JPS6050002B2 - Ceramic substrate manufacturing method - Google Patents
Ceramic substrate manufacturing methodInfo
- Publication number
- JPS6050002B2 JPS6050002B2 JP773281A JP773281A JPS6050002B2 JP S6050002 B2 JPS6050002 B2 JP S6050002B2 JP 773281 A JP773281 A JP 773281A JP 773281 A JP773281 A JP 773281A JP S6050002 B2 JPS6050002 B2 JP S6050002B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- substrate
- manufacturing
- thin film
- slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Inorganic Insulating Materials (AREA)
Description
【発明の詳細な説明】
本発明は凸凹構造を有する特殊形状の薄膜セラミック基
板を製造するセラミック基板の製造方法に関するものて
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a ceramic substrate manufacturing method for manufacturing a specially shaped thin film ceramic substrate having an uneven structure.
従来凸凹構造を有する特殊形状の薄膜セラミック基板を
製造する方法としては、（力 シートをあらかじめ打ち
抜き、その後ホットプレスで積層して製造する方。Conventionally, the method of manufacturing a special-shaped thin film ceramic substrate with an uneven structure is to punch sheets in advance and then laminate them using a hot press.
（ィ）粉体を用い、乾式成形で製造する方法。(a) A method of manufacturing by dry molding using powder.
の２通りが知られている。しかし、上記（アの方法は、
製造工程が非常に複雑でコスト高であり、小さくて複雑
な凸凹構造のものはできない。Two ways are known. However, the above (method A)
The manufacturing process is extremely complicated and costly, and it is not possible to manufacture products with small and complicated uneven structures.
また、上記（イ）の方法は粉体の均一充填が非常に難し
く、焼成時に変形、ヒズミが発生し、薄膜セラミック基
板を製造するのは困難てある。本発明はこれらの欠点を
なくすためになされたものであり、さらに複雑な凸凹構
造を有する薄膜セラミック基板を製造することが可能な
製造方法を提案するものてある。Furthermore, in the method (a) above, it is very difficult to uniformly fill the powder, and deformation and distortion occur during firing, making it difficult to manufacture thin film ceramic substrates. The present invention has been made to eliminate these drawbacks, and proposes a manufacturing method capable of manufacturing a thin film ceramic substrate having a more complicated uneven structure.
本発明は微粉砕されたセラミック粉末に樹脂、可塑剤、
溶剤等を適量加え、ボールミル等で均一に混合してスラ
リーとし、これを金属板等にエッチング等により凸凹構
造の特殊加工をほどこし、さらに表面にシリコン等の離
形材を処理した基板の上に流し込み、乾燥後、剥離し製
造するものである。The present invention combines finely pulverized ceramic powder with resin, plasticizer, and
Add an appropriate amount of solvent, mix uniformly with a ball mill, etc. to make a slurry, apply special processing to a metal plate etc. to create an uneven structure by etching, and then spread it on a substrate whose surface has been treated with a release material such as silicon. It is manufactured by pouring it, drying it, and then peeling it off.
以下、図面を参照しながら、本発明の実施例を詳述する
。Embodiments of the present invention will be described in detail below with reference to the drawings.
泥装は下記組成のアルミナスラリーである。The slurry is an alumina slurry with the following composition.
アルミナ粉末（平均粒径１．０μ）・・・１０嘲（重量
）
粘結剤（ポリビニルブチラール）
・・・ ７部（〃）
可塑剤（ジブチルフタレート）・・・４部（〃）分散剤
（ラピゾール） ・・・０．１部（〃）トルエン ・・
・１５部（〃）イソプロピルアルコール ・・・２臨（
〃）このアルミナスラリーを第１図、第２図に１で示す
。Alumina powder (average particle size 1.0μ)...10 parts (weight) Binder (polyvinyl butyral)...7 parts (〃) Plasticizer (dibutyl phthalate)...4 parts (〃) Dispersant ( Rapizol)...0.1 part (〃)Toluene...
・15 parts (〃) Isopropyl alcohol ・・・2 parts (
〃) This alumina slurry is shown as 1 in Figs. 1 and 2.
そして、第３図に示すようなＯ、３ｗｆｍの薄鋼板をエ
ッチング加工し角形に抜いた第１基板２Ａ、と１、Ｏｗ
ｌｍの鋼板よりなる第２基板２Ｂを貼り合せ、その上に
剥離性をよくするために離形剤としてシリコンを塗布し
てなる凹凸構造の加工が施こされた基板２上へ上記スラ
リー１を流し込む。次いで、これを一定隙間を有するブ
レード３で薄く引き伸ばして成形を行う。この際気泡等
の抱き込みに注意して行わなければならない。その後、
乾燥機を用いて、４０′Ｃ−３０分、８０℃−２０分、
１１０℃一１紛で乾燥を行つた。従つて、基板２として
は１５０℃ぐらいまでの温度に耐え得るものでなければ
ならなく、セラミック基板等の無機材料で構成すること
もできる。次いで剥離後、空気中で４００℃の温度で３
時間バインダーアウトし、１６００℃の温度で２時間焼
成して薄膜セラミック基板を製造した。以上のように、
本発明方法によれば非常に容易に凸凹構造を有する特殊
形状のセラミック基板を製造することが可能で、さらに
基板２を用途によりエッチング加工等で非常に複雑な形
状に加工することにより、より複雑な凸凹構造を有する
薄膜セラミック基板を製造できるものである。Then, as shown in FIG.
A second substrate 2B made of a steel plate of lm is laminated, and the slurry 1 is applied onto the substrate 2, which has an uneven structure formed by applying silicon as a mold release agent to improve releasability. Pour. Next, this is stretched thinly with a blade 3 having a certain gap to form a shape. At this time, care must be taken to avoid trapping air bubbles, etc. after that,
Using a dryer, 40'C - 30 minutes, 80°C - 20 minutes,
Drying was carried out at 110°C. Therefore, the substrate 2 must be able to withstand temperatures up to about 150° C., and may be made of an inorganic material such as a ceramic substrate. Then, after peeling, it was heated in air at a temperature of 400°C for 3
The binder was removed for a period of time and then baked at a temperature of 1600° C. for 2 hours to produce a thin film ceramic substrate. As mentioned above,
According to the method of the present invention, it is possible to very easily manufacture a ceramic substrate with a special shape having an uneven structure.Furthermore, by processing the substrate 2 into a very complicated shape by etching or the like depending on the purpose, it is possible to make the ceramic substrate even more complicated. A thin film ceramic substrate having a rough structure can be manufactured.
第１図は本発明のセラミック基板の製造方法における一
実施例を示す断面図、第２図は同平面図、第３図イ，Ｃ
３Ｃま本発明方法を説明するための２種類の基板の平面
図である。
１・・・・・・スラリー、２・・・・・・基板。FIG. 1 is a sectional view showing an embodiment of the method for manufacturing a ceramic substrate of the present invention, FIG. 2 is a plan view of the same, and FIGS.
3C is a plan view of two types of substrates for explaining the method of the present invention. 1...Slurry, 2...Substrate.
Claims (1)
に凸凹構造の加工を施し、さらに離形剤を付与した基板
を用い、この上にセラミック粉末、可塑剤、粘着剤、分
散剤、溶媒よりなるスラリーを流し込み、乾燥後剥離し
、その後焼成を行い、凸凹構造を有する特殊形状の薄膜
セラミック基板を得ることを特徴とするセラミック基板
の製造方法。1. A substrate made of an inorganic or metallic material that can withstand temperatures up to 150°C is processed into a convex-concave structure, and a mold release agent is added, and then ceramic powder, a plasticizer, an adhesive, a dispersant, and a solvent are placed on top of the substrate. A method for manufacturing a ceramic substrate, characterized by pouring a slurry, drying and peeling, and then firing to obtain a specially shaped thin film ceramic substrate having an uneven structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP773281A JPS6050002B2 (en) | 1981-01-20 | 1981-01-20 | Ceramic substrate manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP773281A JPS6050002B2 (en) | 1981-01-20 | 1981-01-20 | Ceramic substrate manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121107A JPS57121107A (en) | 1982-07-28 |
| JPS6050002B2 true JPS6050002B2 (en) | 1985-11-06 |
Family
ID=11673874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP773281A Expired JPS6050002B2 (en) | 1981-01-20 | 1981-01-20 | Ceramic substrate manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6050002B2 (en) |
-
1981
- 1981-01-20 JP JP773281A patent/JPS6050002B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57121107A (en) | 1982-07-28 |
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