JPS6059562U - Mounting structure of high-density circuit package - Google Patents
Mounting structure of high-density circuit packageInfo
- Publication number
- JPS6059562U JPS6059562U JP15157383U JP15157383U JPS6059562U JP S6059562 U JPS6059562 U JP S6059562U JP 15157383 U JP15157383 U JP 15157383U JP 15157383 U JP15157383 U JP 15157383U JP S6059562 U JPS6059562 U JP S6059562U
- Authority
- JP
- Japan
- Prior art keywords
- circuit package
- mounting structure
- density circuit
- matrix
- density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来ρ高密度回路パッケージを示す正面図、第
２図は上記回路パッケージを実装するプリント基板を示
す平面図、第３図は従来の高密度回路パッケージの実装
構造を示す断面説明図、第４図は本考案による高密度回
路パッケージの実装構造を示す断面説明図、第５図は上
記回路パッケージを実装するプリント基板を示す平面図
、第６図はプリント基板上に高密度回路パッケージを搭
載する状態を示す断面説明図、第７図は本考案の変形例
を示す断面説明図である。
１０・・・プリント基板、１１・・・信号ピン、１１ａ
・・・上端部、１２・・・高密度回路パッケージ、１３
・・・スルーホール、１４・・・ハンダメッキ、１５・
・・フラ、ンジ、１６，１６’・・・接続パッド、１７
，１７’…ハンダ。Fig. 1 is a front view showing a conventional ρ high-density circuit package, Fig. 2 is a plan view showing a printed circuit board on which the circuit package is mounted, and Fig. 3 is a cross-sectional explanatory diagram showing the mounting structure of a conventional high-density circuit package. , FIG. 4 is a cross-sectional explanatory diagram showing the mounting structure of a high-density circuit package according to the present invention, FIG. 5 is a plan view showing a printed circuit board on which the circuit package is mounted, and FIG. FIG. 7 is a cross-sectional explanatory view showing a modified example of the present invention. 10... Printed circuit board, 11... Signal pin, 11a
. . . Upper end portion, 12 . . . High-density circuit package, 13
...Through hole, 14...Solder plating, 15.
...Fla, ji, 16,16'...Connection pad, 17
,17'...Solder.
Claims (1)
ト基板の上記スルーホールに入出力用の多数本の信号ピ
ンをそれぞれ挿入してノ１ンダ付けし、上記プリント基
板のスルーホールに対応する裏面の位置にマトリクス状
に接続パッドを形成した高密度回路パッケージをそれぞ
れの接続パ、ラドが上記信号ピンの上端部に接触するよ
うに搭載したことを特徴とする高密度回路パツケニジの
実装構造。A large number of signal pins for input and output are inserted into the through holes of the printed circuit board, which has through holes formed in a matrix on the board surface, and are connected by soldering. A mounting structure for a high-density circuit package, characterized in that a high-density circuit package having connection pads formed in a matrix at positions is mounted such that each connection pad and pad are in contact with the upper end of the signal pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15157383U JPS6059562U (en) | 1983-09-30 | 1983-09-30 | Mounting structure of high-density circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15157383U JPS6059562U (en) | 1983-09-30 | 1983-09-30 | Mounting structure of high-density circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6059562U true JPS6059562U (en) | 1985-04-25 |
Family
ID=30335845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15157383U Pending JPS6059562U (en) | 1983-09-30 | 1983-09-30 | Mounting structure of high-density circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059562U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001043188A1 (en) * | 1999-12-06 | 2001-06-14 | Ibiden Co., Ltd. | Electronic part module, method of producing the same, etc. |
-
1983
- 1983-09-30 JP JP15157383U patent/JPS6059562U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001043188A1 (en) * | 1999-12-06 | 2001-06-14 | Ibiden Co., Ltd. | Electronic part module, method of producing the same, etc. |
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