b and the nozzle plate 3 are joined via a soft solder 4a having a melting point of about 180 to 200°C. Next, the body 5 is joined to the other surface of the nozzle plate 3 using soft solder 4b having a melting point of about 130 to 150°C. In body 5,
A liquid passage 7 and a liquid chamber 8 are provided.
上記構成において、電気振動子１（電極膜２ｂ
含む）―ノズル板３、ノズル板３―ボデイー５間
の接合を融点の異なる軟鑞を介した接合構造にし
ている。軟鑞の組合せは、前者の接合に高融点軟
鑞、後者の接合には高融点軟鑞の固相点以下の融
点を有す低融点軟鑞が適している。 In the above configuration, the electric vibrator 1 (electrode film 2b
)--nozzle plate 3, and the nozzle plate 3--body 5 are bonded using soft solders having different melting points. As for the combination of soft solders, a high melting point soft solder is suitable for the former joining, and a low melting point soft solder having a melting point lower than the solidus point of the high melting point soft solder is suitable for the latter joining.
このため前者の接合部は、後者の接合時の熱的
影響を受けても、接合層に空隙部や層厚さなどの
変化を生じることがない。そのため、特性の安定
化が図れる効果が得られる。 Therefore, even if the former bonding portion is subjected to thermal effects during the latter bonding, there will be no change in voids or layer thickness in the bonding layer. Therefore, the effect of stabilizing the characteristics can be obtained.
尚、前者の接合部に低融点軟鑞、後者の接合部
に高融点軟鑞を用い、軟鑞付手順を変えることに
よつても同様の効果は得られる。 The same effect can also be obtained by changing the soft brazing procedure by using a low melting point soft solder for the former joint and a high melting point soft solder for the latter joint.
発明の効果
本発明の霧化ポンプによれば、次の効果が得ら
れる。Effects of the Invention According to the atomizing pump of the present invention, the following effects can be obtained.
(i) 電気振動子（電極膜を含む）とノズル板の接
合部と、ノズル板とボデイーの接合部の一方と
他方で融点の異なる鑞付をする先の接合部は熱
的影響を受けても、接合層に空隙部や層厚さの
変化などが生じない。従つて、安定した特性を
得られる効果がある。(i) The joint between the electric vibrator (including the electrode film) and the nozzle plate, and the joint between the nozzle plate and the body, where one side and the other side are soldered with different melting points, are subject to thermal influence. Also, no voids or changes in layer thickness occur in the bonding layer. Therefore, there is an effect that stable characteristics can be obtained.
図は本発明の一実施例の説明に用いた断面図で
ある。
１…電気振動子、２ａ…電極膜、２ｂ…電極
膜、３…ノズル板、４ａ…軟鑞、４ｂ…軟鑞、５
…ボデイー、６…ノズル孔、７…液体通路、８…
液体室。
The figure is a sectional view used to explain one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Electric vibrator, 2a... Electrode film, 2b... Electrode film, 3... Nozzle plate, 4a... Soft solder, 4b... Soft solder, 5
...Body, 6...Nozzle hole, 7...Liquid passage, 8...
liquid chamber.
Claims (1)
動子と、一ないし一以上のノズル孔を設けたノズ
ル板と、これらを支持するボデイーとからなり、
前記電極膜の一方を含めた前記電気振動子と前記
ノズル板との接合部と、前記ノズル板の裏面とボ
デイーとの接合部との一方を、他方とは融点の異
なつた鑞で接合した霧化ポンプ。 ２ 電気振動子とノズル板との間の接合は、高融
点軟鑞付けをした特許請求の範囲第１項記載の霧
化ポンプ。 ３ ノズル板裏面とボデイーとの間の接合には、
前記高融点軟鑞の固相点以下の融点からなる、低
融点軟鑞付をした特許請求の範囲第２項記載の霧
化ポンプ。[Scope of Claims] 1. Consisting of an electric vibrator having electrode films on opposing smooth surfaces, a nozzle plate having one or more nozzle holes, and a body supporting these,
A mist in which one of the joint between the electric vibrator and the nozzle plate, including one of the electrode films, and the joint between the back surface of the nozzle plate and the body are joined with solder having a different melting point from the other. conversion pump. 2. The atomization pump according to claim 1, wherein the electric vibrator and the nozzle plate are joined by high melting point soft brazing. 3 For the connection between the back of the nozzle plate and the body,
The atomizing pump according to claim 2, which is provided with a low melting point soft solder having a melting point below the solidus point of the high melting point soft solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22425882A JPS59112857A (en) | 1982-12-20 | 1982-12-20 | Atomizer pump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22425882A JPS59112857A (en) | 1982-12-20 | 1982-12-20 | Atomizer pump |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59112857A JPS59112857A (en) | 1984-06-29 |
| JPS648584B2 true JPS648584B2 (en) | 1989-02-14 |
Family
ID=16810955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22425882A Granted JPS59112857A (en) | 1982-12-20 | 1982-12-20 | Atomizer pump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59112857A (en) |
-
1982
- 1982-12-20 JP JP22425882A patent/JPS59112857A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59112857A (en) | 1984-06-29 |
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