JPS6047412A - Method of producing electronic part and conductive paste composition - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing ceramic electronic components such as ceramic capacitors, varistors, thermistors, etc., and a conductive paste composition used directly in carrying out this manufacturing method. .

Conventional technology and its problems Conventionally, granular A was used to form electrodes of this type of ceramic electronic component.
g. A conductive paste composition is prepared by dispersing a metallized component such as an Ag-Pd alloy or Cu, a frit, etc. in a liquid carrier composed of an organic vehicle, and this conductive paste composition is applied to a porcelain surface. A method has been used in which the coating is applied in a predetermined pattern by means such as screen printing, and then the coating is printed. However, in the above conventional method, when baking is performed in bulk during the baking process, the electrodes adhere to each other due to bonding between metal components contained in the electrodes or bonding between frits raised on the surface, etc., resulting in a reduction in yield. There is a problem in that it causes a decline.

As a means to prevent this electrode adhesion, baking is performed before processing.
Attempts have been made to coat the electronic component with powder of SiC, A120a, ZrO2, etc., or to embed it in powder and perform a baking process. but,
With this method, it is not possible to control the amount of powder stuck to the electrode surface. As a result, a large amount of powder adheres to the electrode surface, causing problems such as the soldering properties of the electrodes being significantly reduced, making it impossible to solder, and reducing yield due to variations in the way the electrodes are sprinkled. Ta.

Furthermore, as another means for preventing electrode adhesion, a method of adding Ni or Ni compound powder to the conductive paste composition has been attempted. However, in the case of adding Ni or one compound, atmospheric treatment is performed, so the adhesion prevention function is hardly achieved and the capacitor characteristics are also deteriorated.

Purpose of the Invention The present invention solves the above-mentioned conventional problems, and provides an electronic device that can easily form electrodes that have a high anti-adhesion effect and do not cause characteristic deterioration for electronic components made of porcelain. It is an object of the present invention to provide a method for manufacturing parts and a conductive paste composition suitable for implementing this manufacturing method.

Structure of the Present Invention In order to achieve the above object, the method for manufacturing an electronic component according to the present invention is to apply a conductive paste composition containing at least one of granular oxide, carbide, or nitride to an electronic component made of porcelain. After coating, the baking process is performed to form a conductive layer on the electronic component.

Further, in order to carry out this manufacturing method, the present invention provides a conductive paste composition comprising a mixture of a granular metallization component and a liquid carrier, which contains at least one of granular oxides, carbides, or nitrides. It is characterized by

First, in the present invention, a conductive paste composition prepared by dispersing a metallized component such as granular Ag, Ag-Pd alloy, or Cu, a frit, etc. in a liquid carrier diluted with an organic vehicle, and a granular at least one of oxides, carbides, or nitrides. Suitable examples of the granular oxide include ZrO□, Al□O, TiO2, or BaTiOg solid solution, and suitable carbides include SiC or 11lc.

In order to form a conductive layer such as an electrode on a ceramic electronic component, such as a ceramic capacitor, using a conductive paste composition having the composition shown in 2. The coating is applied onto the surface of a porcelain electronic component in a predetermined pattern by means such as screen printing, and after undergoing necessary steps such as drying, baking is performed.

In this case, since the conductive paste composition according to the present invention contains at least one particle of oxide, carbide, or nitride, these components act as an electrode adhesion prevention component and prevent ceramic electronic components from forming. When baked in bulk, the adhesion of electrodes to each other is significantly reduced, and the yield is significantly improved.

Incidentally, the defective rate, which was conventionally 50 to 70%, could be suppressed to almost zero by the present invention.

Moreover, since these electrode adhesion prevention components can be incorporated in advance into the conductive paste II composition in an appropriate amount, unlike the conventional sprinkling method, soldering due to excessive adhesion will not result in poor soldering properties. Since there is no such thing and the amount used is the minimum necessary, advantages such as low cost can be obtained.

Further, since the step of sprinkling the powder adhering to the electrode and the step of removing it in case of excessive adhesion, which were conventionally necessary, are not necessary, the electrode forming step is simplified and costs can be reduced.

Furthermore, unlike the conventional method of adding Ni or Xi compound powder to the conductive paste composition, this method does not cause deterioration of characteristics.

Effects of the present invention As described above, the method for manufacturing electronic components according to the present invention is to apply a conductive paste composition containing at least one of granular oxides, carbides, or nitrides to electronic components made of porcelain. After that, baking is a process that forms a conductive layer on the electronic component, so it has a high adhesion prevention effect on electronic components made of porcelain and does not cause characteristic deterioration. It is possible to provide a method for manufacturing an electronic component in which electrodes can be easily formed, and a conductive paste composition suitable for implementing this manufacturing method.

Claims (7)

[Claims] (1) After applying a conductive paste composition containing at least one kind of particulate oxide, carbide, or nitride to an electronic component made of porcelain, baking is performed to form a conductive layer on the electronic component. A method of manufacturing an electronic component, characterized by forming an electronic component. (2) The method for manufacturing an electronic component according to claim 1, wherein the electronic component is made of dielectric ceramic or semiconductor ceramic. (3) A conductive paste composition comprising a mixture of a granular metallized component and a liquid carrier, the conductive paste composition containing at least one type of granular oxide, carbide or nitride. (4) The oxide is Zr(h, Al2O3, Ti0z
The conductive paste composition according to claim 3, characterized in that it is made of either a BaTiO3 solid solution or a BaTiO3 solid solution. (5) The conductive paste composition according to claim 3, wherein the carbide is made of either SiC or C. (6) Claim 3, wherein the metallization component is made of Ag, Pd, or an alloy thereof.
The conductive paste composition described in 1. (7) The conductive paste composition according to claim 3, wherein the metallization component is made of Cu.