JPS6055845A - Polishing method of commutator - Google Patents
Polishing method of commutatorInfo
- Publication number
- JPS6055845A JPS6055845A JP16221483A JP16221483A JPS6055845A JP S6055845 A JPS6055845 A JP S6055845A JP 16221483 A JP16221483 A JP 16221483A JP 16221483 A JP16221483 A JP 16221483A JP S6055845 A JPS6055845 A JP S6055845A
- Authority
- JP
- Japan
- Prior art keywords
- commutator
- polishing
- abrasive
- tape
- organic binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/14—Maintenance of current collectors, e.g. reshaping of brushes, cleaning of commutators
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Motor Or Generator Current Collectors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は整流子と刷子とを用いて電流を伝送する電動機
の整流子の研摩方法に関するものであり従来例の構成と
その問題点
従来、整流子およびこれ′と共働する刷子とからなる電
動機では、整流子−刷子間の接触安定性を向上させ、使
用中の回転不良を防止するため、整流子表面を研摩して
その表面粗さを調整している。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for polishing a commutator of a motor that transmits current using a commutator and a brush. In an electric motor consisting of a brush and a brush that work together, the surface of the commutator is polished to adjust its surface roughness in order to improve the contact stability between the commutator and the brush and prevent rotation failure during use. are doing.
一般にとのだめの研摩には、第１図に示すような研摩テ
ープす々わちＳｉＣ、Ａｇ、、０３々どの砥粒１をアル
キッド樹脂、ポリエステル樹脂、乾性油などの有機質バ
インダー２で担持した紙、樹脂等の基材３からなる研摩
テープが用いられている。Generally, for polishing tonodame, abrasive tape as shown in Figure 1 is used.Abrasive tape such as SiC, Ag, 03, etc. is supported by an organic binder 2 such as alkyd resin, polyester resin, or drying oil. , an abrasive tape made of a base material 3 of resin or the like is used.
しかしながら、この従来法では研摩時に研摩テープから
有機質バインダー２が整流子表面に付着残存し、このた
め整流子−刷子間の初期的な接触安定性が劣化し回転不
良につながることが多い。However, in this conventional method, the organic binder 2 from the abrasive tape remains attached to the surface of the commutator during polishing, which often deteriorates the initial contact stability between the commutator and the brushes, leading to poor rotation.
これを防止するため、研摩後、有機溶媒による整流子の
洗浄を実施しなければならない。To prevent this, the commutator must be cleaned with an organic solvent after polishing.
しかし、このような洗浄後も研摩テープから整流子表面
へ付着した有機質バインダーは残留している。これは、
研摩によって有機質バインダーが強固に整流子表面に付
着し、いわば表面に埋め込」；れることになるだめであ
る。However, even after such cleaning, the organic binder adhering to the commutator surface from the abrasive tape remains. this is,
The problem is that the organic binder firmly adheres to the surface of the commutator due to polishing and becomes "embedded," so to speak, in the surface.
第２図は、従来のＳｉＣ研摩テープによって研摩され、
′ヒ後、有機溶婬中で洗浄して作製され／辷整流子表面
の有機質バインダーの付着量とこれを用いた小形電動機
の回転性能との相関を調べだ結果の１例である。々お第
２図において、有機質バインダーの付着は赤外分光分析
法、ガス質量分析法などの有機分析法とＸ線マイクロア
ナライザ、オージェ電子分光分析法、Ｘ線光電子分光分
析法などの表面分析法とを併用して調べ、その付着量で
示しだものである。また、回転性能は実使用条件下で多
数の小形電動機を２５０時間ランニングテストし、その
電流波形をオシログラフで観察し、第３図Ｖこ示すよう
に波形に伺ら異常のかいものをランク０１電流の零にな
る状態（いわゆるｏｆｆ点）が３秒間以上観４１すされ
るものをランク５として評価し、その平均ランクで示し
たものである。FIG. 2 is polished by conventional SiC polishing tape;
This is an example of the results obtained by investigating the correlation between the amount of organic binder attached to the surface of the commutator and the rotational performance of a small electric motor using the commutator. In Figure 2, the attachment of the organic binder is performed using organic analysis methods such as infrared spectroscopy and gas mass spectrometry, and surface analysis methods such as X-ray microanalyzer, Auger electron spectroscopy, and X-ray photoelectron spectroscopy. The results are shown by the amount of adhesion. In addition, the rotational performance was tested by running a large number of small motors for 250 hours under actual usage conditions, and observing the current waveforms using an oscilloscope. Those in which the current is zero (so-called OFF point) for 3 seconds or more are evaluated as rank 5, and the average rank is shown.
第２図に示したように、従来例のものでは整流子表面に
有機質バインダーが付着残留し、この付着量が多い程回
転性能が劣っていることがわかる。As shown in FIG. 2, it can be seen that in the conventional commutator, organic binder remains attached to the surface of the commutator, and the larger the amount of the attached organic binder, the worse the rotational performance.
発明の目的
本発明は、上述のような研摩テープからの有機質バイン
ダーの付着残留による回転不良の発生を防止することを
目的とするものである。OBJECTS OF THE INVENTION The object of the present invention is to prevent the occurrence of rotational defects due to residual organic binder from an abrasive tape as described above.
発明の構成
本発明は、従来法のような有機質バインタ゛−を含む研
摩テープではなく、これを含丑ないイｉｌｆ摩テープに
よって整流子表面を研摩するため、有機質バインダーの
付着残留はなく、またこれ故研摩後の洗浄工程も不必要
であり、かつこのバインダーの残留による回転不良の発
生が皆無になるものである。Structure of the Invention In the present invention, the surface of the commutator is polished not with an abrasive tape containing an organic binder as in the conventional method, but with an ILF abrasive tape that does not contain the organic binder, so there is no residual organic binder attached to the commutator. There is no need for a cleaning step after polishing, and there is no possibility of rotation failures caused by residual binder.
実施例の説明
前述したように本発明では、有機質バインダーを含まな
いＱｆ屋テープが使用されるが、この研摩テープとして
は第４図に示すような、たとえばＳｉＣ、Ａ／２０３な
どのセラミックや、ＦＢ 、 Ｎｉ 、 Ｏｒなどの金
属のうち１種捷だはそれ以」二からなる砥粒１１を溶射
によって紙、樹脂、金属薄板等からなる基材１２に担持
した研摩テープが使用されるり丑だ、前述の砥粒１１を
アルミニウム、銅、ステンレス等からなる薄板（基材１
２）に埋め込１れたものも使用することができる。これ
らの研摩テープはいずれも有機質バインダーを含寸ない
ものである。DESCRIPTION OF THE EMBODIMENTS As mentioned above, in the present invention, Qf-ya tape containing no organic binder is used, but this abrasive tape may be made of ceramics such as SiC, A/203, etc. as shown in FIG. An abrasive tape is used in which abrasive grains 11 made of one or more metals such as FB, Ni, Or, etc. are supported on a base material 12 made of paper, resin, thin metal plate, etc. by thermal spraying. , the abrasive grains 11 described above are attached to a thin plate (base material 1) made of aluminum, copper, stainless steel, etc.
2) can also be used. All of these abrasive tapes do not contain any organic binder.
本発明による整流子表面の有機物の残留量ならびにこれ
を使用した小形電動機の回転性能を調べた結果の１例を
次表に示す。The following table shows an example of the results of investigating the amount of organic matter remaining on the surface of the commutator according to the present invention and the rotational performance of a small electric motor using the commutator.
（注）数が大きいほど性能不良
表および第２図に示したように、従来例に比べ本発明で
は整流子表面の有機物付着量か１１５０以下となり回転
性能も極めて良好である。(Note) As shown in the performance failure table and FIG. 2, the larger the number, the more the organic matter deposited on the commutator surface in the present invention compared to the conventional example, the amount of organic matter adhering to the commutator surface is 1150 or less, and the rotation performance is also extremely good.
発明の効果
上述したように本発明の使用により、従来法による回転
性能劣化が防止され、かつ従来必要であった研摩後の洗
浄も不要になる等、性能的にもまだ工程削減によるコス
トの低減化にもその効果には著しいものがある。Effects of the Invention As mentioned above, the use of the present invention prevents the deterioration of rotational performance caused by conventional methods, and also eliminates the need for cleaning after polishing, which was required in the past, resulting in cost reductions due to process reduction. The effects of this are also remarkable.
第１図は従来の研摩テープの断面図、第２図は有機質バ
インダーの付着量と回転性能との関係を示す図、第３図
ａ〜ｆは小形電動機の電流波形と回転性能ランクを示す
図、第４１スは本発明に用いる研摩テープの断面図であ
る。Figure 1 is a cross-sectional view of a conventional abrasive tape, Figure 2 is a diagram showing the relationship between the amount of organic binder attached and rotational performance, and Figures 3 a to f are diagrams showing the current waveform and rotational performance rank of a small electric motor. , No. 41 is a sectional view of the abrasive tape used in the present invention.
Claims (3)
て、整流子表面を研摩することを特徴とする整流子の研
摩方法。(1) A commutator polishing method characterized by polishing the commutator surface with an abrasive tape that does not contain an organic binder.
砥粒をその表面に溶射して作製されたものであることを
特徴とする特許請求の範囲第１チｌ記載の整流子の研摩
方法。(2) The method for polishing a commutator according to claim 1, wherein the polishing tape is prepared by thermally spraying abrasive grains made of ceramic or metal powder onto the surface of the polishing tape.
の表面にセラミックまだは金属粉からなる砥粒を埋めこ
んだ研摩用テープであることを特徴とする特許請求の範
囲第１項捷たは第２項記戦の整流子の研摩方法。(3) The material of the abrasive tape is a thin metal plate, and the abrasive tape has abrasive grains made of ceramic or metal powder embedded in the surface of the abrasive tape. Or the commutator polishing method described in Section 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16221483A JPS6055845A (en) | 1983-09-02 | 1983-09-02 | Polishing method of commutator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16221483A JPS6055845A (en) | 1983-09-02 | 1983-09-02 | Polishing method of commutator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6055845A true JPS6055845A (en) | 1985-04-01 |
Family
ID=15750132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16221483A Pending JPS6055845A (en) | 1983-09-02 | 1983-09-02 | Polishing method of commutator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6055845A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011009212A (en) * | 2009-06-25 | 2011-01-13 | Schunk Kohlenstofftechnik Gmbh | Carbon brush |
-
1983
- 1983-09-02 JP JP16221483A patent/JPS6055845A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011009212A (en) * | 2009-06-25 | 2011-01-13 | Schunk Kohlenstofftechnik Gmbh | Carbon brush |
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