JPS6066879A - Semiconductor device for optical communication - Google Patents

Abstract

PURPOSE:To prevent the malfunction due to noises by a method wherein a photo receiving element is shielded with a conductive layer. CONSTITUTION:A shielding conductive layer 38 is formed on the inner surface of one of apertures 33 and 34 bored in a ceramic substrate 31, and a ceramic substrate 32 is fixed on the back of the substrate 31. The photo receiving elements 30 are fixed at the positions corresponding to the apertures 33 and 34 in the upper part of the substrate 32. The shielding conductive layer 39 is formed so as to cover the front of the substrate 32, and the shielding conductive layer 40 is formed so as to cover the back. During operation, an emitted light is radiated from a photo transmitting window 36 and then transferred through an optical fiber. The transmitted light from the other optical fiber comes in from a photo transmitting window 37 and is then supplied to the element 30.

Description

DETAILED DESCRIPTION OF THE INVENTION This article relates to a semiconductor device for use in tS optical communication.

[Invention j. +<δ1, J's apostasy and its problems] With light betrayal (Ko, 1♂''”1: award. LI for LED (gugo, fi. Dimade) that converts spirit mail to light faith) A PD (photodiode) or A that converts the light emitting power of a laser diode (laser diode) into an electrical one
PD (Avalanche 7 1st diode) is connected to [b, both V, ij: songs are connected with optical fiber (7 is the common word). S:, m6 shop i# II!・For the condensation that exchanges this message, Jl61, light emitting te9 and diel÷
Similarly, connect the light-emitting element and the light-receiving element at the other end, and use 511' fiber between the light-emitting element and the light-receiving element and between the light-emitting element and the light-emitting element at both ends. Join.

These lights (-1, 1, 1, 2, 3, 3, 3, 3, 3, 3, 3, 3, 3, 3, 3, 3, 4, 5, 4, 5, 5, 6, 5, 1, 5, 1, 2, 1, 2, 1, 2, 1, 2, 1, 2, 1, 2, 1, 5, 1, 5, and 1, respectively, as shown in Figure 1).
1. i qjl. After fixing the naps 4 each containing one IC circuit to the lead frame 17-6 and making the prescribed connections with the bonding wires 8, the transmitting optical semiconductor device IK1 molded with transparent glass glue is attached. The power is there. Similarly, the receiver circuit which amplifies and reproduces the light receiving signal and its llX power signal is converted into an IC.
(I also know of an optical semiconductor device V1 for reception molded with +71T plastic.

A bidirectional module for mutually communicating between two inputs 1 using the above-mentioned optical semiconductor device is, for example, as shown in FIGS. 2 and 3, for transmitting and receiving J- y of 0
Glue the semiconductor device for transmission ff?; 18 and the semiconductor device for transmission into the optical fiber I'I glass E-rud l6, which has the four parts 12 and 14 that fit together. Agent 22 is 1.1 constant (2.
The module has the same plastic sales)' 7 6 [Package size 1, so it is easy to connect the IR Jl, and by using a plug with two optical fibers installed in parallel, the connection between the module and the plug is universally possible. It has the advantage of being able to be used in many ways.

However, the above-mentioned bidirectional module (11th order) has a drawback.

■ Semiconductor devices for optical receivers are susceptible to external noise, with weak signals of several hundred nA from the light-receiving element (lambda) being emitted from the light-receiving element. In order to handle several tens of rn A, this basket vi
A miscellaneous task occurs due to the switching of L, and the transmitting half body N='< i= and the proximity device search receiver rod 4Fj jump into the body pass 5.1, and the reception/Tel half body 7. Body device operation type (Zen).

■ The openings for the p4r, z, and q bodies are made of transparent plastic and the moldings are made of transparent plastic.
i'=i: Particularly moisture resistant, c, (Evening: For example, Brerashafunkabst (121'0% 2 ajnl)
So, Kazumoe 1fl and late 1i? 5 Then [, be afraid.

C(), 7' fibers, emitter °C element, receiver
Although it is necessary to match lA&, the emitting L element and the light receiving element are lead ii. 1. Since the mount σj1 is on the lead leaf 1/-A, light Q:Izii is likely to occur due to warping or gradual deformation of the lead leaf 1/-A. Another light year? 'i Since the transmitting semiconductor device and the receiving semiconductor device are individually fixed in the 31φ plastic mold l6, j(
Two optical fibers are installed side by side, and optical axis deviations are likely to occur due to Tl bubbles and tolerances between the plug and the plug.

[Object of the Invention] The object of the present invention is to solve the above-mentioned problems, and in particular to provide a half-barrel body for optical communication that is devised to prevent malfunctions caused by noise. It is to hold 42 times of soro.

[Summary of the invention]

This invention provides the first opening 1 (and the opening 1' of 81 2)!
a first ceramic base plate having a first (r
＞・Second group fixed to y1 of the pyramid part
A light emitting element fixed on a ceramic substrate of 1τ'.L., y-
[;B[:Second ceramic substrate - A light receiving element made of solid ζ1, and the first ceramic! ．． E, 7 is airtightly light controlled on the surface of h, which faces the light emitting element and light receiving element 8 i;! Kinzo ν″j with a toukou in j/Ji
gel, a first shielding quaternary layer formed on the inner surface of at least one of the first and second openings, and a large part of the surface nIj of the second ceramic substrate so as to lead to the gel; 1. The formed second shielding groove N layer covers most of the two surfaces of the second ceramic substrate (i.e. two formed cores).1. In total, for the shield of 3, it is also electric Je) □j and Ka Naru Mitsuyama Nino Shinji Ushiji, I (-coloring'S).

[The Heaven of Invention is 11] The 9th edition of ``This Light'' is 41 as shown in Figure 4. Opening hole 7 of 1: B, ? ;? The second opening 34 is bored out. Both openings T11ζ3. ? ,,
? 4 out of 4 [If one side is 1 series, the second opening 3
On the inner surface of 4, there is an a-shaped container, a metal layer 78 for the shield 1, and a shape 1. knee! ζ is over. Further, on the back side 17ti of the first ceramic base 1 (reverse 3), a ceramic base 32 is firmly attached. The first opening 33 in the upper part
2'y'j 16 L 2 light emitting elements 52
is fixed ζ1, and the receiving element 30 is located at the position 16 corresponding to ≦34 (P,) in the second opening 77 (≦34), and the receiving element 30 is fixed at a fixed height f''12.

A second shielding conductive layer 39 is formed on the surface of the ceramic substrate 32 (rabbit 2) so as to cover most of it, and a third shielding layer 39 is formed on the back surface of the ceramic substrate 32 to cover most of it. The electrical layer 40 is now formed. Further, on the surface of the first ceramic board 31, the light emitting element 52 and the IPj) which are opposite to the Nikki-Koshiko 30 are provided. The periphery of the metal shell 35 having a diameter of 236937 is directly soldered in a gas-tight manner.

Now, during operation, the light C emitted from the light emitting element 52 is
], and the emitted light is transmitted through an optical fiber.

On the other hand, the light is transmitted by another optical fiber to the second light-transmitting window, ? 77)) From the incident U5, the light receiving element 3
0 and is converted into current.

〔Effect of the invention〕

According to this invention, since the light-receiving element 30 is shielded by the electric current, the receiving section (7 is a comparatively large calculation and the current is high-speed Even if the switch is installed adjacent to an intervening transmitter that generates noise, there is no longer a problem with the noise causing the 81' (operation). Because it is manufactured using an airtight seal, the high and low temperature resistance and moisture resistance are significantly improved compared to conventional models molded with plastic. Furthermore, according to the present invention, 5'e; transmission/reception T; [1
Is there one ceramic Z '□? ),? 2, the axis misalignment with the optical fiber can be reduced compared to the case where the optical transmitter and receiver are used separately. [Other Examples] Fig. 5 1 to 10 show a fruit basket 11 of the present invention, which provides the same effects as the above-mentioned embodiment.

First, Figure 8r1.5 shows the weld link 41f being attached to the circumferential ring C5 on the first ceramic base Al 31 [7], and the shell 35 being welded to this weld ring 41.

Next, FIG. 6 shows that the light from the optical transmitter side is transmitted to the optical receiver side in the gap between the shell 35 and the first ceramic substrate 3) between the forward transmitter part and the optical receiver part in FIG. This is an example in which a light-impermeable object 42 is fixed to prevent light from entering.

Next, Fig. 7 shows that the light receiving element 30 outputs the output σt] at the receiving t+2: once missing ■Path 13 is inserted into the opening 34 of the head 2 [・! 1 constant σi]
(Figure 8 is in Figure 7) Initial feed (Part i (
Also, in iii, the circuit element 44 for driving the light-emitting metal element 2 is installed in the [5:4 hole 33 of J]
・lU'C Kingo], history of the second 11'n'k2 Y full 32'< j? This is an example in which the third ceramic shoes 1 (the diaphragm 45 is fixed) are used to connect the wiring provided on the right side.

Next, FIG.
I also used a conductive layer 4G for my nephew on the surface 4.
5;'/, -S integrated circuit element 43 and b
1 Determined Zl te shi')ru I'yl and many ro. In the above-mentioned Figs. 7 and 78, the optical element 30 and the receiving phase concentrating circuit element 43 are fixed in the -N hole,
J)3Ui1. As the speed of the chi increases, the reception
λ, (electromagnetic noise from the circuit element 43 returns through the surface of the light-receiving element 30. J Niri, both for light receiving element 30 and reception!;'r circuit Seiko 4
,? Since l+4j also follows lI, it is even more stable (7
Finally, FIG. 10 shows that the shell is composed of a first shell 48 that has a first transparent light 50 and a second shell 49 that has a second transparent light 50. This is an example of a cow that fell to maturity.

+1. IM! 17r-j f;i', i, iP,
fi Fffi FFJ & 711 figure (well, the conventional light!
A plane showing the 9-trust raw conductor frame S [゛h1 Figures 2 and 3 are a front view and a cross-sectional view showing an example of a module for optical communication A8,
Valley 14 (Light 1 (') according to one implementation 911 of this invention
Cross-sectional views of the semi-barrier 1 for Iij (not showing the parts), Figures 5 to 10
FIG. 1 is a sectional view showing an embodiment of the present invention.

, 90... Light-receiving element, 31... First ceramic base l1,'? 2... second ceramic substrate, 33...
- First opening, 34... Second opening, 35... Shell, 36.37... Transparent window, 38... First shielding conductive layer, 39... Second shield J[1 general purpose layer, 40...Third shield groove% layer, 5Z...Light emitting element.

Applicant's agent: Patent attorney Takehiko Suzue Figure 1 ? 4th N Figure 5 direction Figure 6 2

Claims (1)

[Scope of Claims]
Ceramics!゛Iν and this first ceramic￥,
A second ceramic base 4 which has been hardened in this manner,
1 and 1 are fixed on the light emitting element fixed on the second ceramic substrate corresponding to the openings 1 and 1 above, and on the second ceramic plate corresponding to the second openings 1 and 1, respectively. The first ceramic plate is airtightly sealed to the surface of the plate, and a positive light source is applied to the light emitting element and the light receiving element facing the light emitting element and the light receiving element. a shell made of scrap metal having the above-mentioned
At least one of the openings of No. 2 ij'; the first shielding layer, which has been completely formed on the surface of the second ceramic substrate; Formed to cover most of the back surface of the second ceramic substrate ζ)1. The shielding groove 1 of the shield 3 is provided with a layer.
This device F'. (2) Place a receiver aJr circuit/circuit element connected to the light-receiving element in a drowsy manner on the second ceramic cap corresponding to the second GFI hole. 'iJ Claims No. (1) Q, j; j:'s original tracing semiconductor device 0 (3) Providing a third opening in the first ceramic substrate Q
F, a fourth shielding 2A'i82PJ is formed on the inner surface of this ε33 opening Ht+, and the light receiving plate is placed on the 5゛22 ceramic substrate, which is contrasted with -1 to the third opening. 1. A half-body mounting device for a nine-tone body according to claim 1, wherein a receiving integrated circuit element electrically connected to the element is fixed. (4) The shell faces the light emitting element τ1i]
Claims (1) to (1) are comprised of a first shell having a first light-transmitting window on the surface thereof, and a second shell having a second light-transmitting window on the surface facing the light-receiving element. Semi-26 optical communication system h0 described in paragraph (3)