JPH07252686A - Method and device for surface treatment - Google Patents

Abstract

PURPOSE:To simplify a prepn. operation by simplifying the structure of a device for subjecting the inside surface of a hollow work to a surface treatment, such as plating, while making it possible to execute this surface treatment at a high speed. CONSTITUTION:A treating vessel 10 is provided with a liquid inflow section 13 and a liquid outflow section 14. A plating liquid L forcibly fed by a pump 22 is admitted into a cylinder bore W11 of the work W1 from this liquid inflow section 13 in the state of immersing the work W1 into the treating liquid in this treating vessel 10. The plating liquid L past the cylinder bore W11 is discharged from the liquid outflow section 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment method and apparatus for applying a surface treatment such as plating to the inner surface of a hollow work such as an engine cylinder block.

[0002]

2. Description of the Related Art Conventionally, various surface treatment techniques have been known in which a surface to be treated of a workpiece is plated, and as a pre-process thereof, degreasing, etching, alumite and the like are performed. For example, as such a technique, there is known a technique in which a work is immersed in a bath in which a treatment liquid such as a plating liquid is stored to perform a plating treatment or the like. However, with this method, it is difficult to speed up the plating process and the like.

Therefore, recently, there has been considered a technique for increasing the speed of the surface treatment by performing the surface treatment while flowing the treatment liquid onto the surface to be treated of the work. Particularly, as a technique for plating the inner surface of a hollow work such as an engine cylinder block, for example, Japanese Patent Laid-Open No.
There is one such as shown in Japanese Patent No. 222589. That is, in the one disclosed in this publication, a plating solution introducing pipe, a cylindrical electrode, and the like are provided on a support that supports a cylinder block of an engine as a work, and the cylinder block is installed on the support. While positioning the electrode in the cylinder bore, covering the cylinder bore with a lid to seal this part, in this state, the plating solution sent by the pump is sent from the plating solution introduction pipe into the cylinder bore. The engine cylinder and the electrodes are energized.

According to this method, the plating solution sent into the cylinder bore flows between the circumferential surface of the cylinder bore and the electrode, and flows out from the lower outlet through the upper portion of the cylinder bore and the flow path inside the electrode. By thus flowing the plating solution between the surface to be plated and the electrode, it is possible to increase the current density and perform high-speed plating.

[0005]

By the way, according to the above-mentioned conventional method, when the inner surface of the hollow work is subjected to surface treatment such as plating at high speed, the sealing member mounted on the work. There is a problem that the structure of the power supply member and the power supply member becomes complicated, and the preparation work such as mounting these members on the work becomes troublesome.

A specific description will be given by taking as an example the case where high speed plating is applied to the cylinder bore peripheral surface of an engine cylinder block. In the plating process, it is necessary to seal the plating solution flowing in the cylinder bore so as not to leak outside. In the case of a multi-cylinder cylinder block, it is necessary to seal each cylinder bore, and when an exhaust port, a scavenging port and the like communicate with the cylinder bore as in a cylinder block of a two-cycle engine, these must be sealed. Therefore, the structure of the sealing device and the like becomes complicated, and the sealing work becomes troublesome, and simplification of these is desired. In addition to this, simplification of mounting work of a power feeding member for energizing the work is also required.

In view of the above circumstances, the present invention allows surface treatment such as plating to be performed at high speed,
It is an object of the present invention to provide a surface treatment method and apparatus which can simplify the structure and simplify the preparation work.

[0008]

The invention according to claim 1 is
A surface treatment method for performing a surface treatment on the inner surface of a hollow work, wherein the work is installed in a treatment tank that stores a treatment liquid,
With the work soaked in the treatment liquid in the treatment tank, the treatment liquid pressure-fed by the treatment liquid feeding pump flows into the hollow portion of the work from the liquid inflow portion provided in the treatment tank. Then, the processing liquid flowing through the hollow portion of the work is caused to flow out from the liquid outflow portion provided in the processing tank.

According to a second aspect of the present invention, in the method according to the first aspect, the plating solution is used as the treatment solution, and the plating electrode is placed in the hollow portion of the workpiece installed in the treatment tank. It is designed to allow the inflow and outflow of.

According to a third aspect of the present invention, in the method according to the second aspect, the work tank is sealed after the work is installed in the treatment tank.

According to a fourth aspect of the present invention, in the method according to the second aspect, the plating solution is forcibly sucked out from the solution outflow portion.

According to a fifth aspect of the present invention, in the method according to the first aspect, the anodizing treatment liquid is used as the treatment liquid, and the anodizing treatment electrode is provided inside the cylindrical portion of the workpiece installed in the treatment tank. In the arranged state, the processing liquid is made to flow into the hollow portion of the work from one end side and flow out into the processing tank from the other end side.

According to a sixth aspect of the present invention, there is provided a surface treatment method for plating an inner surface of a hollow work, wherein the work is installed on a main body of a processing apparatus having a liquid inflow portion, and plating is performed in the hollow portion of the work. The electrode for use is positioned, and the pressing lid having the power supply part to the work and the liquid outflow part is pressed against the upper end of the work, and the plating solution pumped by the pump for feeding the plating solution is supplied from the solution inflow part. The plating solution is made to flow into the hollow part of the work and the plating solution passing through the hollow part of the work is allowed to flow out from the liquid outflow part.

According to a seventh aspect of the present invention, there is provided a surface treatment apparatus for performing plating on the inner surface of a hollow work, comprising a treatment tank for storing a plating solution, and the work is fixed in the treatment tank. A work installation part that supports the position, a plating electrode that is inserted into the hollow part of the work, and a plating solution that is connected to a pump for feeding the plating solution, and the plating solution is installed in the hollow part of the work that is installed in the treatment tank. And a liquid outflow part for outflowing the plating solution that has passed through the hollow part of the work.

According to an eighth aspect of the present invention, in the apparatus according to the seventh aspect, a lid member for sealing the processing bath is provided at the upper end of the processing bath so as to be opened and closed.

According to a ninth aspect of the present invention, in the apparatus according to the eighth aspect, the lid member is equipped with a power feeding portion for the work.

According to a tenth aspect of the present invention, in the apparatus according to the seventh aspect, the liquid inflow portion and the liquid outflow portion are provided in the processing tank, and a passage communicating with the liquid inflow portion is provided on the discharge side of the plating liquid feeding pump. And a passage connected to the liquid outflow portion is connected to the inflow side of the pump.

The invention according to claim 11 is a surface treatment apparatus for anodizing an inner surface of a hollow work, comprising a treatment tank for storing an anodizing solution, and the treatment tank comprises
Installed in the processing tank, connected to a work setting part that supports the work at a fixed position in the processing tank, an anodizing electrode inserted in the hollow part of the work, and a pump for feeding the processing liquid. A liquid inflow portion for inflowing the processing liquid from below is provided in the tubular portion of the workpiece to be processed, and a liquid outflow portion for outflowing the processing liquid passing through the tubular portion from above into the processing tank.

According to a twelfth aspect of the present invention, there is provided a surface treatment apparatus for plating an inner surface of a hollow work, the treatment apparatus main body having a work setting portion on an upper surface thereof, and the treatment apparatus main body being pressed against the treatment apparatus main body. The processing apparatus main body is provided with a pressing lid that comes into contact with the upper end of the work, and the electrode inserted into the hollow portion of the work and the plating solution feeding pump are connected to the plating solution in the hollow portion of the work. And a liquid inflow part for guiding
On the other hand, the lid member is integrally provided with a liquid outflow part for outflowing the plating solution through the hollow part of the work and a power supply part of the work.

[0020]

According to the method described in claim 1, the treatment liquid pumped by the pump flows into the hollow portion of the work from the liquid inflow portion, and the treatment liquid flows in the work, whereby the surface treatment is performed. Will be faster. Moreover, since the above-mentioned processing is performed in a state where the work is immersed in the plating solution in the processing tank, the work need not be sealed.

A method according to claim 2, wherein this method is applied to a plating treatment.
According to the described method and the apparatus according to the seventh aspect for carrying out this method, high-speed plating is effectively performed without the need for sealing the work.

According to the method of the third aspect and the apparatus of the eighth aspect, the fluidity of the plating solution in the hollow portion of the work is closed by sealing the processing tank even when the port of the work is not sealed. Is increased. Further, according to the apparatus of claim 9, the work of connecting the power feeding portion to the work is simplified.

According to the method of claim 4 and the device of claim 10, the fluidity of the plating solution in the hollow part of the work is enhanced by forcibly sucking the plating solution from the solution outflow part. .

According to the method of the fifth aspect and the apparatus of the eleventh aspect, since the anodizing treatment liquid flows in the work, the anodizing treatment is sped up, and furthermore, the anodizing in the treatment tank is performed. By performing the above-mentioned processing in the state where the work is immersed in the processing liquid, the work need not be sealed.

According to the method of claim 6 and the apparatus of claim 12, high-speed plating is performed by flowing the plating solution in the work, and the structure is rationalized. This simplifies the preparation work such as connecting the power supply unit to the.

[0026]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows an outline of the entire plating processing system. In this plating system, processing sections A to D for various pretreatments, a plating processing section E, and a drying section F are arranged along the plating processing line in an array corresponding to the work order. Specifically, the degreasing processing unit A,
Alkali etching processing section B, mixed acid etching processing section C, alumite processing section D, plating processing section E and drying section F
Are arranged in this order. The processing sections A to E are respectively provided with processing tanks A1 to E1 and an appropriate number of tanks A2 to E2 for collecting the processing solution and washing with water. Further, a tank (not shown in FIG. 1) for supplying a processing solution or a stock solution to the processing tank is arranged for each of the processing sections A to E.

A work input part 3 is provided on the start end side of the plating processing line, and a work unloading part 4 is provided on the end end side of the plating processing line. Work transfer means 5 for transferring the work W along the transfer line is provided above the transfer line.

FIG. 2 shows a first embodiment of the surface treatment apparatus of the present invention applied to the plating treatment system as described above. The apparatus according to the present embodiment is used in the plating processing section E and performs plating on the inner surface of a hollow work.
The apparatus shown in this figure has a structure applied when a cylinder block of a two-cycle engine for a motorcycle is used as a work W1, and this work W1 has cylinder bores W11 that are open on both upper and lower sides, and It has an exhaust port W12 and a scavenging port W13 which communicate with W11 and open to the outer surface of the cylinder block.

In this figure, 10 is a processing tank, which corresponds to the processing tank E1 in the plating processing section E in FIG.
The processing tank 10 is formed to have an appropriate size capable of accommodating the work W1 and can store the plating solution L therein. At the bottom of the processing tank 10, a work setting section 11 for setting the work W1 is provided.

Below the work setting section 11, a liquid inflow section 13 formed of a lateral passage along the bottom of the processing tank 10.
Is formed, a communication hole 13a communicating with the liquid inflow portion 13 is opened in the center of the work setting portion 11, and when the work W1 is installed on the work setting portion 11, the liquid inflow portion 13 and the work Communication hole 1 with cylinder bore W11 of W1
It is designed to communicate via 3a. The solution inflow part 13 is connected to a plating solution feed pump 22 via a solution supply pipe 21, and the pump 22 is connected to a plating solution storage tank 20. A valve 23 for adjusting the flow rate is provided in the liquid supply pipe 21.

An electrode 12 is attached to the processing tank 10. The electrode 12 is formed in a tubular shape, and the lower end of the electrode 12 protrudes above the work setting part 11 through the liquid inflow part 13 and the communication hole 13 a, and the lower end part thereof is the processing tank 10.
It is fixed at the bottom of. Then, when the work W1 is installed on the work setting part 11, the electrode 12 is located in the cylinder bore W11 of the work W1, and in this state, the space between the outer peripheral surface of the electrode 12 and the peripheral surface of the cylinder bore W11. The part communicates with the liquid inflow part 13. At the lower end of the hollow portion of the electrode 12, a liquid outflow portion 14 that opens below the processing tank 10 is formed. The liquid outflow portion 14 is connected to a liquid recovery pipe 24. The downstream end reaches the plating solution storage tank 20.

A lid member 15 for sealing the processing bath 10 is provided at the upper end of the processing bath 10. The lid member 15 can be opened and closed with respect to the processing tank 10. For example, the lid member 15 is attached to a support frame 10a supporting the processing tank 10 via a hinge or the like (not shown) to close the processing tank 10. It is rotatable in the open state. A lid pressing cylinder 16 is provided for the lid member 15, and the lid pressing cylinder 16 pushes the lid member 15 from above via the frame body 16a when the lid member 15 is in the lid closed state. Thus, the lid member 15 is brought into close contact with the upper edge of the processing tank 10.

Further, a power feeding cylinder 18 is attached to the upper side of the lid member 15, and a rod 18a of the power feeding cylinder 18 penetrates through the lid member 15 and projects downward, and at the tip of the rod 18a. A plate-shaped power supply member 17 made of a conductor is attached. Then, when the work W1 is installed in the processing tank 10 and the lid member 15 is in a state of sealing the processing tank 10, the power feeding cylinder 18 is operated to cause the power feeding member 17 to move to the work W1. It is designed to be pressed against the upper end. In addition,
At the portion where the rod 18a of the power feeding cylinder 18 penetrates the lid member 15, the seal pressing plate 1 for sealing this portion is formed.
9 is provided.

The power feeding member 17 is provided with the rectifier 2 in the energizing circuit via the rod 18a and the seal holding plate 19.
5 is connected to the negative side of the rectifier 25, while the electrode 12 is connected to the positive side of the rectifier 25.

A surface treatment method using this apparatus will be described below.

In the plating process, the work W1 is loaded into the processing tank 10 from above with the lid member 15 opened in advance, and set on the work setting section 11. Then, the lid member 15 is closed and the lid pressing cylinder 16 is operated,
The upper end of the processing tank 10 is hermetically sealed, and the power supply cylinder 18 is operated to bring the power supply member 17 into pressure contact with the upper end of the work W.

After the above state, the pump 22 is operated to send the plating solution L from the plating solution storage tank 20 to the solution inflow portion 13 through the solution supply pipe 21, and further the plating solution L. Flows into the cylinder bore W11 of the work W1 through the communication hole 13a.

At this time, the processing tank 10 may be empty in advance, or the plating solution L may be stored to some extent. In any case, until the treatment tank 10 is filled with the plating solution L, part of the plating solution L that has flowed into the cylinder bore W11 is an exhaust port W12 or a scavenging port as shown by a dashed arrow in FIG. Treatment tank 10 from W13
However, when the plating solution L is filled in the processing tank 10 by continuing the supply of the plating solution L, the plating solution L does not flow out from the ports W11 and W12, and the inside of the cylinder bore W11 is stopped. The entire amount of the plating solution that has flowed into the tank flows into the solution outlet section 14 where the pressure is low.

That is, the processing tank 1 sealed with the lid member 15
0 is filled with the plating solution L, and the plating solution L is filled with the work W.
In the state where 1 is soaked, the plating solution L fed into the plating solution inflow portion 13 is between the outer peripheral surface of the electrode 12 and the peripheral surface of the cylinder bore W11, as indicated by the solid line arrow in FIG. As such, it flows into the inside of the electrode 12 near the upper end of the cylinder bore W11 and flows out from the liquid outflow portion 14 below the electrode 12. Then, while the plating solution L is flowing as described above, the electrodes 12 are used as an anode and the work W1 is used as a cathode to energize them, thereby performing high-speed plating.

According to this method, each port W12,
It is not necessary to seal W13, and the cylinder bore W
The upper end of 1 does not have to be completely sealed. Therefore, the sealing device for sealing the cylinder bore W1 and the ports W12, W13 and the like and the sealing work thereof are omitted, the structure and the preparatory work are simplified, and troubles such as splashing of the plating solution due to defective sealing are not caused. . Moreover, as in the case where the ports W12 and W13 are sealed, the plating solution L flows well between the peripheral surface of the cylinder bore W11 and the electrode 12, and high-speed plating is effectively performed.

FIG. 3 shows, as a modification of the first embodiment, an apparatus applied when a cylinder block of a four-cycle multi-cylinder in-line engine for an automobile is used as a work W2.

The apparatus shown in this figure also includes a processing tank 30,
The plating solution inflow part 3 is provided below the work setting part 31 at the bottom thereof.
3 is formed, and the cylindrical electrode 32 is disposed in the processing tank 30.
A plurality of electrodes 32 are arranged in an array corresponding to each cylinder bore W21 of the work W2. Specifically, when the work W2 is a cylinder block of four cylinders, four electrodes 32 are arranged at predetermined intervals so as to correspond to each cylinder bore W21, and the lower end of each electrode 32 is It is fixed to the processing bath 30 while being electrically connected to each other via a conductor.

The liquid inflow portion 33 extends laterally below the work setting portion 31 over the portion where the electrode 32 is disposed. Also, each cylinder bore W21 of the work W2
Communication holes 33a communicating with the liquid inflow portion 33 and opening to the work setting portion 31 are provided at the positions corresponding to, respectively, and the electrodes 32 are connected to the liquid inflow portion 33 and the communication holes 33a.
When the work W2 is installed on the work installation part 31, the cylinder bores W21 of the work W2 are connected to the communication holes 33 by penetrating through the holes and protruding above the work installation part 31.
The electrode 32 communicates with the liquid inflow portion 33 via a, and the electrode 32 is located in each cylinder bore W21. A liquid outflow portion 34 is provided at the lower end of the hollow portion of each electrode 32.
Are formed.

Then, as in the apparatus of FIG. 2, the liquid inflow portion 3
3 and the plating solution storage tank 20 are provided with a solution supply pipe 21, a pump 22 and a valve 23, and a plating solution discharge pipe 24 is provided between the solution outflow portion 34 and the plating solution storage tank 20. Has been done. Further, a lid member 35 and a lid pressing cylinder 36 for sealing the upper end of the processing tank 30.
Is provided, and the power supply cylinder 3 is attached to the lid member 35.
8, the power supply member 37 and the like are provided, and the power supply member 37 and the electrode 32 are connected to the rectifier 25, which is also similar to the device of FIG.

FIG. 4 shows another modification of the first embodiment.
The apparatus applied when the cylinder block of a V-type engine is used as the work W3 is shown.

The apparatus shown in this figure also includes a processing tank 40,
The plating solution inflow part 4 is provided below the work setting part 41 at the bottom thereof.
3 is formed, the work W3 having a pair of V-shaped banks is installed in the work setting part 41 with the head side of both banks facing downward, and in this state, the cylinder bores of both banks of the work W3 are formed. The work setting part 41 and the plating solution inflow part 4 so that the W31 communicates with the plating solution inflow part 43.
3 is formed.

Further, each cylinder bore W41 of the work W3
A plurality of electrodes 42 corresponding to the electrodes are arranged. Specifically, the electrodes 42 are arranged in two rows on the left and right.
Is inserted into each cylinder bore W31. A liquid outflow portion 44 is formed at the lower end of the hollow portion of each electrode 42.

Then, as in the apparatus of FIG. 2, the liquid inflow portion 4
3 and the plating solution storage tank 20 are provided with a solution supply pipe 21, a pump 22 and a valve 23, and a plating solution discharge pipe 24 is provided between the solution outflow portion 44 and the plating solution storage tank 20. Has been done. Further, a lid member 45 and a lid pressing cylinder 46 for sealing the upper end of the processing tank 30.
Is provided, and the power supply cylinder 4 is attached to the lid member 45.
8, the power feeding member 47 and the like are provided, and the power feeding member 47 and the electrode 42 are connected to the rectifier 25, which is also similar to the device of FIG.

Even when the apparatus shown in FIG. 3 or the apparatus shown in FIG. 4 is used, the work W2 or W3 is treated in the processing tanks 30 and 4.
0, while the processing tanks 30 and 40 are sealed by the lid members 35 and 45, the pump 22
The plating solution L fed by means of is fed into the cylinder bores of the works W2, W3, and while the plating solution L is flowing, the electrodes 32, 42 and the works W2, W3 are energized to perform high-speed plating. Be done. Further, it is not necessary to individually seal the cylinder bores W21 and W31 of the works W2 and W3, and the sealing device and the sealing work are simplified.

Next, a second embodiment of the surface treatment apparatus of the present invention will be described with reference to FIGS. The equipment shown in these figures is also used in the plating process part to perform plating on the cylinder bore peripheral surface of the work, and to make the plating solution flow while the work is immersed in the plating solution in the processing tank. However, as a method of flowing the plating solution,
The plating solution is sent from below into the cylinder bore of the work, while the plating solution is forced out from above.

FIG. 5 shows a specific example of the second embodiment.
The structure applied when the cylinder block of the two-cycle engine for motorcycles is made into the work W1 is shown. The apparatus shown in this figure is equipped with a processing tank 50 in which a predetermined amount of plating solution is stored in advance. When the work W1 is immersed in the plating solution L in the processing tank 50, the work supporting member (work setting) is installed. Part 51 and is installed at a predetermined height position in the processing tank 50. Further, in the processing tank 50, when the work is installed, the cylinder bore W1
1 is provided with an electrode 52 that rushes in, and a liquid inflow portion 53 and a liquid outflow portion 54 are provided.

The liquid inflow part 53 is arranged in the lower part of the processing tank 50, the downstream end is opened upward, and the upstream side is connected via a pipe 56 to the discharge side of a plating liquid feeding pump 55. There is. Then, when the work is held at a predetermined height position in the processing tank, the liquid inflow portion 53 causes the work W1 to move.
Located directly under the cylinder bore W11 of
The lower end of 11 is opened in the plating solution.

On the other hand, the liquid outflow portion 54 is arranged in the upper part of the processing tank 50, the upstream end portion is opened downward, and the downstream side is connected to the suction side of the pump 55 through the pipe 57. Then, when the work W1 is held at a predetermined height position in the processing tank 50, the liquid outflow portion 54 is located immediately above the cylinder bore W11 of the work W1 and faces the upper end opening of the cylinder bore W11. It is designed to open inside. The liquid outflow portion 54 can be retracted from a position corresponding to the work W1 when the work W1 is carried in and out of the processing tank.

The work W1 is connected to the minus side of the rectifier via an appropriate power feeding member, and the electrode 52 is connected to the plus side of the rectifier. ing.

According to this embodiment, the work W1 is the processing tank 5
In the state of being immersed in the plating solution L in 0, the pump 5
The plating solution L pumped by 5 is sent into the cylinder bore W11 of the workpiece W1 through the downstream end opening of the solution inflow section 53, and the plating solution L flowing through the cylinder bore W11 flows out upward. And the cylinder bore W
The plating solution L flowing out of 11 is forcibly sucked into the suction side of the pump 55 from the solution outflow portion 54, and the plating solution L circulates between the pump 55 and the work W1.

In this way, the cylinder bore W of the work W1
11, the plating solution L is sucked from one side and the plating solution L is forcedly sucked from the other side, so that the plating solution flows in the cylinder bore W11 even if the opening portion of the cylinder bore W11 is not sealed. The nature is enhanced. Therefore, although the high speed plating is performed well, the cylinder bore W11 and the port W12,
A sealing device for sealing W13 and the like and its sealing work are omitted, the structure and the work are simplified, and the work W1 is immersed in the plating solution L,
Scattering of the plating solution will be prevented.

Further, the device of this embodiment has an advantage that the shape of the electrode 52 is simplified as compared with the first embodiment. That is, in the apparatus of the first embodiment, the electrode is formed in a tubular shape so that the plating solution that has flowed into the cylinder bore flows through the inside of the electrode to the outflow portion. Since it is designed to flow into the cylinder bore from one end side and flow out to the other end side, it is not necessary to form the electrode into a tubular shape, and the electrode can be easily molded.

FIG. 6 shows, as a modification of the second embodiment, a structure applied when a cylinder block of a four-cycle multi-cylinder in-line engine for an automobile is used as a work W2. The apparatus shown in this figure also includes a processing tank 60, an electrode 62, a liquid inflow portion 63, a liquid outflow portion 64, a pump 65, etc., and the liquid inflow portion 63 and the liquid outflow portion 64 are pumped by a pump 65 via pipes 66, 67. It is connected to the. Then, the electrode 6
2 are arranged in an array corresponding to each cylinder bore W21 of the work W2, and the liquid inflow portion 63 and the liquid outflow portion 64 are open at a plurality of locations corresponding to each cylinder bore W21. Except for the change corresponding to the work W2, the device has the same configuration as the device shown in FIG.

FIG. 7 shows another modification of the second embodiment.
The structure applied when the cylinder block of a V-type engine is used as the work W3 is shown. The apparatus shown in this figure also includes a processing tank 70, an electrode 72, a liquid inflow portion 73, and a liquid outflow portion 7.
4, a pump 75 and the like, and the liquid inflow portion 73 and the liquid outflow portion 74 are connected to the pump 75 via pipes 76 and 77. The electrodes 72 are arranged in two rows so as to correspond to the cylinder bores W31 of both banks of the work W3, and the liquid inflow portion 73 and the liquid outflow portion 74 correspond to the cylinder bores W31 of both banks. Although the openings are provided at the respective positions, the configuration is the same as that of the apparatus shown in FIG. 5, except for the change corresponding to the work W3.

Also in the case of the apparatus shown in FIGS. 6 and 7, FIG.
The plating process is performed in the same manner as in the case of the apparatus shown in FIG.

Next, a third embodiment of the surface treatment apparatus of the present invention will be described with reference to FIG. The apparatus of this embodiment does not immerse the work in the plating solution in the processing tank as in the first and second embodiments, but performs high-speed plating with the upper end of the cylindrical portion of the work sealed. However, the structure of the equipment and the preparation work for plating are simplified by rationalizing the structure of the power supply part and the electrode for the seal part and the work, and the technical problem to be solved is the first. This is common to the first and second embodiments.

The plating apparatus shown in this figure is a processing apparatus main body 80 that is provided in the plating processing section and supports the work W4.
And a pressing lid 84 coupled to the upper end of the work W4 installed on the processing apparatus body 80.

The processing apparatus main body 80 has a work setting section 81 on the upper surface, and the work W4 is placed on the work setting section 81.
Is to be installed. This work setting part W4
A liquid inflow portion 83 formed of a lateral passage is formed below, and a communication hole 83a communicating with the liquid inflow portion 83 is opened upward in the work setting portion 81. Work W above
Reference numeral 4 denotes, for example, a cylinder block of a four-cycle engine, which has a cylinder bore W41 that opens up and down. When the work W4 is installed on the work installation section 81, the liquid inflow section 83 and the work The cylinder bore W41 of W4 communicates with the communication hole 83a. The liquid inflow portion 83 is connected to a pump 22 for feeding the plating solution via a liquid supply pipe 21 having a valve 23 for adjusting the flow rate, and the pump 22 is connected to the plating solution storage tank 20.

Further, an electrode 82 is provided on the main body 80 of the processing apparatus.
Is installed. The electrode 82 is formed in a rod shape, and the lower end thereof is fixed to the lower portion of the processing apparatus main body 80 in a state of penetrating through the liquid inflow portion 83 and the communication hole 83a and protruding above the work setting portion 81. Installation section 8
When the work W4 is installed on the work 1, the electrode 82 is positioned in the cylinder bore W41 of the work W4.

On the other hand, the pressing lid 84 has a contact surface on the lower surface side for the upper end of the work, and the work setting portion 8 is provided.
When the work W4 is installed on the work W1, the work W4 is set on the work W4 and is pressed from above by the lid pressing cylinder 85 so that the work W4 comes into close contact with the upper end of the work W4 and closes the periphery of the upper end opening of the cylinder bore W41. It is designed to be sealed.

A liquid outflow portion 86 opening downward is formed in the holding lid 84. When the holding lid 84 is set on the work W4, the liquid outflow portion 86 and the cylinder bore W41 of the work W4 are connected to each other. Are communicating with each other. A lead-out pipe 87, which communicates with the liquid outflow portion 86, is connected to a side portion of the pressing lid 84. This outlet pipe 87
Is bent downward on the side of the pressing lid 84, and the lower end portion thereof is fitted to the upper end of the liquid recovery pipe 88. The lower end of the liquid recovery pipe 88 reaches the plating liquid storage tank 20.

Further, the pressing lid 84 is integrally provided with a power feeding portion 89 for the work W4. The power feeding portion 89 is made of a conductive material and is provided in a range from the upper surface of the pressing lid 84 to the lower surface of the pressing lid 84 via the side portion of the liquid outflow portion 86. Then, the pressing lid 84 is placed on the work W4.
When the is set, the power feeding portion 89 comes into contact with the upper end of the work W4.

The feeding part 89 is connected to the minus side of the rectifier 25 in the energizing circuit, while the electrode 82 is connected.
Is connected to the positive side of the rectifier 25.

As a plating method using this apparatus, the pump 25 is operated while the work W4 is installed on the processing apparatus main body 80 and the pressing lid 84 is set on the work W4 as described above. As a result, the plating solution L passes from the plating solution storage tank 20 to the cylinder bore W4 through the solution supply pipe 21, the solution inflow portion 83, and the communication hole 83a.
It is sent within 1. Then, the plating solution L that has flowed through the cylinder bore W41 passes from the solution outflow portion 86 formed on the holding lid 84 above the work W through the outlet tube 87 to the solution recovery tube 8
Runs out to 8. While the plating solution L is flowing in this way,
The electrode 82 is used as an anode and the work W4 is used as a cathode to energize the electrodes, so that the plating process is performed at high speed.

In particular, according to this embodiment, the cylinder bore W
The plating liquid L that has flowed into the liquid 41 from the lower liquid inflow portion 83
Liquid outflow portion 8 formed on the holding lid 84 above the work W4
Since there is no need to form the electrode 82 into a cylindrical shape to form a flow path therein, the shape of the electrode 82 is simplified and its molding is facilitated.

Further, since the power feeding portion 89 is integrally provided on the cover member 84, the cylinder bore W41 of the work W4 can be set as long as the cover member 84 is set on the work W4.
And the connection of the power feeding portion 89 to the work W4 are performed at one time, which simplifies the preparatory work for the plating process.

Next, a fourth embodiment of the surface treatment apparatus of the present invention will be described with reference to FIGS. The equipment shown in these figures is used in the alumite treatment part, which is one of the pretreatment parts in the plating system, and performs the alumite treatment (anodizing treatment) on the inner surface of the cylindrical part of the work, that is, the cylinder of aluminum casting. A process for forming an anodic oxide film is performed on the cylinder bore peripheral surface of the block. This 4th
Like the apparatus of the first embodiment and the apparatus of the second embodiment, the apparatus of the above embodiment also allows the processing liquid to flow while the work is immersed in the processing liquid in the processing tank. However, in the case of the alumite treatment, it is not required to manage the fluidity of the treatment liquid to a higher degree than in the case of the plating treatment, and therefore, the apparatus of the first embodiment and the apparatus of the second embodiment are required. It has a simple structure.

FIG. 9 shows a specific example of the fourth embodiment.
The structure applied when the cylinder block of the two-cycle engine for motorcycles is made into the work W1 is shown. The surface treatment apparatus shown in this figure includes a treatment tank 90 (corresponding to the treatment tank D1 in FIG. 1), and the treatment tank D1 is formed to have an appropriate size capable of accommodating the work W1.
In addition, the alumite liquid L'can be stored.

At the bottom of the processing tank 90, the work setting section 9 is provided.
1 is provided, and a liquid inflow portion 93 is formed below the work setting portion 91, and a communication hole 93a communicating with the liquid inflow portion 93 is opened at the center of the work setting portion 91, and the work setting portion 91 is provided. When the work W1 is installed on the work W1, the liquid inflow portion 93 and the cylinder bore W11 of the work W1 communicate with each other through the communication hole 93a. The liquid inflow portion 93 is connected to a pump 102 for supplying alumite liquid via a liquid supply pipe 101 having a valve 103 for adjusting the flow rate, and this pump 102 is connected to an alumite liquid storage tank 100.

An electrode 92 is attached to the processing bath 90. The electrode 92 is formed in a rod shape, penetrates the liquid inflow portion 93 and the communication hole 93a, and is a work setting portion 91.
The lower end is fixed to the lower part of the processing tank 90 in a state of projecting upward so that the electrode 92 is positioned inside the cylinder bore W11 of the work W1 when the work W1 is set on the work setting section 91. Has become.

A small auxiliary tank 90a is provided on the upper outside of the processing tank 90. The auxiliary tank 90a and the processing tank 90 are provided.
An overflow hole 90b is formed in the partition wall for partitioning and. A liquid recovery pipe 104 is connected to the auxiliary tank 90a, and the downstream end side of the liquid recovery pipe 104 reaches the alumite liquid storage tank 100.

Further, this surface treatment apparatus is provided with a liquid outflow portion constituting member 94. This liquid outflow portion constituent member 9
4 is formed in a hollow shape with the upper end closed and the lower end opened, and a plurality of liquid outflow holes 95 are provided in the peripheral wall of the liquid outflow portion constituting member 94. And the processing tank 9
With the work W1 installed in the work setting part 91 of 0, the liquid outflow part constituting member 94 is put on the upper end of the work W1 and is pressed from above by a holding cylinder (not shown) to form a liquid outflow part forming member. The lower end of 94 is the work W1
It is designed so that it can be pressed onto the upper edge of. In the state in which the liquid outflow portion constituting member 94 is set to the work W1 in this manner, the hollow portion of the liquid outflow portion constituting member 94 and the cylinder bore W11 communicate with each other, and the alumite liquid L ′ flowing through the cylinder bore W11 becomes the liquid. From the hollow portion of the outflow portion constituent member 94, the liquid flows out through the liquid outflow hole 95 onto the liquid surface in the processing tank 90.

The work W1 is attached to the liquid outflow portion constituting member 94.
Is integrally provided to the rectifier 105, and the electrode 92 is connected to the minus side of the rectifier 105 in the energizing circuit.

As a surface treatment method using this apparatus, the work W1 is installed in the treatment tank 90 as described above, and the liquid outflow portion constituting member 94 is provided on the work W1.
When the pump 102 is operated in the state where is set, the alumite liquid L ′ is sent from the alumite liquid storage tank 100 into the cylinder bore W11 through the liquid supply pipe 101, the liquid inflow portion 93 and the communication hole 93a.
Then, the alumite liquid L ′ that has flowed into the cylinder bore W11 flows upward, and a part of the alumite liquid L ′ flows into the ports W12 and W.
Although it also flows out from 13, most of it flows through the cylinder bore W11 to the hollow portion of the liquid outflow portion constituting member 94 above it,
The liquid flows out from the liquid outflow hole 95 onto the liquid surface of the processing tank 90.
Further, with the outflow of the alumite liquid L ′ into the processing tank 90,
The alumite liquid L ′ in the processing tank 90 overflows from the overflow hole 90b into the auxiliary tank 90a, and is recovered in the alumite liquid storage tank 100 via the liquid recovery pipe 104.

While the alumite solution L'is flowing as described above, the work W1 is used as an anode and the electrode 92 is used as a cathode to energize them, so that the alumite treatment is performed at high speed.

Also in this method, since the work W1 is processed while being immersed in the processing liquid in the processing tank 90, the sealing of the ports W12, W13 and the like becomes unnecessary, and the structure and the work are simplified. This is the same as in the first and second embodiments.

FIG. 10 shows, as a modification of the fourth embodiment, a structure applied when a cylinder block of a four-cycle multi-cylinder in-line engine for an automobile is used as a work W2. Like the apparatus shown in FIG. 9, the apparatus shown in this figure also includes a processing tank 110, and the workpiece setting section 111, the electrode 112, the liquid inflow section 113, and the communication hole 11 are provided in the processing tank 110.
3a, an auxiliary tank 110a and an overflow 110b hole are provided, and the liquid inflow portion 113 and the auxiliary tank 110a are connected to the liquid supply pipe 101 and the liquid recovery pipe 104, respectively. The electrode 112, the liquid inflow portion 113, and the communication hole 113
"a" is arranged so as to correspond to each cylinder bore W21 of the cylinder block of the 4-cycle multi-cylinder in-line engine as the work W2. Further, a liquid outflow portion constituting member 114 which also serves as a power feeding portion for the work W2 is provided, and the liquid outflow portion constituting member 114 has a hollow shape which opens downward and has a liquid outlet hole 115 in the side wall. Then, the work W is placed in the work setting section 111 of the processing tank 110.
2 is installed, the liquid outflow part constituting member 114 is covered on the upper end of the work W2 and is pressed from above by the holding cylinder 115. In this state, the hollow part of the liquid outflow part forming member 114 and the work W2 are separated from each other. It communicates with each cylinder bore W21. The liquid outflow portion constituent member 114 and the electrode 112 are connected to the rectifier 105.

FIG. 11 shows, as another modification of the fourth embodiment, a structure applied when the cylinder block of the V-type engine is used as the work W3. The apparatus shown in this figure also includes a processing tank 120, and the workpiece setting section 121, the electrode 122, the liquid inflow section 123, and the auxiliary tank 1 are provided in the processing tank 120.
20a, an overflow hole 120b and the like, and further, a liquid outflow portion constituting member 124 having a liquid outflow hole 125 and a holding cylinder 126, which are the same as those of the apparatus shown in FIG. 10 except for a change corresponding to the work W3. It is composed.

Also in the case of the apparatus shown in FIGS. 10 and 11,
The alumite treatment is performed by the same method as the apparatus shown in FIG.

The apparatus shown in FIGS. 9 to 11 is
If the electrode is omitted, it can be applied to a pretreatment other than the alumite treatment.

By the way, in the processing of the entire plating processing system, the work W has the pretreatment parts A to D shown in FIG.
It is sequentially sent to the plating processing section E and the drying section F, and each processing section performs pretreatment and plating processing. For example, in the degreasing treatment unit A, the alkali etching treatment unit B, and the mixed acid etching treatment unit C, as a simple method, the respective treatments are performed by immersing the work W in the treatment liquid in the treatment tank. In D and the plating processing section E, the processing is performed by the apparatus as shown in the above embodiment.

In each processing unit, after the processing in the processing tank, the tank attached to the processing unit collects the processing liquid adhering to the work and rinses the work with water. With reference to FIG. 12, a degreasing processing unit will be described as an example. A processing tank A1 for storing degreasing liquid and a plurality of liquid recovery tanks A21, A22, A
23 and a washing tank A24 are arranged adjacent to each other, clean water is supplied to the washing tank A24, and other tanks A1, A21, A22, A
The liquid overflowing from each tank on one side flows into 23. Then, the work W is pulled up when the treatment in the treatment tank A1 is completed, and the work W is collected in the liquid recovery tank A2.
1 is moved to the upper position and lowered into the tank A21, and thereafter similarly transferred to the recovery tanks A22, A23 and the water washing tank A24, and after the water washing, it is moved to the next processing section.

The raising and lowering and movement of the work W as described above are performed by the work transfer means. In general, this type of work transfer means is equipped with a work transfer jig such as a pallet and the like, and the work transfer jig and the work are combined so that they can be moved up and down and moved in and out of each tank. However, in this case, since the treatment liquid adheres to the work transfer jig, the carry-out amount of the treatment liquid from the treatment tank increases, which is not preferable in terms of efficiency such as washing with water and economy.

Therefore, in order that the work W can be carried by itself without using a work carrying jig, the work carrying means should be constructed as shown in FIG. 13 or as shown in FIG. 14, for example. Is desirable.

That is, in the example shown in FIG.
1,202 (treatment tanks A1 to E1 and tanks A2 to E in FIG. 1)
(Corresponding to 2), a work supporting member 210 for supporting the work W is provided so as to be capable of moving up and down between an ascending position located above the tanks 201 and 202 and a descending position located below the tanks 201 and 202, This work support member 2
10 is connected to an elevating / lowering driving means 213 such as an elevating / lowering cylinder via an elevating rod 211, a rod 212 and the like.
A work transfer means 215 for moving the work W in the transfer line direction is arranged above the tanks 201 and 202. The work transfer means 215 is attached to the beam 216 extending in the transfer line direction and the beam 216. And the work gripping device 217. The work gripping device 217 includes a chuck 218 capable of expanding and contracting for gripping the upper end of the work W.
Is movable up and down by a predetermined amount with respect to the gripping device main body, and the gripping device main body is movably attached to the beam 215. The work transfer means 215 is provided with driving means (not shown) for expanding / contracting the chuck 218, moving up and down, and moving the gripping device body.

In the plating treatment section and the alumite treatment section, the work supporting member 210 may be provided in the treatment tank or the treatment apparatus main body of the surface treatment apparatus as shown in each of the embodiments.

According to this carrying means, at the time of processing a work in the tank 201, the work W is disengaged from the work gripping device 217 and supported by the work supporting member 210, and then the work supporting member 210 is set to the lowered position. Thus, the work W is stored in the tank. After the processing in the tank 201, the work supporting member 210 supporting the work W is operated to the raised position, and then the work W is gripped by the chuck 218 of the work gripping device 217, and the work W is supported by the work supporting member 210. Then, the work gripping device 217 transfers the work to a position corresponding to the next tank 202.

In this way, by transferring the single body of the work W, the carry-out amount of the processing liquid is reduced.

Also in the example shown in FIG. 14, each tank 201,
A work supporting member 210 that supports a work W is provided on each of the 202 so as to be movable up and down.
0 is connected to the elevating drive means 213 via the elevating rod 211, the rod 212 and the like, while the work transfer means 220 is arranged above the tanks 201 and 202. The work transfer means 220 is provided in each tank 20 at a height position corresponding to the height when the work support member 210 is in the raised position.
1, a guide roller 221 arranged between the first and the second roller 202, a slide plate 222 which is arranged above the guide roller 221 by a predetermined amount and is slidable in the conveying line direction, and a drive means for moving the slide plate 222 (see FIG. (Not shown), the slide plate 222 is provided with a fitting hole 223 for the upper end of the work.

According to this carrying means, when the work W is processed in the tank 201, the work W is supported by the work supporting member 210, and the work supporting member 210 is moved to the lowered position, so that the work W is placed in the tank. Be accommodated. After the processing in the tank 201, the work supporting member 210 supporting the work W is operated to the raised position, so that the upper end of the work W fits into the fitting hole 223 of the slide plate 222. Then slide plate 22
As the work piece 2 slides, the work W slides on the work support member 210, passes over the guide rollers 221, and moves onto the work support member 210 of the next tank 202.

Therefore, this example can be applied to the case where the work W can slide on the work supporting member 210, and even in the case of this example, the amount of the processing liquid taken out can be increased by transferring the single body of the work W. Less.

[0098]

As described above, according to the present invention, the processing liquid pumped by the processing liquid feeding pump is used to dip the workpiece in the processing liquid in the processing tank. Since the processing liquid flowing through the hollow part of the work is allowed to flow out from the liquid outflow part through the liquid inflow part provided in the above, the surface treatment applied to the inner surface of the hollow work can be performed at high speed. Moreover, it is possible to simplify the structure by eliminating the need for sealing the work, omitting the sealing device and the like, and simplifying the preparation work.

Especially when applied to the plating treatment, high speed plating can be performed by flowing the plating solution while simplifying the structure and the preparatory work by eliminating the need for sealing the work.

In this case, after the work is installed in the treatment tank, the treatment tank is hermetically sealed, and when the treatment tank is filled with the plating solution, the solution flows out from the liquid inflow portion through the hollow portion of the work. The flow of the plating solution toward the portion becomes good, and high-speed plating can be effectively performed. Further, even if the plating solution is forcibly sucked out from the solution outflow portion, the flow of the plating solution in the work becomes good, and high-speed plating can be effectively performed.

Further, when applied to anodizing treatment and the work is immersed in the anodizing solution in the processing tank, the anodizing solution is flown into the hollow part of the work from one end side,
If the flow is made to flow into the processing tank from the other end side, it is possible to speed up the anodizing process while eliminating the need for sealing the work.

As a method and apparatus applied to the plating treatment, the treatment apparatus main body on which the work is installed is provided with the liquid inflow portion and the electrode, while the holding lid pressed against the upper end of the work is provided with the plating liquid outflow portion and the power supply. If a portion is provided so that the plating solution pumped by the pump for feeding the plating solution flows from the plating solution inflow part through the inside of the work to the solution outflow part of the pressing lid, the structure of the electrode and the like can be simplified. In addition, it is possible to simplify the preparatory work such as sealing the work and connecting the power supply unit.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a plating processing system to which the present invention is applied.

FIG. 2 is a sectional view of the surface treatment apparatus according to the first embodiment of the present invention.

FIG. 3 is a sectional view showing a modification of the first embodiment.

FIG. 4 is a cross-sectional view showing another modification of the first embodiment.

FIG. 5 is a sectional view of a surface treatment apparatus according to a second embodiment of the present invention.

FIG. 6 is a sectional view showing a modification of the second embodiment.

FIG. 7 is a cross-sectional view showing another modification of the second embodiment.

FIG. 8 is a sectional view of a surface treatment apparatus according to a third embodiment of the present invention.

FIG. 9 is a sectional view of a surface treatment apparatus according to a fourth embodiment of the present invention.

FIG. 10 is a sectional view showing a modification of the fourth embodiment.

FIG. 11 is a cross-sectional view showing another modification of the fourth embodiment.

FIG. 12 is an explanatory diagram showing the processing of each tank and the movement of the work in the pretreatment unit and the like.

FIG. 13 is an explanatory diagram showing an example of a work transfer unit.

FIG. 14 is an explanatory diagram showing another example of the work transfer means.

[Explanation of symbols]

10, 30, 40, 50, 60, 70, 90, 110,
120 treatment tanks 12, 32, 42, 52, 62, 72, 92, 112,
122 electrodes 13, 33, 43, 53, 63, 73, 93, 113,
123 liquid inflow section 14, 34, 44, 54, 64, 74, 94, 114,
124 Liquid outflow part 22, 55, 65, 75, 102 Pump 15, 35, 45 Lid member 80 Processing device main body 83 Liquid inflow part 84 Lid member 86 Liquid outflow part W, W1, W2, W3, W4 Workpiece

Claims (12)

[Claims] 1. A surface treatment method for performing a surface treatment on an inner surface of a hollow work, wherein the work is set in a treatment tank for storing the treatment liquid, and the work is immersed in the treatment liquid in the treatment tank. In such a state, the processing liquid pressure-fed by the pump for supplying the processing liquid is caused to flow into the hollow portion of the work from the liquid inflow portion provided in the processing tank, and the processing liquid flowing through the hollow portion of the work, A surface treatment method, which comprises flowing out from a liquid outflow portion provided in the treatment tank. 2. The plating solution is used as the processing solution, and the plating solution is allowed to flow in and out in a state where the plating electrode is arranged in the hollow portion of the work set in the processing tank. The surface treatment method described in 1. 3. The surface treatment method according to claim 2, wherein the treatment tank is closed after the work is installed in the treatment tank. 4. The surface treatment method according to claim 2, wherein the plating solution is forcibly sucked out from the solution outflow portion. 5. An anodizing treatment liquid is used as a treatment liquid, and the treatment liquid is applied to a hollow portion of the work while the anodizing treatment electrode is arranged inside the cylindrical portion of the work installed in the treatment tank. 2. The surface treatment method according to claim 1, wherein the surface treatment method comprises inflowing from one end side and flowing out into the treatment tank from the other end side. 6. A surface treatment method for plating an inner surface of a hollow work, wherein the work is installed on a processing apparatus main body having a liquid inflow part, and a plating electrode is positioned in the hollow part of the work. While the pressing lid having the power supply part to the work and the liquid outflow part is pressed against the upper end of the work, the plating solution pressure-fed by the pump for feeding the plating solution from the above liquid inflow part to the hollow part of the work A surface treatment method, characterized in that the plating solution that has flowed in and passed through the hollow part of the work is allowed to flow out from the liquid outflow part. 7. A surface treatment apparatus for plating an inner surface of a hollow work, comprising a treatment tank for storing a plating solution, wherein the work is installed to support the workpiece at a fixed position in the treatment tank. Part, a plating electrode inserted into the hollow part of the work, and a liquid inflow part that is connected to a pump for feeding the plating solution and guides the plating solution to the hollow part of the work installed in the processing tank. And a liquid outflow section for outflowing the plating solution through the hollow portion of the work. 8. The surface treatment apparatus according to claim 7, wherein a lid member for sealing the treatment tank is provided on the upper end of the treatment tank so as to be openable and closable. 9. The surface treatment apparatus according to claim 8, wherein the lid member is provided with a power feeding portion for the work. 10. A liquid inflow part and a liquid outflow part are provided in a processing tank, a passage connected to the liquid inflow part is connected to a discharge side of a pump for feeding a plating solution, and a passage connected to the liquid outflow part is connected to the pump. 7. It is connected to the inflow side of
The surface treatment device described. 11. A surface treatment apparatus for anodizing an inner surface of a hollow work, comprising a treatment tank for storing an anodizing treatment liquid, wherein the work is placed at a predetermined position in the treatment tank. Connected to the work installation part to support, the anodizing electrode inserted into the hollow part of the work, and the pump for supplying the processing liquid, and the lower part of the cylindrical part of the work installed in the processing tank. And a liquid outflow portion for outflowing the processing liquid that has passed through the tubular portion into the processing tank from above. 12. A surface treatment apparatus for plating an inner surface of a hollow work, the treatment apparatus main body having a work setting portion on an upper surface thereof, and the work being installed on the treatment apparatus main body by press contact with the upper end of the work. And a holding lid, which is connected to a pump for feeding a plating solution and a plating solution feeding pump into the processing apparatus main body, and which introduces the plating solution into the hollow section of the work. On the other hand, the surface treatment apparatus is characterized in that the lid member is integrally provided with a liquid outflow portion for outflowing the plating liquid passing through the hollow portion of the work and a power feeding portion of the work.