JPS648590B2 - - Google Patents
Info
- Publication number
- JPS648590B2 JPS648590B2 JP17524683A JP17524683A JPS648590B2 JP S648590 B2 JPS648590 B2 JP S648590B2 JP 17524683 A JP17524683 A JP 17524683A JP 17524683 A JP17524683 A JP 17524683A JP S648590 B2 JPS648590 B2 JP S648590B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle plate
- solder
- electric vibrator
- soldering
- metal thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 37
- 229910052751 metal Inorganic materials 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 26
- 239000010409 thin film Substances 0.000 claims description 20
- 239000010408 film Substances 0.000 claims description 12
- 238000005476 soldering Methods 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910000833 kovar Inorganic materials 0.000 claims description 3
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 claims description 3
- 239000010956 nickel silver Substances 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 10
- 238000000889 atomisation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
- B05B17/0638—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers spray being produced by discharging the liquid or other fluent material through a plate comprising a plurality of orifices
- B05B17/0646—Vibrating plates, i.e. plates being directly subjected to the vibrations, e.g. having a piezoelectric transducer attached thereto
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、灯油などの液体燃料、水・薬液など
の液体の霧化ポンプに関するものであり、さらに
詳しくは、圧電振動子などの電気振動子を利用し
た霧化ポンプに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an atomizing pump for liquid fuels such as kerosene and liquids such as water and chemical solutions. This relates to the atomization pump used.
従来例の構成とその問題点
従来この種の霧化ポンプは、第１図に示すよう
に構成されている。すなわち電気振動子１の相対
向する平滑面には、電極膜２ａ，２ｂが形成さ
れ、電極膜２ｂとノズル板３とは半田層４ａを介
して接合がされていた。さらにノズル板３の他方
の面と、ボイー５は半田層４ｂを介して接合され
ていた。Conventional configuration and problems thereof A conventional atomizing pump of this type has a configuration as shown in FIG. That is, electrode films 2a and 2b were formed on opposing smooth surfaces of the electric vibrator 1, and the electrode film 2b and the nozzle plate 3 were joined via a solder layer 4a. Furthermore, the other surface of the nozzle plate 3 and the boy 5 were joined via a solder layer 4b.
電気振動子１は主成分がPbO、TiO2、ZrO2、
NbO、MgOからなるセラミツク体で、円形中央
部に開口部を設けたリング形状を有し、電極膜２
ａ，２ｂは、銀系の厚膜用導電性ペーストの焼結
体、ノズル板３は厚さ約50μm程度のステンレス
やチタンなど、半田付に不活性な金属板が選ば
れ、その中央部には、ノズル６の貫通孔（孔径約
70〜100μm）が、１つまたは複数個設けられてい
る。尚、ノズル板３は、各構成部材と半田で接合
されるため、第２図に示す様にノズル板３表面
を、予め半田付に活性な、銅、金、銀、洋白、コ
バールなどの金属薄膜層３１，３２で形成されて
いた。この金属薄膜層３１は、電気振動子１を接
合する被着部であり、ほぼ電気振動子１と同形状
の被着パターンからなつていた。被着パターン
は、第３図に示す様に、電気振動子１の加振によ
り、ノズル板３が、図中点線の様に振動運動する
際、この振動特性の変動の原因になる、接合部の
半田流れを阻止し、半田層４ａを定形化するもの
である。金属薄膜層３２は、ボデイー５を接合す
る被着部で、上記と同様に被着パターンが設けら
れている。金属薄膜層３１，３２の膜厚は約0.5
〜1.5μm適度で、この層とノズル板３との間は、
付着強度を高めるため、クロム、ニクロム、チタ
ン等の金属の薄膜による中間層（膜厚約0.5μm前
後）３１ａ，３２ａを設けるなどしている。次に
電極膜２ａは、印加電源及び電気回路（図省略）
からのリード線接続用電極であり、ボデイー５に
は液体通路７および液体室８が設けられ、この様
にして霧化ポンプは構成されていた。 The main components of the electric vibrator 1 are PbO, TiO 2 , ZrO 2 ,
It is a ceramic body made of NbO and MgO, and has a ring shape with an opening in the center of the circle, and the electrode film 2
a and 2b are sintered bodies of silver-based conductive paste for thick films, and the nozzle plate 3 is an inert metal plate for soldering, such as stainless steel or titanium, with a thickness of about 50 μm. is the through hole of nozzle 6 (hole diameter approx.
70 to 100 μm) is provided one or more times. Since the nozzle plate 3 is joined to each component by solder, the surface of the nozzle plate 3 is coated with a material active for soldering, such as copper, gold, silver, nickel silver, or kovar, as shown in FIG. It was formed of metal thin film layers 31 and 32. This metal thin film layer 31 is a deposited portion to which the electric vibrator 1 is bonded, and has a deposited pattern that has approximately the same shape as the electric vibrator 1. As shown in FIG. 3, the adhesion pattern is a joint that causes fluctuations in the vibration characteristics when the nozzle plate 3 vibrates as shown by the dotted line in the figure due to the vibration of the electric vibrator 1. This prevents the solder from flowing and shapes the solder layer 4a. The metal thin film layer 32 is an adhesion part that joins the body 5, and is provided with an adhesion pattern in the same manner as described above. The thickness of the metal thin film layers 31 and 32 is approximately 0.5
~1.5μm is appropriate, and between this layer and the nozzle plate 3,
In order to increase the adhesion strength, intermediate layers 31a and 32a made of a thin film of metal such as chromium, nichrome, titanium, etc. (film thickness of about 0.5 μm) are provided. Next, the electrode film 2a is connected to an applied power source and an electric circuit (not shown).
The body 5 was provided with a liquid passage 7 and a liquid chamber 8, and thus the atomizing pump was constructed.
この構成では、ノズル板３と電気振動子１を接
合する際、ノズル板３の表面に設けられた、金属
薄膜層３１が、電気振動子１とほぼ同形状からな
るため、半田付する半田量をかなり精度良く管理
する必要があつた。また、過剰の半田が供給され
た場合は、半田層４ａの接合端部（電気振動子と
ノズル板との界面端部）に余剰の半田９が球状に
残り、振動特性を変動させるなどの問題があつ
た。 In this configuration, when joining the nozzle plate 3 and the electric vibrator 1, since the metal thin film layer 31 provided on the surface of the nozzle plate 3 has almost the same shape as the electric vibrator 1, the amount of solder to be soldered is It was necessary to manage it with great precision. In addition, if excessive solder is supplied, excess solder 9 will remain in a spherical shape at the joint end of the solder layer 4a (the interface end between the electric vibrator and the nozzle plate), causing problems such as fluctuations in vibration characteristics. It was hot.
発明の目的
本発明は、かかる従来の欠点を除去するもの
で、霧化ポンプの構成において、各構成部材の接
合を容易にし、特性の信頼性を高め、生産性の良
い霧化ポンプを提供することを目的とする。OBJECT OF THE INVENTION The present invention eliminates such conventional drawbacks, and provides an atomizing pump that facilitates joining of each component in the construction of an atomizing pump, improves reliability of characteristics, and has good productivity. The purpose is to
発明の構成
この目的を達成するために本発明は、電気振動
子とノズル板と、これらを支持するボデイーと
が、それぞれ半田層で接合された構成からなり、
前記のノズル板の表面には、前記電気振動子を接
合するための被着部と、半田溜のための被着部
を、相互に連結した構成で半田被着パターンを設
け、この半田被着パターンは、半田付に活性な金
属薄膜層を形成したものである。Structure of the Invention In order to achieve this object, the present invention has a structure in which an electric vibrator, a nozzle plate, and a body supporting these are each joined by a solder layer,
A solder deposition pattern is provided on the surface of the nozzle plate, in which a soldering part for joining the electric vibrator and a soldering part for a solder reservoir are interconnected. The pattern is a thin layer of metal that is active for soldering.
この構成によつて、ノズル板と電気振動子との
接合界面の余乗半田は、振動系の影響の少ない半
田溜部へ流れ吸収される。従つて、ノズル板と電
気振動子との接合界面の半田層は形状的に均一化
できる。ノズル板中央部を中心とした振動系の、
半田層を均一化することにより、振動特性の安定
化が図れるものである。 With this configuration, the cogonometric solder at the bonding interface between the nozzle plate and the electric vibrator flows into the solder reservoir where it is less affected by the vibration system and is absorbed. Therefore, the solder layer at the bonding interface between the nozzle plate and the electric vibrator can be made uniform in shape. A vibration system centered on the center of the nozzle plate,
By making the solder layer uniform, vibration characteristics can be stabilized.
実施例の説明
以下、本発明の一実施例を、第４図、第５図を
用いて説明する。尚、これらの図において、第１
図〜第３図と同じものについては、同一番号を付
している。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 and 5. In addition, in these figures, the first
Components that are the same as those in FIGS. 3 to 3 are designated by the same numbers.
第４図において、電気振動子１は外径φ10mm開
口径φ3.5mm、厚さ約10mmのリング状で、従来例と
同様のもので、電極膜２ａ，２ｂが形成されてい
る。ノズル板３は、半田付に不活性なステンレ
ス、チタンなどの金属薄板で、従来と同様のもの
を選んだ。ノズル板３の両面の一部には、半田付
に活性な銅、金、銀、洋白、コバール等の金属薄
膜層３３，３４が、真空蒸着法、スパツタ法、メ
ツキ法、溶射法などにより形成されている。この
金属薄膜層３３，３４の形状は、ノズル板３面上
で、電気振動子１ならびにボデイー５との接合を
要す部分のみに、被着部としてパターン形成がな
されている。尚、金属薄膜層３３を形成したノズ
ル板３面上には、第５図に示す様な振動系への影
響の少ない外周部位置に、半田溜を目的とした金
属薄膜層３５が設けられ、金属薄膜層３３と相互
に連結した半田被着パターンから構成されてい
る。 In FIG. 4, an electric vibrator 1 is ring-shaped with an outer diameter of 10 mm, an opening diameter of 3.5 mm, and a thickness of about 10 mm, and is similar to the conventional example, and has electrode films 2a and 2b formed thereon. The nozzle plate 3 is a thin metal plate made of stainless steel, titanium, or the like that is inert to soldering, and is the same as the conventional one. On a part of both sides of the nozzle plate 3, metal thin film layers 33 and 34 made of copper, gold, silver, nickel silver, Kovar, etc., which are active for soldering, are formed by vacuum evaporation, sputtering, plating, thermal spraying, etc. It is formed. The shape of the metal thin film layers 33 and 34 is such that a pattern is formed on the nozzle plate 3 only in the portions that require bonding with the electric vibrator 1 and the body 5 as adhered portions. Incidentally, on the surface of the nozzle plate 3 on which the metal thin film layer 33 is formed, a metal thin film layer 35 for the purpose of a solder reservoir is provided at a position on the outer periphery that has less influence on the vibration system as shown in FIG. It consists of a metal thin film layer 33 and interconnected solder deposit patterns.
ついで、電気振動子１の電極膜２ｂと、ノズル
板３の金属薄膜層３３、ならびにノズル板３の金
属薄膜層３４とボデイー５は、半田層４ａおよび
半田層４ｂを介して接合される。また、ボデイー
５の液体通路７、液体室８などは、従来と同じ構
造にしている。 Next, the electrode film 2b of the electric vibrator 1, the metal thin film layer 33 of the nozzle plate 3, and the metal thin film layer 34 of the nozzle plate 3 and the body 5 are joined via the solder layer 4a and the solder layer 4b. Furthermore, the liquid passage 7, liquid chamber 8, etc. of the body 5 have the same structure as the conventional one.
上記構成において、発振回路（図省略）からの
電圧印加により、電気振動子１は発振され、半田
層４ｂを介して、ノズル板３を加振する。ノズル
板３は、第３図の点線で示した様に、振動運動を
する。その結果、液体室９に充填された液体は加
圧され、ノズル孔６を介して噴霧化される。 In the above configuration, the electric vibrator 1 is oscillated by voltage application from an oscillation circuit (not shown), and vibrates the nozzle plate 3 via the solder layer 4b. The nozzle plate 3 makes an oscillating motion as shown by the dotted line in FIG. As a result, the liquid filled in the liquid chamber 9 is pressurized and atomized through the nozzle hole 6.
噴霧化は振動特性に依存されるため、ノズル板
３の振動運動を安定にすることが必要であつた。
従つて、本発明の構成では、ノズル板３の表面
に、半田に活性な金属薄膜層３３，３５の相互を
連結した被着パターンを形成しているため、電気
振動子１を接合時、金属薄膜層３３の余剰半田
は、金属薄膜層３５へ流れ、振動系の影響の少な
いこの部分で、冷却後、固着される。その結果、
金属薄膜層３３からなる被着部の半田層４ａ界面
は、定形化できる。そのため、ノズル板３の振動
運動を、安定にすることが出来る。また、上述の
様に、接合に不必要な余剰の半田は、金属薄膜層
３５で、その量に比例し吸収することができるた
め、従来の様な精度の良い半田量の管理が不要と
できる。 Since atomization depends on vibration characteristics, it was necessary to stabilize the vibration movement of the nozzle plate 3.
Therefore, in the configuration of the present invention, since the surface of the nozzle plate 3 is formed with an adhesion pattern in which the metal thin film layers 33 and 35 that are active to solder are interconnected, the metal Excess solder on the thin film layer 33 flows to the metal thin film layer 35, and is fixed after cooling in this part that is less affected by the vibration system. the result,
The solder layer 4a interface of the adhered portion made of the metal thin film layer 33 can be shaped. Therefore, the vibration motion of the nozzle plate 3 can be made stable. In addition, as mentioned above, surplus solder that is unnecessary for bonding can be absorbed by the metal thin film layer 35 in proportion to its amount, making it unnecessary to manage the amount of solder with high precision as in the past. .
発明の効果
以上のように、本発明の霧化ポンプによれば、
ノズル板の表面に、電気振動子を接合するための
被着部と、半田溜のための被着部を、相互に連結
した構成で半田被着パターンを形成しているた
め、半田接合時、前者の被着部に対し余剰の半田
は、後者の被着部で相当量を吸収できる。結果と
して、前者の被着部の半田界面は、定形化でき
る。従つて、ノズル板の振動運動を安定化する効
果が得られ、また、半田の供給量を精度良く管理
することが不要となる効果が得られる。Effects of the Invention As described above, according to the atomization pump of the present invention,
On the surface of the nozzle plate, the solder pattern is formed by interconnecting the adhesive part for joining the electric vibrator and the adhesive part for the solder reservoir, so when soldering, A considerable amount of excess solder relative to the former adhered portion can be absorbed by the latter adhered portion. As a result, the solder interface of the former adhered portion can be defined. Therefore, the effect of stabilizing the vibration motion of the nozzle plate is obtained, and the effect that it is not necessary to precisely control the amount of solder supplied is obtained.
第１図は従来の構成による霧化ポンプを示す断
面図、第２図ａ，ｂは従来の構成による要部の平
面図及び断面図、第３図は霧化ポンプ基本動作を
説明する断面図、第４図は本発明の一実施例を示
す霧化ポンプの断面図、第５図ａ，ｂは本発明の
構成による要部の平面図及び断面図である。
１…電気振動子、２ａ…電極膜、２ｂ…電極
膜、３…ノズル板、４ａ…半田層、４ｂ…半田
層、５…ボデイー、６…ノズル孔、７…液体通
路、８…液体室、３１，３２，３３，３４，３５
…金属薄膜層、３１ａ，３２ａ…中間層。
Figure 1 is a sectional view showing an atomizing pump with a conventional configuration, Figures 2 a and b are a plan view and sectional view of the main parts of a conventional configuration, and Figure 3 is a sectional view explaining the basic operation of the atomizing pump. , FIG. 4 is a sectional view of an atomizing pump showing an embodiment of the present invention, and FIGS. 5 a and 5 b are a plan view and a sectional view of essential parts according to the configuration of the present invention. DESCRIPTION OF SYMBOLS 1... Electric vibrator, 2a... Electrode film, 2b... Electrode film, 3... Nozzle plate, 4a... Solder layer, 4b... Solder layer, 5... Body, 6... Nozzle hole, 7... Liquid passage, 8... Liquid chamber, 31, 32, 33, 34, 35
...metal thin film layer, 31a, 32a... intermediate layer.
Claims (1)
振動子と、この電気振動子によつて加振されるノ
ズル板と、これらを支持するボデイーとが、それ
ぞれ半田層で接合された構成からなり、前記ノズ
ル板の表面には、前記電気振動子を接合するため
の被着部と、半田溜のための被着部を、相互に連
結した構成で半田被着パターンを設け、この半田
被着パターンは、半田付に活性な金属薄膜層で形
成した霧化ポンプ。 ２ ノズル板は、半田付に不活性なステンレス、
チタンなどの金属薄板である特許請求の範囲第１
項記載の霧化ポンプ。 ３ 半田付に活性な金属薄膜層は、銅、金、銀、
洋白、コバールなどの金属から成る特許請求の範
囲第１項記載の霧化ポンプ。 ４ 半田溜のための被着部は、ノズル板が電気振
動子により加振され振動する際、ノズル板の振動
を抑えた部分に設けた特許請求の範囲第１項記載
の霧化ポンプ。[Scope of Claims] 1. An electric vibrator having an electrode film provided on opposing substantially smooth surfaces, a nozzle plate vibrated by the electric vibrator, and a body supporting these are each soldered together. The nozzle plate has a structure in which solder is applied to the surface of the nozzle plate in a structure in which an adhesion part for joining the electric vibrator and an adhesion part for a solder reservoir are connected to each other. A pattern is provided, and this solder deposition pattern is formed by a thin metal film layer active for soldering using an atomizing pump. 2 The nozzle plate is made of stainless steel that is inert to soldering.
Claim 1 which is a metal thin plate such as titanium
Atomizing pump as described in section. 3 The metal thin film layer active for soldering is copper, gold, silver,
The atomizing pump according to claim 1, which is made of a metal such as nickel silver or Kovar. 4. The atomizing pump according to claim 1, wherein the adhering portion for the solder reservoir is provided in a portion where vibration of the nozzle plate is suppressed when the nozzle plate is vibrated by being excited by an electric vibrator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17524683A JPS6068071A (en) | 1983-09-21 | 1983-09-21 | Atomizing pump |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17524683A JPS6068071A (en) | 1983-09-21 | 1983-09-21 | Atomizing pump |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6068071A JPS6068071A (en) | 1985-04-18 |
| JPS648590B2 true JPS648590B2 (en) | 1989-02-14 |
Family
ID=15992812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17524683A Granted JPS6068071A (en) | 1983-09-21 | 1983-09-21 | Atomizing pump |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6068071A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5828394A (en) * | 1995-09-20 | 1998-10-27 | The Board Of Trustees Of The Leland Stanford Junior University | Fluid drop ejector and method |
| US7954730B2 (en) | 2005-05-02 | 2011-06-07 | Hong Kong Piezo Co. Ltd. | Piezoelectric fluid atomizer apparatuses and methods |
| WO2010089822A1 (en) * | 2009-02-09 | 2010-08-12 | 株式会社村田製作所 | Atomizing member and atomizer equipped with same |
| CN102527565A (en) * | 2011-12-27 | 2012-07-04 | 重庆科技学院 | Atomizing plate of high speed centrifugal type atomizer |
| KR102581043B1 (en) * | 2021-01-25 | 2023-09-22 | 한국과학기술연구원 | Mesh type atomizer using porous thin film and method for manufacturing the same |
-
1983
- 1983-09-21 JP JP17524683A patent/JPS6068071A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6068071A (en) | 1985-04-18 |
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