JPS6054499A - Counter of chip parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a counting device for chip components, and more particularly to a counting device suitable for counting the number of chip components such as chip resistors stored in a casing means such as a magazine.

In general, chip components such as chip resistors are extremely small, for example, in the form of a flat rectangular parallelepiped, and are stored in a magazine attached to an automatic wiring device for convenience such as automatic wiring to a wiring board and sent to customers. It has been shipped. The magazine has a rectangular cylindrical storage space that is large enough to accommodate the vertical and horizontal lengths of the chip components, and the chip components are stored one above the other inside. Then, the +1 lil number is counted manually or by optical detection, etc. at the time of storage.

FIG. 1 shows a conventional automatic chip component insertion device. The deep part 4 sent from the direction of arrow A through the chute 2 is transferred to the work guide 5 at the end of the chute 2, and then transferred to the magazine 6 arranged with the insertion port facing the end. The bushings 8 are sequentially transferred and stored in the direction of arrow C by a busher 8 that moves back and forth as shown by arrow B. In this case, a slit 10 is provided in the middle of the shooter 2, and the light source 12 and the fiber sensor 14 are placed between the slits 10 and 2, and the light reaching the fiber sensor 14 is blocked by the chip component 4 passing through the shooter 2. The passage of the chip component 4 is detected in this manner. Chip parts 4 are stored inside the magazine.
The counting was performed by detecting the operation of the bushing 8, and the number of times the button was operated was used as the counted value.

(2) Therefore, if the chip component 4 becomes clogged in the section from the position passing the detection point of the chip component 4 to the front of the bushing 8,
Since the pusher 8 operates even if there are no chip parts 4 and the counting continues, there is an inconvenience that the number of pieces stored in the magazine 6 and the number of pieces counted may not match, and if this is not discovered, the magazine 6 with an insufficient quantity may be There is a risk that it will be shipped as an appropriate product.

Also, the timing of falling to the position of the work guide 5,
If the timing at which the pusher 8 operates is off, the pusher 8 may cause damage to the chip components 4, and the defective products may be transferred to the magazine 6.
There is an inconvenience that even if the item is transferred to another country, it is also counted as the official number.

An object of the present invention is to provide a chip component counting device that prevents damage to chip components and improves the accuracy of counting the chip components being transferred.

This invention includes a suction device that suctions and transfers chip components, and a pressure sensor that detects pressure changes that occur when chip components are sucked into the negative pressure path of this suction device, and the output of this pressure sensor. -J is characterized by comprising a counting device that detects a signal (3) and counts the number of chip components to 11.

Hereinafter, the invention will be explained in detail with reference to the drawings and embodiments.

FIG. 2 shows an embodiment of the chip component counting device of the present invention, which is installed in a transfer device for transferring chip components. That is, this transfer device 16
Next, a suction device 18 for sucking and transferring the chip components 4 to be transferred is installed, and this suction device 18 is equipped with 691 pairs of suction pins 20 and 22. The suction pin 20 transfers the deep part 4 of the supply feeder 24 to the adjacent inspection table 26, and the other suction pin 22 transfers the deep part 4 of the supply feeder 24 to the inspection table 26.
The suction pins 20, 22 are installed to transfer the chip components 4 placed in the magazine 6 to the magazine 6, and the movement of these suction pins 20, 22 is controlled by a control device (not shown).

The inspection table 26 is provided with an inspection terminal (not shown) to inspect the quality of the chip component 4, and if it is defective, remove it from the table 26 by a removal device (not shown).

(4) Each suction pin 20.22 also has a negative pressure path 28.
is formed of a resin hose or the like, and each negative pressure path 28 is connected to a negative pressure forming device that provides a constant negative pressure -P, and control valves 30 and 32 that control the supply of negative pressure are individually installed. has been done. The opening and closing of the control valves 3o and 32 are controlled by a pressurization control device 34 at regular time intervals.

A differential pressure sensor 36 is installed in the negative pressure path 28 on the suction pin 22 side as a pressure sensor for detecting pressure changes when the chip component 4 is suctioned, and the detected force is given to the counting device 38. , the number of picked up chip components 4 is output as an electrical signal from its output terminal 4o.

FIG. 3 shows a specific example of the circuit configuration of the differential pressure sensor 36 and the counting device 38. That is, the differential pressure I! Nza 3
It is composed of a bridge circuit composed of a pressure conversion element 42 and resistors 44, 46, 48, and a driving power source 5o is connected between one terminal and taken out from between the other terminals. This output is amplified by an amplifier 52, passed through a variable resistor 54, amplified again by an amplifier 5G, and then fed to a 'ζ counting circuit 58. The δ11 loss path 58 can be configured by a calculation device in conjunction with the control device 34 and the like.

The operation will be explained based on the above configuration. Differential pressure sensor 3
6B Suction pin 22 generated when chip component 4 is suctioned
The pressure change in the side negative pressure path 28 is blown out as an electric signal, and the output becomes a pulse signal as shown in FIG. r'
o LtThe internal pressure of the negative pressure path 28 when the chip component 4 is not attracted even if the negative pressure -P acts, -P (<Po)
indicates the internal pressure when the chip component 4 is adsorbed,
It is possible to count the chip parts 4 by detecting whether or not the chip parts 4 are attracted from such different pressures, and by counting the pressure change once.

FIG. 5 shows the transfer of the chip component 4 and the timing at which the negative pressure -P is applied. In this case, the continuous chip components 4 are shown in the middle of being transferred, and the chip components 4 transferred by the suction pins 20 are placed on the inspection table 26. As shown in A, the suction pins 20 and 22 descend toward the chip component 4 in the direction of arrow a, and (6) stop on the second surface of the chip component 4 as shown in B.

At this time, or slightly before, the control device 34 detects the timing and opens the control valve 30.32, 1'tITE.
A negative pressure -P is applied to the passage 28. As a result, the chip component 4 is attracted to each suction pin 20, 22 and raised in the direction of the arrow. Next, the suction pins 20 and 22 raised to a certain height are moved in the direction of arrow C as shown in C while applying negative pressure -P. After the pin 22 is positioned above the magazine 6, it is lowered in the direction of arrow d as shown in D. In addition, the next chip component 4 is transferred to the supply feeder 24 as the chip component 4 is transferred. Next, as shown in E, when the chip component 4 is positioned on the −L side of the inspection table 26 and the opening of the magazine 6 is
0.32 and release the negative pressure -P. Each chip part 4
is separated from the suction pin 20.22 and placed on the inspection table 26, while being stored inside the magazine 6, and the suction pin 20.22 moves in the direction of arrow e. Next, as shown in F, each suction pin 20, (7) 22 moves in the direction of arrow f, and the chip component 4 falls into the magazine 6 in the direction of arrow g, and the suction pins 20, 22 move in the direction of arrow f. Return to the position shown in A. The second chip component 4 on the inspection table 26 is inspected within the time until the suction pin 22 arrives.

In this way, if the area of action of the negative pressure -P accompanying the transfer of the chip component 4 is constant and the chip component 4 is not attracted even if one negative pressure -P is applied, the pressure change in the negative pressure path 28 will be Since it is small, whether or not the chip component 4 is transferred, that is, the magazine 6
It is possible to detect the storage of the needle in the needle, allowing for a highly reliable stitch count. In particular, since the transfer means is different from conventional ones, there is no inconvenience such as the chip parts 4 being damaged during transfer, and the inconvenience of counting damaged chip parts as genuine ones can be eliminated. can.

According to experiments, in the conventional technique shown in FIG. 1, the shortage of 1 or 2 out of 200 items accounted for 60 to 70%, whereas in the embodiment of the present invention, the shortage of 1 or 2 out of 200 items accounted for 60 to 70%. The number of cases of cancer was improved to below 0.5 to 1% (8).

In the embodiment, the chip parts 4 are used to transfer and count the parts.
However, this chip component 4 includes not only a chip resistor but also a transistor, a capacitor, etc., and the present invention can also be used for transporting and counting small objects having a certain shape.

Furthermore, in the embodiment, the storage of chip components in a magazine was explained as an example, but the present invention counts the chip components to be transferred as they are transferred, and is not limited to storage in a magazine. do not have.

As explained above, according to the present invention, chip components to be transferred to a magazine or the like can be counted with high precision.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing a conventional automatic chip component insertion device, FIG. 2 is an explanatory diagram showing an embodiment of a chip component counting device of the present invention, and FIG. 3 is a specific diagram of a differential pressure sensor and a counting device. FIG. 4 is an explanatory diagram showing the waveform of the detection output, and FIG. 5 is an explanatory diagram showing the transfer of chip components. (9) 6...Magazine, 16...Transfer device, 20.22.
... Suction pin, 28... Negative pressure path, 36... Differential pressure sensor, 38... Counting device. (10) Fig. 1 Fig. 1 Fig. 2 "Q / Ta R Rubigi Fig. 5 (A) (B) (D) (E) -p P -P (C) CF)

Claims (1)

[Claims] A suction device that suctions and transfers chip components and a pressure sensor that detects the pressure change that occurs when chip components are sucked are installed in the negative pressure path of this suction device, and the output of this pressure sensor is detected. An H1 counting device for chip parts, characterized in that it is composed of an n1 counting device for counting J-tube parts;