JPS6051266B2 - Resin coating equipment for manufacturing tape carriers - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin coating device for manufacturing tape carriers.

As is well known, a tape assembly method is known as one method for automating the assembly process of IC (integrated circuit device) chips.

This method involves drilling sprocket holes and chip mounting holes in a strip of polyimide resin tape, pasting copper foil on one side with adhesive, and then selectively etching this copper foil to form a lead pattern. , forming a carrier tape to which the chip can be attached. Next, a chip made of circuit elements manufactured in a different manufacturing system is prepared, and a carrier tape that is continuously moved is superimposed on the chip that is intermittently supplied to connect the electrodes on the top surface of the chip and the inside of the chip mounting hole. The chip is connected to the carrier tape by welding to the inner end of the lead protruding from the carrier tape, and the chip and the inner end of the lead are sealed with resin (molding).
It is something to do. The tape carrier manufactured in this way (the tape on which the chip is fixed and sealed with resin) is then cut into individual semiconductor devices when used and lead to the desired wiring board, lead frame, etc. attached through the outer end of the By the way, the resin sealing work that is performed after fixing the chip to the carrier tape involves dividing the carrier tape after the chip is mounted at regular intervals, for example into two chips lined up, and applying a resin coating device called a dispenser one by one. Then, push out a certain amount of resin from the nozzle of the dispenser onto the 20 chips on one carrier tape, and use tweezers or a glass rod to avoid damaging the chips. There is a technology that hardens the resin by spreading it within a certain range and heating it with a heater installed at the bottom of the table to "baking" the resin, or by placing a resin tablet on the chip and then baking it. A known technique is to soften and melt the tablet, spread it over the entire area to be coated, and re-harden it.However, in the former technique, the area to be coated with resin is formed manually, so the thickness and spread are etc., resulting in non-uniform sealing reliability, and the use of a reel-to-reel system, which is an original feature of the tape assembly method, because a long strip of carrier tape is cut to a certain length and used. (
The tape unwound from the reel is assembled while it is moving forward, and the system in which the tape is then sequentially wound onto a take-up reel starting from its tip becomes impossible, which reduces work efficiency.

In addition, in the latter technology, the viscosity of the resin is high and air bubbles easily enter the inside, and the thickness of the sealing part is limited to 1.5 Tnm, for example.
It cannot be made thinner than below. This is to prevent the deterioration of the resin and the heat deterioration of the semiconductor elements sealed, so the tablet is
Since it can only be heated to around 50°C, the viscosity of the melted resin is high, making it difficult for the resin to spread.
In addition, with the latter technique, the tablets are easily crushed, causing dust to be generated and deteriorating the working environment. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a resin coating device for manufacturing tape carriers that can coat resin with high efficiency.

Another object of the present invention is to provide a resin coating device for manufacturing a tape carrier that can perform highly reliable sealing without generating bubbles inside the seal.

Furthermore, another object of the present invention is to provide a resin coating device for manufacturing a tape carrier, which can reduce the size of the sealing portion by thinly coating the resin.

In order to achieve such an object, the present invention has a tape feeding mechanism that feeds out a carrier tape with an IC chip mounted on a reel that is in the process of being assembled onto a sealing line, a transfer mechanism that intermittently transfers the tape, and ．． The resin application mechanism is equipped with a resin application mechanism that applies resin to the IC chip when the tape is stopped, a bake mechanism that heats and dries the resin, and a tape winding mechanism that winds the resin around the tape carrier after resin sealing. Along with squeezing out the resin, pendulum-shaped luck! The present invention is applied to an IC chip of a tape by circular reciprocating motion by a moving mechanism, and the present invention will be explained in detail below with reference to Examples.

FIG. 1 shows an embodiment of a resin coating apparatus for manufacturing a tape carrier according to the present invention.

In the figure, a carrier tape delivery mechanism 1, a tape transport mechanism 2, a resin coating mechanism 3, a baking oven 4, and a carrier tape winding mechanism 5 are sequentially arranged from the left side to the right side. Further, a control unit 7 is provided at the lower center of the front surface of the machine stand 6, and a hot air generation mechanism 8 for generating hot air to be sent to the baking oven 4 is provided at the center rear. Also, machine 6
An upper draft 9 and an exhaust duct 10 are provided at the upper part of the air conditioner. Then, the carrier tape 12 to which the chip has been fixed is sequentially released from the releasing reel 11 of the carrier tape sending mechanism 1, and
A tape transport mechanism 2 sends a carrier tape 12 to a resin coating mechanism 3, and the resin coating mechanism 3 coats the area of the carrier tape with resin. Further, while the carrier tape 12 coated with resin moves through the long baking oven 4, the resin portion is baked and solidified, and then exits the baking oven 4 and is transferred to the take-up reel 13 of the carrier tape winding mechanism 5. It is wound up. At this time, the spacer tape 15 is unwound from the adjacent spacer tape unwinding reel 14, and this spacer tape 15 is attached to the carrier tape 12.
By wrapping the carrier tapes 12 in an overlapping manner, the semiconductor devices of the overlapping carrier tapes 12 are prevented from coming into direct contact with each other. This spacer tape is also used in the carrier tape delivery mechanism 1 to prevent damage to overlapping chips and lead patterns of the carrier tape 12. That is, a spacer tape 16 is wound around the release reel 11 of the carrier tape delivery mechanism 1 so as to overlap the carrier tape 12. The spacer tape 16 unwound by unwinding the carrier tape 12 is sequentially wound onto a take-up reel 17 disposed adjacent to the unwinding reel 11. Next, referring to Figure 2, install carrier tape 1.
The second transfer mechanism will be briefly explained. The carrier tape 12 is configured to pass through a narrow gap (not shown) in the tape feed section main body 18, and a tape feed claw 19 is disposed above this gap. A long groove is provided on the upper surface of one end of the tape feeding claw 19 in a direction perpendicular to the direction in which the carrier tape 12 extends, and a roller 22 attached to the end surface of a cam 21 fixed to the rotating shaft of a motor 20 is installed in this groove. They are mated. The roller 22 is eccentric with respect to the center of the rotating shaft of the motor 20, and one revolution of the motor 20 causes the tape feeding claw 19 to reciprocate once in the longitudinal direction of the carrier tape 12. Further, on the lower surface of this tape feeding claw 19, claws (not shown) are provided which temporarily protrude into sprocket holes (not shown) provided at regular intervals on both sides of the carrier tape 12, and when the claws protrude into the sprocket holes, the carrier The tape 12 is conveyed at a predetermined interval. Furthermore, a positioning piece 23 having a claw (not shown) that protrudes into the sprocket hole of the carrier tape 12 and positions the carrier tape 12 is provided on one end side of the tape feed section main body 18. Further, a microswitch 24 is in contact with the cam 21 to detect one rotational movement of the cam 21. Further, the tape transport mechanism 2 and the release reel 11
A tension roller 25 is attached to the carrier tape 12 between the
are in contact. This tension roller 25 is rotatably attached to the tip of an elongated tension par 27 that swings around a shaft 26.
is always rotated to the left around the shaft 26 by a spring (not shown).
That is, the carrier tape 12 is rotated so as to be released and pulled back toward the reel 11, thereby applying tension to the carrier tape 12. A slit 28 is provided at the rear end of the tensioner 27, and two detection mechanisms each consisting of a light source and a phototransistor 29 (not shown) are provided above and below the movement range of the slit 28. . When the carrier tape 12 is transported by the tape transport mechanism 2, the tension roller 25 rotates clockwise around the shaft 26, and the slit 28 at the rear end of the tensioner 27 is connected to the tape feeding start detection mechanism on the left side in the figure. 30
When the light reaches the detection section, it passes through the slit 28 and reaches the phototransistor 29. As a result, a motor (not shown) is rotated by the tape feeding start detection mechanism 30, and the release reel 11 is rotated to feed the carrier tape 12. Then, the tension roller 25 rotates to the left due to the elasticity of the spring, but when detected by the tape feed stop detection mechanism 31 on the right side, the release reel 11 stops rotating and the feeding of the carrier tape 12 stops. do. on the other hand,
A tension roller 32 is disposed between the tape transport mechanism 2 and the take-up reel 13 in the same manner as described above.

This tension roller 32 is attached to the tip of a tensioner 34 that swings around a shaft 33, and is always rotated clockwise around the shaft 33 by a spring (not shown) to apply tension to the carrier tape 12. ing. In addition, a slit 35 is provided at the rear end of the tension par 34.
is provided, and two optical detection mechanisms are arranged in the movement range of this slit 35, and the right tape winding start detection mechanism 36 rotates the take-up reel 13 and starts rolling the carrier tape 12. The winding of the carrier tape 12 is stopped by starting winding and stopping the rotation of the take-up reel 13 by operating the tape winding stop detection mechanism 37 on the left side. Next, the resin application mechanism will be explained with reference to FIG.

As shown in FIG. 1, the nozzle 38 for dispensing the resin of the resin application mechanism 8 is fixed to a support piece 40 that swings about a shaft 39, and its tip extends downward. Further, as shown in FIG. 4, this nozzle 38 has a flat tip, and its width is formed to be approximately the same as the width of the area to which the resin is applied. Further, the flat surface of the nozzle 38 extends in a direction perpendicular to the longitudinal direction of the carrier tape 12, and the nozzle 38 swings in a direction along the longitudinal direction of the carrier tape 12. Further, a connecting tube 41 is connected to the upper end of the nozzle 38 , and this connecting tube 41 is inserted into a resin container 43 placed in a pressure chamber 42 . A vibrator 44 is attached to the pressure chamber 42, and compressed air is sent into the pressure chamber from the vibrator 44. Further, one end of the connecting tube 41 is inserted into a low-viscosity resin 45 housed in a resin container 43. Therefore, when compressed air is sent into the pressure chamber 42 from the vibrator 44, the surface of the resin 45 is pushed down by the air, so the resin 45 passes through the connecting tube 41 and reaches the nozzle 538, and the surface of the resin 45 is pushed down by the air. It is pushed out from the tip. Therefore, as shown by the chain line in FIG. 5, the nozzle 38 is lowered to face the area to be coated on the carrier tape 12, and the nozzle 38 is made one reciprocating pendulum movement back and forth in the longitudinal direction of the carrier tape 12, and the nozzle 038 A resin 45 extruded from the tip is applied. Then, the resin 45 comes to cover a portion of the polyimide resin 46, the chip 47, and the inner ends of the leads 48 on one side. Figure 5 shows carrier tape 12
The figure shows the back side of which is coated with resin. The amount of resin extruded (the amount of application) can be adjusted by adjusting the air pressure in the pressure chamber and the ejection time. Further, these controls are performed using a conventionally known dispenser method. Furthermore, the length of descent of the nozzle can be freely set. In addition, the inside of the baking oven 4 is constructed so that the hot air generated by the hot air generating mechanism 8 flows into a hot air sending vibe (not shown) and is blown out from small holes provided around this vibe. is designed to maintain the temperature at the optimum baking temperature. Furthermore, this baking oven is longer than conventional ovens at 2 m, so that the resin is cured while the carrier tape moves inside the oven. Therefore, after the resin coating is completed on one side, this resin coating apparatus is used again to cover the remaining side with resin, as shown in FIG. 6, to manufacture a tape carrier. According to such an embodiment, the following effects occur.

(1) Since the process of unwinding the carrier tape from the reel and winding the carrier tape onto the reel can be performed automatically, the resin application work time is shortened.

(2) Since the resin is applied while moving the nozzle in a pendulum shape, the resin is applied as shown in Figure 5.
The resin is applied to the entire region to be coated, and the amount of resin coated is small at the reciprocating end region of the nozzle.

Therefore, the chip etc. can be covered thinly and completely with the resin. (3) Since a liquid resin with low viscosity is applied to the area to be applied, air in the resin escapes from the resin.

Therefore, even if the coating layer is thin, sealing can be ensured, and highly airtight sealing can be achieved. (4) Since liquid resin is used, crushing does not occur unlike tablet resin.

Therefore, the work environment will not be contaminated with dust. Note that the present invention is not limited to the above embodiments.

Ta! For example, the above embodiment is an example in which resin is applied to one side (back side) of the carrier tape, but the carrier tape that has passed through the baking oven is arranged so as to be folded upward, and
By arranging the resin coating device, the baking oven, and the tape winding device in series, the resin may also be coated on the other side (front surface) of the carrier tape. By doing this, you can further streamline the resin coating work (
automation). As described above, according to the resin coating apparatus for manufacturing tape carriers of the present invention, while sequentially feeding a strip-shaped carrier tape in a continuous state, a thin layer of resin is applied to one or both sides of the carrier tape (for example,
0.8wn compared to the conventional thickness of 1.5Ttm) and can be applied reliably and automatically.

Therefore, it is possible to achieve miniaturization and to efficiently manufacture highly reliable semiconductor devices (tape carriers). Furthermore, according to the present invention, since the resin is applied using a low-viscosity liquid resin, there is less generation of air bubbles in the sealing resin, and the airtightness of the seal can be improved, and the resin can be crushed. It has many effects such as not polluting the work environment.

[Brief explanation of the drawing]

FIG. 1 is an external view of an embodiment of the resin coating apparatus for manufacturing tape carriers of the present invention, FIG. 2 is an explanatory diagram of each mechanism that feeds the tape, and FIG. 3 is an explanatory diagram of the resin coating mechanism. , Fig. 4 is a perspective view of the nozzle, Fig. 5 is an explanatory diagram showing the state in which resin is applied to the back side of the carrier tape, and Fig. 6 is an explanatory diagram showing the state in which resin is applied to the back side of the carrier tape and cured. , is an explanatory diagram showing a state in which resin is applied to the surface. 1...Carrier tape delivery mechanism, 2...
・Tape transport mechanism, 3... Luzin application mechanism, 4.
... Bake oven, 5 ... Carrier tape winding mechanism, 6 ... Machine stand, 1 ... Control section, 8
...Hot air generation mechanism, 9... Upper draft, 1
0... Exhaust duct, 11... Release reel, 12... Carrier tape, 13... Take-up reel, 14... Spacer tape release reel, 15, 16... spacer tape, 17...
・Take-up reel, 18... Tape feeding section main body, 1
9... Tape feed claw, 20... Motor,
21...Cam, 22...Roller, 23
...Positioning piece, 24...Micro switch,
25...Tension roller, 26...Shaft, 27...Tension par, 28...Slit, 2
9... Phototransistor, 30... Tape feeding start detection mechanism, 31... Tape feeding stop detection mechanism, 32... Tension roller, 33
...Axis, 34...Tension par, 3
5...Slit, 36...Tape winding start detection mechanism, 37...Tape winding stop detection mechanism, 38
... Nozzle, 39 ... Shaft, 40 ... Support piece, 41 ... Connection tube, 42 ... Pressure chamber, 43 ... Lugin storage device, 44 ... Vibe, 45 ... Luzin, 46 ... Polyimide resin,
47... Chip, 48... Lead.

Claims (1)

[Claims] 1. A tape delivery mechanism that sends out the IC chip-loaded carrier tape that is being assembled onto a reel onto a sealing line;
A transport mechanism that intermittently transports the tape, a resin application mechanism that applies resin to the IC chip when the tape is stopped, a bake mechanism that heats and dries the resin, and a tape winding mechanism that winds the tape onto a tape carrier after sealing with resin. The resin application mechanism squeezes out the resin from the nozzle, and
The IC of the tape is controlled by the circular reciprocating movement by the pendulum-like movement mechanism.
A resin coating device for manufacturing tape carriers, which is characterized by coating resin on chips.