JP2003066478A - Anisotropic conductive film sticking device and anisotropic conductive film sticking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely stick an ACF onto a glass substrate without peeling of the ACF even if an ambient temperature rises in an ACF sticking step. SOLUTION: The ACF tape formed by pasting the anisotropic conductive film (ACF) on a base tape is supplied to the substrate side in the ACF sticking step of supplying the tape pasted with the anisotropic conductive film to the substrate and sticking the anisotropic conductive film to this substrate by thermocompression bonding. At this time, the anisotropic conductive film pasted to this tape is cooled. As a result, even if the ambient temperature rises, the thermal deterioration of the ACF can be prevented. The ACF can be stuck onto the substrate without peeling of the ACF.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to outer lead bonding (O) which is one of the manufacturing processes of liquid crystal display devices and the like.
LB) tape carrier package (TC
Anisotropic conductive film sticking device for sticking ACF on a substrate suitable for use when mounting an electronic component such as P) on a substrate such as a glass substrate of a liquid crystal display device through an anisotropic conductive film (ACF) (ACF sticking device) and anisotropic conductive film sticking method (ACF sticking device)
Pasting method).

[0002]

2. Description of the Related Art Conventionally, for example, in an outer lead bonding (OLB) process which is one of the manufacturing processes of liquid crystal display devices, after cleaning a terminal portion of a glass substrate of a liquid crystal display device, an ACF (different A is attached.
There is a CF attachment process. Then, through this ACF, TC
Proceed to the TCP temporary pressure bonding step of temporarily bonding P (tape carrier package) to the glass substrate and the TCP main pressure bonding step of heating the TCP temporarily pressure bonded to the glass substrate in this TCP temporary pressure bonding step to completely pressure bond the glass substrate. .

ACF used in the conventional ACF sticking process
In the pasting device, as shown in FIG.
The CF tape 10 (which is formed by adhering the ACF to the base tape) is supplied to the glass substrate 20 side, and the tool 3 presses the ACF tape 10 from above to remove the ACF attached to the base tape. It is attached to the terminal portion of the glass substrate 20. The tool 3 has a built-in heater, and while heating the ACF tape 10, AC is applied to the terminal portion.
F (not shown) is thermocompression bonded. ACF on glass substrate 20
The base tape 11 from which the ACF has been peeled off by thermocompression bonding is wound on the winding reel 2.

[0004]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
In the pasting device, since it is necessary to perform thermocompression bonding when adhering the ACF to the glass substrate 20, the temperature inside the device rises (30 ° C. or higher) due to heat radiated from the heater in the tool 3 which is a heat source of the thermocompression bonding. On the other hand, the ACF tape 10 varies depending on the type, but generally when the temperature is 28 ° C. or higher,
It has the property of promoting deterioration due to heat.

Therefore, when the temperature inside the apparatus rises as described above, the ACF tape 10 is heated due to the influence of the temperature, and the AC
The F tape 10 is thermally deteriorated while being wound around the supply reel 1, and the adhesiveness of the ACF is deteriorated. Even if the ACF of the ACF tape 10 which has been thermally deteriorated is attached to the terminal portion of the glass substrate 20, the end portion of the ACF tape is turned over. When TCP is permanently pressure-bonded to the turned-up ACF, the TCP is attached to the glass substrate. Some parts are not crimped.

Therefore, when the above-mentioned ACF curl occurs, a sensor or the like detects this, the glass substrate in which the ACF curl has occurred is taken out as an error, and the ACF is pasted again. There was a problem that production efficiency deteriorated.

The present invention has been made to solve the above-mentioned conventional problems, and an object thereof is to prevent the anisotropic conductive film from being turned over due to an increase in ambient temperature due to heat radiation from a heater. An anisotropic conductive film sticking device and an anisotropic conductive film sticking method capable of surely sticking an anisotropic conductive film to a substrate.

[0008]

In order to achieve the above-mentioned object, the first feature of the present invention is to supply an ACF tape formed by sticking an anisotropic conductive film to a base tape to the substrate side, An anisotropic conductive film sticking device for sticking the anisotropic conductive film of the ACF tape to a substrate by thermocompression bonding is provided with a cooling means for cooling the ACF tape.

A second feature of the present invention is that an ACF tape formed by sticking an anisotropic conductive film to a base tape is supplied to the substrate side, and the anisotropic conductive film of the ACF tape is thermocompression bonded to the substrate. In the method of sticking an anisotropic conductive film, the ACF tape supplied to the substrate side is cooled.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a configuration according to an embodiment of the anisotropic conductive film sticking apparatus of the present invention. However, the portions corresponding to the conventional example will be described with the same reference numerals.

This anisotropic conductive film (ACF) sticking device is
Supply reel 1, base tape 11 for supplying ACF tape 10 (which is constructed by adhering ACF to a base tape)
It has a take-up reel 2 for winding the ACF tape 10, a tool 3 for thermocompression bonding the ACF tape 10 to the glass substrate 20, a cooling nozzle 4 for cooling the supply reel 1, and a cooling nozzle 5 for cooling the ACF tape 10. ..

FIG. 2 is a front view of the supply reel 1. Figure 2
As shown in FIG. 3, the cooling nozzle 4 is arranged on the side surface side of the supply reel 1 so that the outlet of the cooling air 50 faces, and the cooling air 5 is directly supplied to the ACF tape 10 fed from the supply reel 1.
The cooling nozzle 5 is arranged so that 0 hits.

FIG. 3 is a diagram showing a configuration example of a cooling device having cooling nozzles 4 and 5.

In the cooling device shown in FIG. 3, the pipe 6 to which the positive pressure air is supplied from the compressed air source 14 has a solenoid valve 7, a flow rate adjusting valve 8, a mist separator 9 and a cooler 12 in the middle thereof.
Is connected to the cooling nozzle 4, and the pipe 6 is branched and connected to the cooling nozzle 5 via the ionizer 13.

Next, the operation of this embodiment will be described.
The ACF tape 10 is supplied from the supply reel 1 to the glass substrate 20 side, and the tool 3 presses the ACF tape 10 from above to attach an ACF (anisotropic conductive film) to the terminal portion of the glass substrate 20. Since the tool 3 has a built-in heater, the tool 3 heats the ACF tape 10 and thermocompression-bonds the ACF to the terminal portion. ACF is glass substrate 20
The remaining base tape 11 after being attached to is wound on the winding reel 2.

At this time, the supply reel 1 is cooled by the cooling air 50 blown from the nozzle 4, and the ACF tape 10 is cooled.
Is cooled by the cooling air 50 blown from the nozzle 5. As a result, even if the temperature inside the device is increased by the heat radiated from the heater built in the tool 3,
Since the supply reel 1 and the ACF tape 10 are cooled by the cooling air 50, the ACF of the ACF tape 10 is sent to the glass substrate 20 side in a state where thermal deterioration is suppressed. Therefore, the ACF is thermocompression-bonded by the tool 3 to the terminal portion of the glass substrate 20 without causing any trouble such as turning over.

Here, the nozzles 4 and 5 are supplied with air cooled by a cooling device as shown in FIG. That is,
When the electromagnetic valve 7 is turned on, the air from the compressed air source 14 is supplied to the flow rate adjusting valve 8 through the electromagnetic valve 7, and the air adjusted to a predetermined flow rate is cooled by removing dust by the mist separator 9. Sent to the container 12. The air cooled to 10 ° C. to 20 ° C. by the cooler 12 is sent to the cooling nozzle 4 and blown out to the side surface side of the supply reel 1 from the blowout port.

On the other hand, the air cooled by the cooler 12 is ionized by the ionizer 13, and the ionized cooling air is sent to the cooling nozzle 5 and blown out to the ACF tape 10 from its outlet. By adjusting the flow rate of the air with the flow rate adjusting valve 8, the cooling air 50 blown out from the cooling nozzles 4 and 5 does not interfere with the feeding of the ACF tape 10 due to the cooling air blowing on the ACF tape 10.
Strength (wind force) is adjusted.

When the ACF tape 10 is taken out from the supply reel 1, static electricity is generated and charged. Therefore, if the ACF tape 10 is brought to the glass substrate 20, the ACF tape 10 is left as it is and the ACF tape 10 is pulled by the glass substrate. There is a case where the ACF is stuck on the glass substrate 20 and the like, and the ACF cannot be properly thermocompression bonded to the glass substrate 20. Therefore, the ionized cooling air 50 blown out from the cooling nozzle 5 is blown onto the ACF tape 10 to eliminate the charge on the ACF tape 10 and achieve thermocompression bonding at a reliable position.

According to this embodiment, the ACF tape 10 and its supply reel 1 are cooled by the cooling air 50, so that the AC
Even if the ambient temperature of the ACF tape 10 rises because the temperature inside the apparatus rises due to the heater for thermocompression bonding of F, the ACF tape 10 is cooled and its temperature rise is prevented, so that heat deterioration is caused. The ACF can be thermocompression-bonded to the glass substrate 20 in a state where the above is suppressed. Therefore, the ACF is less likely to be turned over during the thermocompression bonding, and it is possible to reduce the sticking error and improve the production efficiency.

Further, the cooling air 5 blown out from the cooling nozzle 5
Since 0 is ionized by the ionizer 13 and the ACF tape 10 can be destaticized, it is not necessary to separately provide a destaticizing means, and the space can be saved accordingly.

The present invention is not limited to the above-described embodiments, and can be implemented in various other modes in specific configurations, functions, actions, and effects without departing from the scope of the invention. . For example, the purpose of cooling the supply reel 1 with the cooling nozzle 4 is to cool the internal ACF tape 10 wound around the supply reel 1. In short, if the ACF tape 10 is cooled, the cooling nozzle The arrangement and number are not limited to those in the above embodiment.

Further, although the example in which the anisotropic conductive film is attached to the glass substrate of the liquid crystal display device has been described, another substrate, for example,
It can also be applied to a device for sticking an anisotropic conductive film on a glass substrate of a plasma display panel.

[0024]

As described in detail above, according to the present invention, the anisotropic conductive film is prevented from being turned over by preventing the anisotropic conductive film from being curled up due to the rise in ambient temperature due to heat radiation from the heater. It can be reliably attached.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration according to an embodiment of an anisotropic conductive film sticking apparatus of the present invention.

FIG. 2 is a front view of the supply reel shown in FIG.

FIG. 3 is a diagram showing a configuration example of a cooling device having the cooling nozzle shown in FIG.

FIG. 4 is a diagram showing a schematic configuration example of a conventional anisotropic conductive film sticking apparatus.

[Explanation of symbols] 1 supply reel 2 take-up reel 3 tools 4, 5 cooling nozzle 10 ACF tape 11 base tape 13 Ionizer

Claims (5)

[Claims] 1. An ACF tape formed by sticking an anisotropic conductive film to a base tape is supplied to a substrate side, and the ACF tape is attached to the substrate.
An anisotropic conductive film sticking device for bonding an anisotropic conductive film of a CF tape by thermocompression bonding, comprising cooling means for cooling the ACF tape. 2. The cooling means blows cooling air to the ACF tape to cool the anisotropic conductive film, and also blows cooling air to the supply reel around which the ACF tape is wound to cool the supply reel. It has a structure, The anisotropic conductive film sticking apparatus of Claim 1 characterized by the above-mentioned. 3. The cooling means comprises ionizing means for ionizing the cooling air, and the cooling air ionized by the ionizing means is applied to the ACF tape to cause the A
The anisotropic conductive film sticking device according to claim 1 or 2, wherein the CF tape is discharged. 4. The anisotropic conductive film sticking apparatus according to claim 2, wherein the cooling unit includes an adjusting unit that adjusts the wind force of the cooling wind. 5. An ACF tape formed by sticking an anisotropic conductive film to a base tape is supplied to the substrate side, and the ACF tape is attached to the substrate.
An anisotropic conductive film sticking method in which an anisotropic conductive film of a CF tape is bonded by thermocompression bonding, wherein the ACF tape supplied to the substrate side is cooled.