JPS6067311A - リ−ドフレ−ムの移送方法 - Google Patents

リ−ドフレ−ムの移送方法

Info

Publication number
JPS6067311A
JPS6067311A JP58171913A JP17191383A JPS6067311A JP S6067311 A JPS6067311 A JP S6067311A JP 58171913 A JP58171913 A JP 58171913A JP 17191383 A JP17191383 A JP 17191383A JP S6067311 A JPS6067311 A JP S6067311A
Authority
JP
Japan
Prior art keywords
lead frame
claw
motor
fixed
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58171913A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6356122B2 (enrdf_load_stackoverflow
Inventor
Nobuhito Yamazaki
山崎　信人
Kazuo Sugiura
一夫 杉浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58171913A priority Critical patent/JPS6067311A/ja
Publication of JPS6067311A publication Critical patent/JPS6067311A/ja
Publication of JPS6356122B2 publication Critical patent/JPS6356122B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Reciprocating Conveyors (AREA)
JP58171913A 1983-09-16 1983-09-16 リ−ドフレ−ムの移送方法 Granted JPS6067311A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58171913A JPS6067311A (ja) 1983-09-16 1983-09-16 リ−ドフレ−ムの移送方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58171913A JPS6067311A (ja) 1983-09-16 1983-09-16 リ−ドフレ−ムの移送方法

Publications (2)

Publication Number Publication Date
JPS6067311A true JPS6067311A (ja) 1985-04-17
JPS6356122B2 JPS6356122B2 (enrdf_load_stackoverflow) 1988-11-07

Family

ID=15932152

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58171913A Granted JPS6067311A (ja) 1983-09-16 1983-09-16 リ−ドフレ−ムの移送方法

Country Status (1)

Country Link
JP (1) JPS6067311A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104555283A (zh) * 2014-12-05 2015-04-29 丹东金丸集团有限公司 用于全自动肠溶胶囊包衣机的拨条机构
CN109159969A (zh) * 2018-07-16 2019-01-08 东莞市联洲知识产权运营管理有限公司 一种机器人配套推码装置上优化的料道

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975178U (enrdf_load_stackoverflow) * 1972-10-16 1974-06-28
JPS543883B1 (enrdf_load_stackoverflow) * 1971-05-10 1979-02-28
JPS55113396A (en) * 1979-02-23 1980-09-01 Shinkawa Seisakusho Kk Device for supplying and containing work
JPS57139988A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Apparatus for automatically conveying printed board
JPS57206098A (en) * 1981-06-15 1982-12-17 Tokyo Shibaura Electric Co Method of producing printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS543883B1 (enrdf_load_stackoverflow) * 1971-05-10 1979-02-28
JPS4975178U (enrdf_load_stackoverflow) * 1972-10-16 1974-06-28
JPS55113396A (en) * 1979-02-23 1980-09-01 Shinkawa Seisakusho Kk Device for supplying and containing work
JPS57139988A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Apparatus for automatically conveying printed board
JPS57206098A (en) * 1981-06-15 1982-12-17 Tokyo Shibaura Electric Co Method of producing printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104555283A (zh) * 2014-12-05 2015-04-29 丹东金丸集团有限公司 用于全自动肠溶胶囊包衣机的拨条机构
CN109159969A (zh) * 2018-07-16 2019-01-08 东莞市联洲知识产权运营管理有限公司 一种机器人配套推码装置上优化的料道

Also Published As

Publication number Publication date
JPS6356122B2 (enrdf_load_stackoverflow) 1988-11-07

Similar Documents

Publication Publication Date Title
US5126002A (en) Leaf paper bundling apparatus
US1907532A (en) Mount making machine
US4539789A (en) Bundling apparatus
JPS6067311A (ja) リ−ドフレ−ムの移送方法
GB2087832A (en) Binding aricle with crossed bands
JPS6356121B2 (enrdf_load_stackoverflow)
JPH10209187A (ja) ボンディング装置
JPS6357329B2 (enrdf_load_stackoverflow)
JPH032771B2 (enrdf_load_stackoverflow)
JP2010503230A (ja) ２クランプを形成する３ジョーを有するグリッパ
JPS6067314A (ja) リ−ドフレ−ムの移送装置
US5127252A (en) Apparatus for the working of wire pieces and the use of such apparatus
JP4291925B2 (ja) 帯状工作物の段階的供給用装置
JP3768472B2 (ja) テープ搬送装置
JP2890333B2 (ja) リードフレームの搬送装置
PL120624B1 (en) Apparatus for joining together the ends of shoe-strings on a shoe-string making machinedlja shnurovanija
JPS627697B2 (enrdf_load_stackoverflow)
JP2512447Y2 (ja) 紙葉類集積結束装置
US1330122A (en) Machine for forming nut-blanks
US1842189A (en) Production of box or container parts with neck inserts
JP2551769Y2 (ja) 紙葉類結束装置
US1750142A (en) Link-welding machine
JP3824839B2 (ja) リードフレームグリッパ
US2852842A (en) Method of forming and applying clasps to envelopes
US1479870A (en) Chain-making machine