JPS6054270A - ハンダ付装置 - Google Patents
ハンダ付装置Info
- Publication number
- JPS6054270A JPS6054270A JP16086483A JP16086483A JPS6054270A JP S6054270 A JPS6054270 A JP S6054270A JP 16086483 A JP16086483 A JP 16086483A JP 16086483 A JP16086483 A JP 16086483A JP S6054270 A JPS6054270 A JP S6054270A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- solder
- terminals
- substrate
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 11
- 229910000679 solder Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 230000003449 preventive effect Effects 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 230000002265 prevention Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 241000985694 Polypodiopsida Species 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005070 ripening Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16086483A JPS6054270A (ja) | 1983-08-31 | 1983-08-31 | ハンダ付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16086483A JPS6054270A (ja) | 1983-08-31 | 1983-08-31 | ハンダ付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6054270A true JPS6054270A (ja) | 1985-03-28 |
| JPS6121748B2 JPS6121748B2 (enrdf_load_stackoverflow) | 1986-05-28 |
Family
ID=15724021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16086483A Granted JPS6054270A (ja) | 1983-08-31 | 1983-08-31 | ハンダ付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6054270A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62212262A (ja) * | 1986-03-12 | 1987-09-18 | 新日本製鐵株式会社 | 炭素繊維強化炭素材料の製造方法 |
| JPS62241871A (ja) * | 1986-04-11 | 1987-10-22 | 新日本製鐵株式会社 | 炭素繊維強化炭素材料の製造法 |
| JPH01188468A (ja) * | 1988-01-22 | 1989-07-27 | Kobe Steel Ltd | 摩擦材用炭素繊維強化炭素複合材料 |
| US5525558A (en) * | 1992-06-16 | 1996-06-11 | Mitsubishi Chemical Corporation | Process for producing carbon fiber reinforced carbon composite material, carbon fiber reinforced carbon composite material and sliding material |
| EP2067561A1 (en) * | 2007-12-07 | 2009-06-10 | ASM Assembly Automation Ltd. | Dispensing solder for mounting semiconductor chips |
| CN111659968A (zh) * | 2019-03-06 | 2020-09-15 | 发那科株式会社 | 进行锡焊的机器人装置 |
-
1983
- 1983-08-31 JP JP16086483A patent/JPS6054270A/ja active Granted
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62212262A (ja) * | 1986-03-12 | 1987-09-18 | 新日本製鐵株式会社 | 炭素繊維強化炭素材料の製造方法 |
| JPS62241871A (ja) * | 1986-04-11 | 1987-10-22 | 新日本製鐵株式会社 | 炭素繊維強化炭素材料の製造法 |
| JPH01188468A (ja) * | 1988-01-22 | 1989-07-27 | Kobe Steel Ltd | 摩擦材用炭素繊維強化炭素複合材料 |
| US5554354A (en) * | 1988-01-22 | 1996-09-10 | Kabushiki Kaisha Kobe Seiko Sho | Carbon fiber-reinforced carbon composite material and process for producing the same |
| US5525558A (en) * | 1992-06-16 | 1996-06-11 | Mitsubishi Chemical Corporation | Process for producing carbon fiber reinforced carbon composite material, carbon fiber reinforced carbon composite material and sliding material |
| EP2067561A1 (en) * | 2007-12-07 | 2009-06-10 | ASM Assembly Automation Ltd. | Dispensing solder for mounting semiconductor chips |
| US7735715B2 (en) | 2007-12-07 | 2010-06-15 | Asm Assembly Automation Ltd | Dispensing solder for mounting semiconductor chips |
| CN111659968A (zh) * | 2019-03-06 | 2020-09-15 | 发那科株式会社 | 进行锡焊的机器人装置 |
| CN111659968B (zh) * | 2019-03-06 | 2022-08-09 | 发那科株式会社 | 进行锡焊的机器人装置 |
| US12017341B2 (en) | 2019-03-06 | 2024-06-25 | Fanuc Corporation | Robot apparatus for soldering |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6121748B2 (enrdf_load_stackoverflow) | 1986-05-28 |
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