JPS6056087A - High-speed plating device - Google Patents

Abstract

PURPOSE:To increase plating rate while maintaining high quality by providing a pair of front and rear hollow cylindrical anodes having semi-cylindrical inside surfaces which attach and detach to and from each other in forward and backward directions between right and left holders which sandwich both ends of a bar-shaped material to be treated. CONSTITUTION:A titled device consists of right and left holders 10, 20 which sandwich both edns of a bar-shaped material (a) to be treated and use the material (a) as a cathode and a pair of front and rear semi-cylindrical anodes 30 having semi-cylindrical inside surfaces which attach and detach to and from each other in forward and backward directions between the holders 10 and 20. A cylindrical plating chamber 40 in the center of which the material (a) is inserted is formed by the semi-cylindrical inside surfaces 33 with each other while both anodes 30 are joined to each other. The only requirement for the holders 10, 20 is therefore to assure the slight right and left movement necessary for clamping and the only required for the anodes 30 is to assure forward and backward movement to open the same to the extent of allowing disengagement of the material (a) from above.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a high-speed plating method that causes a plating solution to flow along the longitudinal direction of the rod-shaped object to perform plating on the outer periphery of the object. Related to plating processing equipment.

In order to improve the plating speed, it is possible to increase the current density on the electrode surface, but there is a limit to maintaining a high quality finish. Therefore, as a method for improving the plating speed while maintaining high quality, there is a method of moving the surface to be plated and the plating solution at a relatively high speed.

There is a method in which this method is applied to plating a rod-shaped object, in which the plating solution is caused to flow along the length of the object, but conventional high-speed plating equipment of this type As disclosed in Japanese Patent Application Laid-Open No. 57-143487, a pair of left and right holders that hold a rod-shaped object to be processed are arranged on both sides of a fixed cylindrical plating chamber so that they can be passed through the plating chamber by an air cylinder, and the A pair of holders are moved along the longitudinal direction of the rod-shaped object to one outside of the cylindrical plating chamber, the object to be processed is held between the pair of holders, and then moved into the plating chamber again to hold the object to be processed. The object is placed in the middle of the plating chamber, and the plating solution is flowed into the plating chamber along the length of the object to plate the surface of the object. However, with such a configuration, it is necessary to pass one holder through the plating chamber and move its tip to the other side each time the object to be processed is attached or removed.

For this reason, it is necessary to ensure the moving distance of the holder, so an air cylinder with a long stroke is required, which, together with the length of the object to be treated, makes the device long in the left and right direction, making it difficult to organize the device and reducing the device area. There is a major drawback. In addition, since the workpiece is mounted at a distance from the plating chamber and then transferred to the plating chamber, it is not possible to check the actual state of the workpiece being held in the plating chamber, and the workpiece may be deviated from the inside of the plating chamber. Even if the objects to be processed are washed away or, in some cases, fall off during transportation, they tend to be left unattended. Furthermore, since the interior of the plating chamber is always closed, inspection and maintenance of the interior of the chamber is difficult.

The present invention aims to provide a high-speed plating apparatus that eliminates the above-mentioned conventional drawbacks, and includes left and right holders that hold both ends of a rod-shaped object to be processed and use the object as a cathode, and a , consisting of a pair of front and rear hollow cylindrical anodes having semi-cylindrical inner surfaces that approach and separate in the front-rear direction, and in a state in which the re-anodes are joined, the object to be processed passes through the center of the semi-cylindrical inner surfaces. A plating chamber is formed, and the plating solution is made to flow in the longitudinal direction of the object to be treated, so that the movement of the holder along the longitudinal direction of the rod is shortened as much as possible. It is possible to perform a clamping operation on the object to be processed at the plating processing position, thereby ensuring the retention of the object, and furthermore, it is possible to vertically divide the interior of the plating chamber to facilitate inspection and maintenance of the inner surface.

An embodiment of the invention will be described with reference to the accompanying drawings.

Referring to FIG. 1, a rectangular tank 2 communicating with a circulation pump 4 is provided inside the device frame l, and a rectangular tank 2 communicating with a circulation pump 4 is provided at the top of the frame l at the left position in the figure. A clamping cylinder 5 with a small stroke on the left and right sides is attached, and a moving bar 11 supporting a moving holder 10, which will be described later, is fixed to the rod end. Further, a fixed holder 20 is mounted on the device frame lO, facing the movable holder lO on the left and right sides, and with a mounting gap S for the rod-shaped object a placed therebetween.
Fixed. As will be described later, the fixed holder 20 communicates with the circulation pump 4 through a conduit 6 with a diaphragm valve 7 interposed therebetween. supplied within.

Further, a pair of front and rear hollow semi-cylindrical anodes 30, 30, which will be described later, are arranged before and after the mounting gap S of the device frame l,
They are provided at the front and rear of the device frame 1, respectively, and are connected to the ends of extrusion cylinders 8, 8 with the direction of expansion and contraction of the rods being the front and back direction. The semi-cylindrical anode 30.30 is connected to the tank 2.
A guide bar 9 extending across the upper portion reliably guides the forward and backward movement of the extrusion cylinder 8.8 as it expands and contracts.

In addition, on the left side of the tank 2, the movable holder 1
An auxiliary tank 2a is provided directly under the moving bar 11 in order to collect the plating solution that overflows as the plating solution moves.
An auxiliary tank 2 b is placed directly below the moving bar 31 of 0.30 mm,
2 b i< provided.

The movable holder 10. The fixed holder 20 and the semi-cylindrical anode 30.30 will be explained in more detail with reference to FIGS. 2-4.

The movable holder 10 has a small-diameter rod shape that continues to the tip of the movable bar 11, and a hollow rod-shaped object to be processed a is attached to the tip of the rod.
A conical beak piece 12 is formed to fit into the end of the conical beak, and a liquid receiving cover 13 is fixed to the periphery of the conical beak piece 12 with the opening surface facing inside. Further, a Teflon layer 14 is formed on the circumferential surfaces of the movable holder 10 and the movable bar 11 to electrically insulate the circumferential surfaces and prevent the neck from being plated.

The fixed holder 20 has a two-stage cylindrical shape as shown in FIG.
An annular opening 22 communicating with the internal cavity of 1b is provided in the left-right direction. In the internal space of the large-diameter rear cylinder 21b of the fixed holder 20, the conduit passage 6 supported on the wall surface of the tank 2 is provided.
The end of the pipe 23 is fitted in such a manner that the inner diameter of the flow passage 24 is equal to the outer circumferential diameter of the annular opening 22, and
A conical rectifying cone 25 whose base diameter is equal to the inner circumferential diameter of the annular opening 22 is screwed onto the inner surface of the small-diameter front cylinder 21a with its sharp end facing backward, and is sent from the conduit 6. The plating solution flows through the flow path 24 without causing turbulence.
The water flows into the annular opening 22 from the inside. Further, the inner circumferential diameter of the annular opening 22 is made approximately equal to the outer diameter of the object to be processed a, and the outer circumferential diameter is made approximately equal to the inner diameter of the plating chamber 40, which will be described later, so that the plating that flows out from the annular opening 22 The liquid is also prevented from causing turbulence within the plating chamber 40.

Further, at the tip of the small diameter front cylinder 21a, a beak piece 26 is formed to protrude and fit tightly into the inner end of the rod-shaped object a at a position that matches the conical beak piece 12 of the movable holder 10 on the left and right sides. .

The fixed holder 20 is supplied with power from the power supply section 27,
Applied to the cathode side. Further, a Teflon layer 28 is formed on the outer periphery of the fixed holder 20 and the inner surface of the annular opening 22, thereby insulating the surface and preventing the surface from being plated.

To explain the semi-cylindrical anode 30.30, on the inner surface of the semi-cylindrical anode 30.30, there is a semi-cylindrical exposed electrode plate 32 formed from an insoluble metal such as platinum or lead. The semi-cylindrical anodes 30.30 are screwed onto the top and bottom of the anodes 30.30 so as to be replaceable, thereby forming semi-cylindrical inner surfaces 33.33 on the semi-cylindrical anodes 30.30, respectively. In addition, at the right end part, when the extrusion cylinders 8, 8 are in the extended state,
A large-diameter inner surface 34 is formed that tightly fits onto the small-diameter front cylinder 21a of the fixed holder 20. Furthermore, a shielding gasket 35.35 is fixed to one of the semi-cylindrical anodes 30.30 along the longitudinal direction of the rod-shaped object a on the upper and lower vertical surfaces thereof, and the extrusion cylinder 8.8 is in an expanded state. As shown in FIG.
A sealed plating chamber 40 is formed inside.

The exposed electrode plate 32 can be easily replaced with an optimal one corresponding to the outer diameter of the rod-shaped object a after the semi-cylindrical anodes 30 and 30 are separated from each other by contraction of the extrusion cylinders 8, 8. This allows the distance between the semi-cylindrical inner surface 33 and the surface of the rod-shaped object 8 to be maintained evenly and optimally, and when the semi-cylindrical inner surface 33 becomes worn, it can be replaced as appropriate. This makes it possible to always provide optimal plating conditions.

Note that the exposed electrode plate 32 is omitted, and a semi-cylindrical anode 30.30 is used.
The semi-cylindrical inner surface 33 may be formed directly on the inner surface 33.

The operation of the above embodiment will be explained.

Move the rod-shaped object a to the holder 10. Fixed holder 20
In order to clamp the workpiece in the mounting gap S, the clamping cylinder 5 is contracted in advance, the movable holder 10 is moved back a little, and one end of the rod-shaped workpiece a is fitted into the beak piece 26 of the fixed holder 20 in the mounting gap S. Then, the clamping cylinder 5 is operated again to extend the conical beak piece 12 of the movable holder 10 inward, and the conical beak piece 12 is inserted into the other end of the rod-shaped workpiece a. Move the holder 10.
It is held by a fixed holder 20. Thereafter, the rods of the extrusion cylinders 8, 8 are expanded so that the upper and lower vertical surfaces of the semi-cylindrical anode 30, 30 are brought into contact with the gasket 35.
35, and a plating chamber 40 is formed therein.

When the circulation pump 4 is activated after power is applied to the fixed holder 20 and the semi-cylindrical anode 30, the plating solution in the tank 2 flows from the conduit 6 into the flow path 24, and is rectified as described above. The plating solution is rectified by the cone 25 and flows out from the annular opening 22 into the plating chamber 40 without generating turbulence. The plating solution in the plating chamber 40 is applied to the rod-shaped object a.
The liquid flows along the length of the object to be treated, collides with the liquid receiving cover 13 and falls, and is collected in the tank 2. In this flowing state, the rod-shaped object a, which is supplied with electricity by the fixed holder 20 and becomes a cathode, is subjected to a plating process on its outer peripheral surface.

Although this embodiment is configured to be applied to a hollow rod-shaped object a, in order to apply it to a non-hollow rod-shaped object a,
The structures of the beak pieces 12 and 26 may be shaped so that they can be fitted onto both ends of the rod-shaped object a, that is, the objects to be treated that can be applied to the present invention may be rod-shaped, and other differences in shape may be used. It is not limited by.

As clarified from the above description, the present invention is directed to the left and right holders 10 and 20 that hold both ends of the rod-shaped workpiece a.
A pair of front and rear hollow cylindrical anodes 30.30 having a semi-cylindrical inner surface 33 that approaches and separates in the front-rear direction is provided between them, and in a state where both the anodes are joined, the semi-cylindrical inner surface 33. Since the cylindrical plating chamber 40 through which objects are inserted through the center is formed, the left and right holders 1O220
The semi-cylindrical anode 30, 30 only needs to be able to move forward and backward to the extent that the rod-shaped workpiece a can be loaded and unloaded from above. The movement stroke of each device accompanying the loading and unloading of the object a is made as small as possible, the device is small and well-organized, and the installation area of the device can be reduced. installation at the treatment location,
Since the actual holding state can be confirmed, various troubles related to the holding of the rod-shaped workpiece a can be eliminated in advance.Furthermore, since the plating chamber 40 is vertically divided, the inside of the plating chamber 40 can be checked. This has excellent effects such as ease of inspection and maintenance.

[Brief explanation of drawings]

The accompanying drawings show embodiments of the present invention, and Fig. 1 is a schematic plan view of the device, Fig. 2 is a longitudinal sectional side view of the main part, and Fig. 3 is Fig. 2A-
FIG. 4 is a sectional view taken along line A and FIG. 4 is a sectional view taken along line B--B in FIG. 2; Tank 5; Cylinder for clamp 6; Conduit line
lO; moving holder 12; beak piece 20; fixed holder 22; annular opening 25; rectifying cone 26; beak piece 3
0, 30, semi-cylindrical anode 32: exposed electrode plate 33: semi-cylindrical inner surface 40; plating chamber

Claims (1)

[Claims] Left and right holders that hold both ends of a rod-shaped object to be processed and use the object as a cathode, and a pair of front and rear hollow semi-cylindrical anodes each having a semi-cylindrical inner surface that approaches and separates in the front-rear direction between the holders. With the re-anode bonded, a cylindrical plating chamber through which the object to be processed passes through the center is formed by the semi-cylindrical inner surfaces, and a plating solution is introduced into the plating chamber along the longitudinal direction of the object to be processed. High-speed plating processing equipment characterized by fluidizing