JPS6049670U - Wet multilayer board - Google Patents

Wet multilayer board

Info

Publication number
JPS6049670U
JPS6049670U JP14026983U JP14026983U JPS6049670U JP S6049670 U JPS6049670 U JP S6049670U JP 14026983 U JP14026983 U JP 14026983U JP 14026983 U JP14026983 U JP 14026983U JP S6049670 U JPS6049670 U JP S6049670U
Authority
JP
Japan
Prior art keywords
multilayer board
insulating layer
wet multilayer
layer
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14026983U
Other languages
Japanese (ja)
Inventor
及川　昇司
文雄 中村
Original Assignee
株式会社日立製作所
日立ビデオエンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所, 日立ビデオエンジニアリング株式会社 filed Critical 株式会社日立製作所
Priority to JP14026983U priority Critical patent/JPS6049670U/en
Publication of JPS6049670U publication Critical patent/JPS6049670U/en
Pending legal-status Critical Current

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  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の湿式多層基板の断面図、第２図は本考案
−実施例の断面図である。 １・・・最上部電極層、２・・・内部電極層、３・・・
アルミナ絶縁層、４・・・アルミナグリーンシート、５
・・・無電解鍍金属、６・・・ピンホール、７・・・ガ
ラス絶縁層。FIG. 1 is a sectional view of a conventional wet multilayer substrate, and FIG. 2 is a sectional view of an embodiment of the present invention. 1... Top electrode layer, 2... Internal electrode layer, 3...
Alumina insulation layer, 4... Alumina green sheet, 5
... Electroless plated metal, 6... Pinhole, 7... Glass insulating layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] アルミナ絶縁層を用いた湿式多層基板において、厚膜印
刷法で形成する最上部電極層と此の層の下のアルミナ絶
縁層との間に、ガラス絶縁層を介在させたことを特徴と
する湿式多層基板。A wet type multilayer substrate using an alumina insulating layer, characterized in that a glass insulating layer is interposed between the top electrode layer formed by a thick film printing method and the alumina insulating layer below this layer. Multilayer board.
JP14026983U 1983-09-12 1983-09-12 Wet multilayer board Pending JPS6049670U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14026983U JPS6049670U (en) 1983-09-12 1983-09-12 Wet multilayer board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14026983U JPS6049670U (en) 1983-09-12 1983-09-12 Wet multilayer board

Publications (1)

Publication Number Publication Date
JPS6049670U true JPS6049670U (en) 1985-04-08

Family

ID=30314117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14026983U Pending JPS6049670U (en) 1983-09-12 1983-09-12 Wet multilayer board

Country Status (1)

Country Link
JP (1) JPS6049670U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368195A (en) * 1989-08-05 1991-03-25 Nippondenso Co Ltd Laminated ceramic board and manufacture thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648197A (en) * 1979-09-28 1981-05-01 Hitachi Ltd Method of manufacturing ceramic multilayer circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5648197A (en) * 1979-09-28 1981-05-01 Hitachi Ltd Method of manufacturing ceramic multilayer circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0368195A (en) * 1989-08-05 1991-03-25 Nippondenso Co Ltd Laminated ceramic board and manufacture thereof

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