JPS6061738U - Power transistor mounting structure - Google Patents
Power transistor mounting structureInfo
- Publication number
- JPS6061738U JPS6061738U JP1983151816U JP15181683U JPS6061738U JP S6061738 U JPS6061738 U JP S6061738U JP 1983151816 U JP1983151816 U JP 1983151816U JP 15181683 U JP15181683 U JP 15181683U JP S6061738 U JPS6061738 U JP S6061738U
- Authority
- JP
- Japan
- Prior art keywords
- power transistor
- case
- flange
- connector
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のパワートランジスタ実装構造を示す一部
断面図、第２図は本考案によるパワートランジスタ実装
構造を示す一部断面図、第３図は接続子の一部断面図で
ある。
１・・・パワートランジスタ、２・・・リード端子、２
ｂ・・・半田付け、３・・・放熱フィン、４・・・プリ
ント板、５・・・絶縁シート、１１・・・ラグ端子、１
２・・・絶縁ブツシュ、２０・・・接続子、２１・・・
接続子頭部、２２・・・接続子リード部、２２ｂ・・・
半田付け、２３・・・接続子スリーブ。FIG. 1 is a partial sectional view showing a conventional power transistor mounting structure, FIG. 2 is a partial sectional view showing a power transistor mounting structure according to the present invention, and FIG. 3 is a partial sectional view of a connector. 1...Power transistor, 2...Lead terminal, 2
b...Soldering, 3...Radiating fin, 4...Printed board, 5...Insulating sheet, 11...Lug terminal, 1
2... Insulating bushing, 20... Connector, 21...
Connector head, 22...Connector lead part, 22b...
Soldering, 23... Connector sleeve.
Claims (1)
して３つの電極のうち１つを該ケースに接続した構造の
パワートランジスタを放熱フィンと共にプリント板に実
装する構造において、導電性の頭部と、該頭部に接続さ
れている導電性リード部と、該リード部にその一部を被
覆する如く固着され外周面に雄ねじが形成された絶縁性
スリーブとを有するボルト状の接続子を、前記ケースの
フランジの取付ボルト用の孔に該接続子の頭部がケース
フランジと接触されるように挿入すると共に該接続子の
スリーブ部分を放熱フィンに螺入してパワートランジス
タと放熱フィンとを該両者間・ に絶縁シートを介在さ
せた状態で一体的に組み付け、且つ該接続子のリード部
先端をプリント板に半田付けにより接続固定したことを
特徴とするパワートランジスタの実装構造。In a structure in which a power transistor having a structure in which a transistor element is packaged in a flange-mounted case and one of three electrodes is connected to the case is mounted on a printed board together with a heat dissipation fin, a conductive head and the head A bolt-shaped connector having a conductive lead part connected to the flange of the case and an insulating sleeve fixed to the lead part so as to partially cover the lead part and having a male thread formed on the outer peripheral surface is attached to the flange of the case. Insert the head of the connector into the mounting bolt hole so that it is in contact with the case flange, and screw the sleeve part of the connector into the heat radiation fin to connect the power transistor and the heat radiation fin between the two. A power transistor mounting structure characterized in that the power transistor is assembled integrally with an insulating sheet interposed therebetween, and the lead end of the connector is connected and fixed to a printed board by soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983151816U JPS6061738U (en) | 1983-09-30 | 1983-09-30 | Power transistor mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1983151816U JPS6061738U (en) | 1983-09-30 | 1983-09-30 | Power transistor mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6061738U true JPS6061738U (en) | 1985-04-30 |
Family
ID=30336320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1983151816U Pending JPS6061738U (en) | 1983-09-30 | 1983-09-30 | Power transistor mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6061738U (en) |
-
1983
- 1983-09-30 JP JP1983151816U patent/JPS6061738U/en active Pending
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