JPS58109287U - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JPS58109287U JPS58109287U JP556582U JP556582U JPS58109287U JP S58109287 U JPS58109287 U JP S58109287U JP 556582 U JP556582 U JP 556582U JP 556582 U JP556582 U JP 556582U JP S58109287 U JPS58109287 U JP S58109287U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- component mounting
- mounting device
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insulating Bodies (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例を示す縦断側面図、第２図はその組立状
態を示す縦断側面図、第３図はこの考案の一実施例を示
す縦断側面図、第４図はその組立状態を示す縦断側面図
である。
１゛・・・・・・電子部品、２・・・・・・外筐、３・
・・・・・絶縁シート、６・・・・・・放熱板、８二１
０・・・・・・取付孔、１２・・・・・・取付ボルト、
−１５・・・・・・絶縁ブツシュ、１６・・・・・・孔
。Fig. 1 is a longitudinal side view showing a conventional example, Fig. 2 is a longitudinal side view showing its assembled state, Fig. 3 is a longitudinal side view showing an embodiment of this invention, and Fig. 4 is its assembled state. FIG. 1゛...Electronic parts, 2...Outer casing, 3.
...Insulation sheet, 6 ... Heat sink, 821
0...Mounting hole, 12...Mounting bolt,
-15... Insulating bushing, 16... Hole.
Claims (1)
トと放熱板、とに少なくともこれら三者を結合するため
の取付ボルトを貫通する取付孔を形成し、前記放熱板の
前記取付孔に前記取付ボルトの太さと略等しい孔を有し
て前記放熱板と前記取付ボルトとの間を電気的に絶縁す
る硬質の絶縁ブツシュを嵌合したことを特徴とする電子
部品取付装置。A mounting hole is formed through the outer casing, an insulating sheet, and a heat sink of electronic components made of semiconductors, which are stacked one after another, through which a mounting bolt for coupling at least these three members is formed, and the mounting hole of the heat sink is provided with the mounting hole. An electronic component mounting device, characterized in that a hard insulating bushing having a hole approximately equal to the thickness of the mounting bolt and electrically insulating between the heat sink and the mounting bolt is fitted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP556582U JPS58109287U (en) | 1982-01-18 | 1982-01-18 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP556582U JPS58109287U (en) | 1982-01-18 | 1982-01-18 | Electronic component mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58109287U true JPS58109287U (en) | 1983-07-25 |
Family
ID=30018365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP556582U Pending JPS58109287U (en) | 1982-01-18 | 1982-01-18 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58109287U (en) |
-
1982
- 1982-01-18 JP JP556582U patent/JPS58109287U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58109287U (en) | Electronic component mounting device | |
| JPS6018550U (en) | Heat dissipation structure | |
| JPS60185340U (en) | Insulating sheet for transistors | |
| JPS60106347U (en) | Transistor insulation fixed structure | |
| JPS59115660U (en) | High voltage insulation structure for semiconductor devices | |
| JPS59177954U (en) | Semiconductor device mounting equipment | |
| JPS58149024U (en) | power bus | |
| JPS58153450U (en) | Output transistor mounting structure | |
| JPS5899891U (en) | Cooling structure of printed circuit board | |
| JPS59145044U (en) | Insulation structure of electrical parts | |
| JPS58153472U (en) | enamel board | |
| JPS5931251U (en) | Power transistor heat sink mounting structure | |
| JPS5937742U (en) | Heat dissipation structure | |
| JPS5965542U (en) | Power transistor insulation mounting device | |
| JPS5834744U (en) | Power diode mounting structure | |
| JPS5911451U (en) | radiator | |
| JPS60109333U (en) | transistor assembly | |
| JPS58182369U (en) | Lead wire connection device | |
| JPS6039251U (en) | Cooling structure for electronic components | |
| JPS5877084U (en) | circuit board | |
| JPS5976072U (en) | terminal device | |
| JPS60125746U (en) | semiconductor unit | |
| JPS59111092U (en) | radiator | |
| JPS59149620U (en) | Capacitor with safety device | |
| JPS5831415U (en) | Plate nuts for insulation boxes |