JPS6047003A - Process and apparatus for plasma polymerization - Google Patents

Process and apparatus for plasma polymerization

Info

Publication number
JPS6047003A
JPS6047003A JP15474983A JP15474983A JPS6047003A JP S6047003 A JPS6047003 A JP S6047003A JP 15474983 A JP15474983 A JP 15474983A JP 15474983 A JP15474983 A JP 15474983A JP S6047003 A JPS6047003 A JP S6047003A
Authority
JP
Japan
Prior art keywords
plasma
film
gas
composition
polymer film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15474983A
Other languages
Japanese (ja)
Other versions
JPH0460122B2 (en
Inventor
Yoichi Murayama
洋一 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Shingijutsu Kaihatsu Jigyodan
Original Assignee
Research Development Corp of Japan
Shingijutsu Kaihatsu Jigyodan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Development Corp of Japan, Shingijutsu Kaihatsu Jigyodan filed Critical Research Development Corp of Japan
Priority to JP15474983A priority Critical patent/JPS6047003A/en
Publication of JPS6047003A publication Critical patent/JPS6047003A/en
Publication of JPH0460122B2 publication Critical patent/JPH0460122B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to prepare a variety of composite films which have heretofore been difficult to prepare and to determine exactly the property and structure of a formed film, by separately feeding a plurality of material gases to a plasma space and forming a composite film thereof on a base. CONSTITUTION:A plurality of material gases in the form of monomers at a predetermined ratio fed from material gas inlets 3, 3' to a vacuum tank 1 are converted into plasma by activation by a high-frequency coil 2 and transferred onto a base 4 by an electric field to form a polymer film. According to this process, it is possible to control exactly each of the flow rates of a plurality of materials and to select the composition of a polymer film freely. The composition of a film sensitively reacts with a flow rate of a material gas, so that it is easy to vary the composition of a film composition continuously along the direction of its thickness. Further, when C2H4 gas and TixCly gas, for example, are fed separately, a Ti-containing polyethylene film can be obtained easily, so that it is possible to produce easily a metal atom-bonded film whose metal atom content has heretofore been difficult to control.

Description

【発明の詳細な説明】 この発明はプラズマを用いた高分子薄膜の生成法、特に
、複数の材料を用いた複合−材としての高分子薄膜の生
成法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a thin polymer film using plasma, and particularly to a method for producing a thin polymer film as a composite material using a plurality of materials.

有助モノマーガスを電気的にプラズマ化fるとプラズマ
に近接した基板・容し等の我面上に有―取仔膜が形成さ
れる現象が見られ、ンラズマ距会と呼はれている。
When a helpful monomer gas is electrically turned into plasma, a phenomenon is observed in which a film is formed on the surface of a substrate, container, etc. that is close to the plasma, and this phenomenon is called lasma formation. .

この、プラズマ重合は、はとんどあらゆる有bガスから
触媒なしに有FPi物のき成ができ、ガス圧、プラズマ
化のための入力等の制御によって容易に班会速度を制御
でき、供給する七ツマ−をi数紳の混合カスとすること
によって同学に共IK会合体得られるという特徴がある
0しかし、この方法によっては、生v:、膜!7)成分
を厚へ方向にわたって変化させ、あるいは交互に嚢なる
高分子膜層を積層させるといった梢密な制御は不可能で
おる。
This plasma polymerization can form FPi-containing products from almost any B-containing gas without a catalyst, and the polymerization speed can be easily controlled by controlling the gas pressure, input for plasma generation, etc. However, depending on this method, it is possible to obtain a co-IK aggregate by making a mixture of I and N. 7) It is not possible to precisely control the composition by changing the components in the thickness direction or by stacking polymer film layers alternately.

また、高分子膜のル敗途中でスパッタリングによって高
分子膜中に金りを含有させる試みもあるが、スパッタリ
ングによって祉金縞自′有量を精密に制御することは不
Il+]能であること、スパッタリングを維持するため
のキャリアカス圧が比較的高く、生成膜に1譬を与える
という問題を含んでいた。
In addition, there have been attempts to incorporate gold into the polymer film by sputtering during the process of forming the polymer film, but it is impossible to precisely control the amount of metal gold by sputtering. However, the carrier gas pressure required to maintain sputtering is relatively high, which has the problem of damaging the produced film.

この発明は、上記のプラズマ重合の%微を最大限に活用
し、生成膜の性質・構造を正確に制−でき、従来合成す
ることが離しかった各種の複合膜を合成可能にしようと
するものである。
This invention aims to make full use of the above-mentioned plasma polymerization, to accurately control the properties and structure of the produced film, and to make it possible to synthesize various composite films that were previously difficult to synthesize. It is something.

以下図面を鯵熱してこの発明を実施例によって詳細に説
明する。
The present invention will now be described in detail by way of examples with reference to the drawings.

第1図は複数種の材料をガスとして9(給する場合の取
合装置を示し、1は真空槽であシ、7゛ラズマ生成のた
めの尚周波コイル2を図示のように真空槽外に巻付ける
場合はカラス部■絶縁材料で作られる。3.3′は原料
カスの供給口であり、!に数種の原料ガスをそれぞれ4
(体のまま、それぞれの供給口3.3′等から所定縁す
ら真空槽内に供給される。これらLv原#+ガスは勿論
、心安に応じ不活性或いは活性なキャリアカスと混合し
て供給されてもよい。
Figure 1 shows a coupling device for supplying multiple types of materials as gases (1) in a vacuum chamber, and (7) a high-frequency coil 2 for plasma generation outside the vacuum chamber as shown. When wrapping around the glass, the crow part ■ is made of insulating material. 3. 3' is the supply port for raw material waste, and several kinds of raw material gases are supplied to 4 each.
(Even the specified edges are supplied into the vacuum chamber from the respective supply ports 3, 3', etc., as they are. These Lv original #+ gases are of course mixed with inert or active carrier scum and supplied depending on the safety. may be done.

4は基板であシ、その弐面に薄膜を成長させるため、支
持台5は宣周波コイル2或いは原料ガス供給口3に対し
て負電位を印加される。6は排気口であυ、真空ポンプ
によって残留ガスを排気する。
Reference numeral 4 denotes a substrate, and in order to grow a thin film on the other side of the substrate, a negative potential is applied to the supporting table 5 with respect to the frequency wave coil 2 or the raw material gas supply port 3. Reference numeral 6 is an exhaust port υ, through which residual gas is exhausted by a vacuum pump.

この装置において、原料ガス供給口3.3’N¥−から
所定の比率で、それぞれ吊体のit具望槽1内に供給さ
れた複数種L1)IjA料カスは、高周波コイル2によ
ってプラズマ化され、活性化され、電場によって基板今
上に輸送され、1!縫膜を形成する 捷だ、プラズマ中においてはイオンに比較して亀子υス
ピードが大きく、プラズマ領域の外側にυを予震が拡が
り、この領域はプラズマ中心に比して負諷位○領域とな
る。このため、この負凧泣領域に基板を配置すると、特
にlL圧を印加しなくても、イオン群は自然に形成され
た電場によって基板上に輸送される。
In this device, multiple types of L1) IJA material waste supplied into the IT conversion tank 1 of the hanging body at a predetermined ratio from the raw material gas supply port 3.3'N\- are turned into plasma by the high frequency coil 2. is activated, transported onto the substrate by the electric field, and 1! This is the axis that forms the suture membrane. In the plasma, the Kameko υ speed is larger than that of ions, and the preshock of υ spreads outside the plasma region, and this region is a negative position ○ region compared to the plasma center. Become. Therefore, when a substrate is placed in this negative kite cry region, ion groups are transported onto the substrate by a naturally formed electric field even without applying particular LL pressure.

このプラズマ&ば装置にあって扛、縁数神の原料ガスを
、それぞれに精密に、゛流量を制御出来、重合膜の組成
を自由に選択することが容易である。そして、残留ガス
は直ちに排気され、膜の組成は原料ガスのOIL人比に
鋭敏・に反応し、膜の4蚕方向に膜の組成を連続的に変
化させ、またはj−状に性質の異なる膜fTし成させる
ことも容易である。
In this plasma and plasma device, the flow rate of each of the raw material gases can be precisely controlled, making it easy to freely select the composition of the polymerized film. Then, the residual gas is immediately exhausted, and the composition of the film responds sharply to the OIL ratio of the raw material gas, and the composition of the film changes continuously in the four directions of the film, or the properties differ in a J-shape. It is also easy to form a film fT.

また、原1#1ガスは有脱モノマーガスたりでなく、無
[幾化合物のガスを利用しうることも明られぞれ惧荀【
コ3.3′から4人すれは、Tlを含有したボリエナレ
ン膜をH&に育ることが出来る。
In addition, it has been found that the raw 1#1 gas can be used not only as a monomer-free gas but also as a non-compound gas.
From 3.3' to 4, a Tl-containing polyenalene film can be grown into H&.

このように、篩分子と金llI41At子θ結合した重
は膜は、崎電率が大きく、又、比抵抗が小さいものを併
ることが出来るυで、!r素材としての利iljが期待
されているが、従来、その驚り原子val=八M、を自
由eL制却することが難しかったものである。
In this way, a heavy film in which sieve molecules and gold llI41Attons θ are bonded has a large electrical constant and a small resistivity at υ. Although ilj is expected to be useful as an r material, conventionally it has been difficult to control the free eL of the surprise atom val=8M.

金tt’−4原−1−あるいは無1威化会物の混入ね、
上記の11/llυようにカスri=υもの7ヒけでな
く、−口4=、液体Qものを真空中で蒸発させることに
よって反応領域に供給することが出来る。
Gold tt'-4 originals-1- or nothing mixed in with the 1 power.
Instead of the liquid Q as described in 11/llυ above, the liquid Q can be supplied to the reaction zone by evaporating it in a vacuum.

第2図VC示す重合装置は、真空槽lへの原料ガス供給
口3′線蒸発相7に接続される。蒸発槽7中icは加熱
フィラメント8が配置され、ここで加熱蒸発さhた金栖
、熱融化合物はガス状で供給口3′から真空槽1内に供
給される。カス、)IH皺は絞シ或いはシャンク9によ
って制卸することが出来る。
The polymerization apparatus shown in FIG. 2VC is connected to the raw material gas supply port 3' line evaporation phase 7 to the vacuum chamber 1. A heating filament 8 is disposed in the IC in the evaporation tank 7, and the molten compound heated and evaporated here is supplied in gaseous form into the vacuum tank 1 from the supply port 3'. Scraps, ) IH wrinkles can be controlled by a squeezer or shank 9.

このように蒸発@7を別に設けることによシ、蒸発権7
内の圧力を低く医ち、蒸発を容易にし、加熱フィラメン
トの配置を容易にすると共に、真空槽1中に導入された
七ツマーカスが加熱フィラメント8に接触して分解し、
予定外V成分が重合膜に混入するのを防止することが出
来る。
By separately providing evaporation@7 in this way, the evaporation right 7
In addition to lowering the internal pressure to facilitate evaporation and ease the placement of the heating filament, the seven strands introduced into the vacuum chamber 1 come into contact with the heating filament 8 and decompose.
It is possible to prevent unexpected V components from being mixed into the polymer film.

第3図に示す東&&tiH,真空槽l内に直接蒸兆用の
加熱フィラメント8を配設したfilで、この取合装置
はプラズマ中への原材供給装置の構造が菌中になるとい
う利点がある。
As shown in Fig. 3, the heating filament 8 for vaporization is placed directly in the vacuum chamber l, and this combining device has the advantage that the structure of the raw material supply device into the plasma is inside the bacteria. There is.

このような装置によル、モノマーガスとじてエチレン、
ブタジェン、メククリル酸メチル等を用い、碑ヤリアガ
スとしてA、N、、、02 等をJflい、抵抗加熱に
よりAA、In、Sn 等の金目を混入することによシ
比抵抗の小さい取合膜を容易に1@ることか出来た。そ
の−例を下表に示す0 これらの有限膜の基板としてガラスケ用いる場合は七ツ
マーガス中に有1洩シリコシを混入すると、ガラスとの
密着強匪を向上させ”ることか出来る。
Such a device produces ethylene, monomer gas,
Using butadiene, methyl meccrylate, etc., A, N,,,02, etc. are used as a base gas, and metal grains such as AA, In, Sn, etc. are mixed in by resistance heating to form a composite film with low specific resistance. I was able to do 1@ easily. An example of this is shown in the table below. When glass glass is used as a substrate for these finite films, it is possible to improve the adhesion to the glass by mixing silicone into the glass.

また、上記の各取合装置は高周波TI4場の印加のため
コイルを^空槽外に配置しているが、勿論、真空槽内に
配置蝮してもよく、またコンデンサ型の印加装置f:用
いてもよい。さらに、プラズマ化のために光による励起
を利用することもできる。この場合、モノマーの種類に
よって特定波長■光を吸収するので、特定のモノマーた
けを励起できる。
In addition, in each of the above coupling devices, the coil is placed outside the empty tank for applying the high-frequency TI4 field, but of course it may be placed inside the vacuum tank, or a capacitor-type applying device f: May be used. Furthermore, excitation by light can also be used to generate plasma. In this case, since light of a specific wavelength is absorbed depending on the type of monomer, only a specific monomer can be excited.

この弗明は、上記のように、取合膜を形成するモノマー
、金楠、半尋体、化合物等の@科をそれぞれ単独でグラ
ズブ中に供給し、基板上に輸送し重合するようにしたの
で、プラズマ取合膜の成分を自由に制御でき、層状に成
分の変化した狙き膜を得ることもできるほか、金槁尋を
台む比抵抗の小さい有除膜を重合できる等、従来のプラ
ズマ亜鋒法では伶られない!I[シい性質會もった@1
Fを容易に風合出来る効果を奏するものである。
As mentioned above, this method involves supplying the monomers, monomers, hemisomers, compounds, etc. that form the composite film individually into the glass tube, transporting them onto the substrate, and polymerizing them. Therefore, it is possible to freely control the components of the plasma collection film, and it is also possible to obtain a targeted film with a layered composition, and it is also possible to polymerize a removal film with low resistivity, which is similar to that of Kim Gonghyun. Plasma submergence method won't let you down! I [we had a nice nature meeting @1
This has the effect of easily changing the texture of F.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図、第3図はそれぞれこV発ψ」のプラズ
マ康会法を実施J゛るための東金装置の村を急回である
。 1:真空槽 2:高り波コイル 3:@科供給口 4:
基板 6:排気口 7二蒸光檀8:加熱フィラメント 
9:シャツタ
Figures 1, 2, and 3 respectively show the village of Togane Equipment, which was used to carry out the plasma therapy of this V-emission ψ. 1: Vacuum chamber 2: High wave coil 3: @ supply port 4:
Substrate 6: Exhaust port 7 Two steamers 8: Heating filament
9: Shafta

Claims (1)

【特許請求の範囲】 1)イf氾モノマーガスをプラズマ化し、基板上に重合
膜を;レリシさせるプラズマ重合法において、プラズマ
空間に碌数種の材料ガスを各勢独に供給し、基板上にそ
の混舒膜を形成させることを特徴とするプラズマ重は法 2)真空憤、該具墾佃中へ有融モノマーガスを尋人する
供給口、l(9檜を排気する排気口及び上把真架槽中O
ガスをプラズマ化するため品周波電場を印加するための
プラズマ装置からなシ、該プラズマ空間に複畝柚の原料
ガスを各別に供給す勾だめの複数の供給装置を有するこ
とを特徴とするプラズマ重合装置、3) 上記複叡υ挑
ミ本F供給装置が、モノマーガスの専入供給日及び惰内
に設けられた蒸発諒とからなる%8’f・6〜氷の乾曲
第2項りプラズマ重合装置
[Claims] 1) In a plasma polymerization method in which a flooded monomer gas is turned into plasma and a polymer film is formed on a substrate, several kinds of material gases are individually supplied to a plasma space, and a polymer film is formed on a substrate. 2) Vacuum reactor, a supply port for introducing molten monomer gas into the container, an exhaust port for discharging the molten monomer gas, and a top Holding tank medium O
A plasma characterized by comprising a plasma device for applying a high-frequency electric field to convert gas into plasma, and a plurality of supply devices each having a gradient for separately supplying a raw material gas of compound ridges to the plasma space. Polymerization equipment, 3) The above-mentioned complex supply equipment is configured to supply monomer gas exclusively and to an evaporation tank installed in the tank. plasma polymerization equipment
JP15474983A 1983-08-26 1983-08-26 Process and apparatus for plasma polymerization Granted JPS6047003A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15474983A JPS6047003A (en) 1983-08-26 1983-08-26 Process and apparatus for plasma polymerization

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15474983A JPS6047003A (en) 1983-08-26 1983-08-26 Process and apparatus for plasma polymerization

Publications (2)

Publication Number Publication Date
JPS6047003A true JPS6047003A (en) 1985-03-14
JPH0460122B2 JPH0460122B2 (en) 1992-09-25

Family

ID=15591067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15474983A Granted JPS6047003A (en) 1983-08-26 1983-08-26 Process and apparatus for plasma polymerization

Country Status (1)

Country Link
JP (1) JPS6047003A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109803A (en) * 1985-11-06 1987-05-21 Sumitomo Electric Ind Ltd Method of forming organic thin film
JPS6320101A (en) * 1986-07-15 1988-01-27 Sanyo Tokushu Seiko Kk Front end tear preventing rolling method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57182302A (en) * 1981-05-06 1982-11-10 Shuzo Hattori Apparatus for forming polymer film by plasma polymerization
JPS59193904A (en) * 1983-04-18 1984-11-02 Matsushita Electric Ind Co Ltd Apparatus for forming thin film of polymer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57182302A (en) * 1981-05-06 1982-11-10 Shuzo Hattori Apparatus for forming polymer film by plasma polymerization
JPS59193904A (en) * 1983-04-18 1984-11-02 Matsushita Electric Ind Co Ltd Apparatus for forming thin film of polymer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109803A (en) * 1985-11-06 1987-05-21 Sumitomo Electric Ind Ltd Method of forming organic thin film
JPH0469643B2 (en) * 1985-11-06 1992-11-06 Sumitomo Electric Industries
JPS6320101A (en) * 1986-07-15 1988-01-27 Sanyo Tokushu Seiko Kk Front end tear preventing rolling method

Also Published As

Publication number Publication date
JPH0460122B2 (en) 1992-09-25

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