JPS6041482Y2 - heat exchange equipment - Google Patents
heat exchange equipmentInfo
- Publication number
- JPS6041482Y2 JPS6041482Y2 JP1979025828U JP2582879U JPS6041482Y2 JP S6041482 Y2 JPS6041482 Y2 JP S6041482Y2 JP 1979025828 U JP1979025828 U JP 1979025828U JP 2582879 U JP2582879 U JP 2582879U JP S6041482 Y2 JPS6041482 Y2 JP S6041482Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- element pair
- heat exchanger
- thermoelectric element
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Description
【考案の詳細な説明】
本考案は、ペルチェ効果を利用した熱交換装置の改良に
関するもので、熱源として使用する熱電素子対と熱交換
器の一方とを熱伝導性を保った状態で離脱性を良好にし
、熱交換装置のサービス性の向上を計ることを目的とし
ている。[Detailed description of the invention] This invention relates to an improvement of a heat exchange device that utilizes the Peltier effect, and is capable of separating a thermoelectric element pair used as a heat source and one of the heat exchangers while maintaining thermal conductivity. The purpose is to improve the serviceability of heat exchange equipment.
この種従来例は熱交換器間に熱電素子対をはさみ前記同
熱交換器をネジ等で締めつけて、前記３者を結合する構
成が採用されている。This type of conventional example employs a configuration in which a pair of thermoelectric elements is sandwiched between heat exchangers, and the heat exchangers are tightened with screws or the like to connect the three.
そして、熱伝導を良好とするために熱拡散コンパウンド
等のシール材が前記熱交換器と熱電素子対の間に充填さ
れている。In order to improve heat conduction, a sealing material such as a heat diffusion compound is filled between the heat exchanger and the thermoelectric element pair.
また、この熱拡散コンパウンドは、例えばトート・シリ
コーン株式会社販売のトート・シリコーン５Ｈ３４０放
熱用コンパウンドのようなシリコーン・コンパウンドで
あり、熱伝導性のすぐれた金属酸化物を多量に含んだグ
リス状のシリコーン・コンパウンドでアル。In addition, this heat diffusion compound is a silicone compound such as TOTO Silicone 5H340 heat dissipation compound sold by TOTO Silicone Co., Ltd., and is a grease-like silicone compound containing a large amount of metal oxide with excellent thermal conductivity.・Al with compound.
このような構成であると、前記画然交換器間にはさみ込
んだ熱電素子対や、前記画然交換器間に取りつけた制御
装置等を交換するため、前記熱交換器の片方を取りはず
した際、前記熱電素子対は前記熱拡散コンパウンド等の
シール材のもつ粘着性により前記同熱交換器のいずれに
付着してはずれるかが不明であった。With such a configuration, when one of the heat exchangers is removed in order to replace the thermoelectric element pair sandwiched between the heat exchangers, the control device installed between the heat exchangers, etc. However, due to the adhesiveness of the sealing material such as the heat diffusion compound, it was unclear which of the heat exchangers the thermoelectric element pair would adhere to and come off.
そのために熱電素子対や制御装置の配線コードに無理な
力が加わり断線等が生ずる危険性が高くサービス性に欠
ける欠点を有していた。As a result, there is a high risk that excessive force will be applied to the thermoelectric element pair and the wiring cord of the control device, resulting in breakage, resulting in a lack of serviceability.
本考案は、上記従来の熱交換装置にみられる欠点を除去
するものである。The present invention eliminates the drawbacks found in the above-mentioned conventional heat exchange devices.
以下、本考案をその一実施例を示す添付図面を参考に説
明する。Hereinafter, the present invention will be described with reference to the accompanying drawings showing one embodiment thereof.
１は携帯可能な保冷、保温容器本体で、外ケース２とア
ルミニウム等にて形成した内ケース３間に断熱材４を充
填した貯蔵室５と、断熱蓋体６より構成されている。Reference numeral 1 denotes a portable cold/heat insulating container body, which is composed of an outer case 2, an inner case 3 made of aluminum or the like, a storage chamber 5 filled with a heat insulating material 4, and a heat insulating lid 6.
７は熱電素子対で、通電することにより一面で吸熱作用
を、また他面で放熱作用を行なう。Reference numeral 7 denotes a pair of thermoelectric elements, and when energized, one side absorbs heat and the other side performs heat dissipation.
８，９は熱電素子対７の上下面に取りつけられた熱交換
器で、アルミニウム等の熱伝導体からなり、内ケース３
側の熱交換器８はブロック状に形成され内ケース３に固
定されている。8 and 9 are heat exchangers attached to the upper and lower surfaces of the thermoelectric element pair 7, and are made of a heat conductor such as aluminum.
The side heat exchanger 8 is formed into a block shape and is fixed to the inner case 3.
また反対側の熱交換器９には放熱用のファン１゜が多数
取付けられている。Further, a large number of fans 1° for heat radiation are attached to the heat exchanger 9 on the opposite side.
熱電素子対７と熱交換器８，９との間には熱拡散コンパ
ウンド等のシール材１１が充填されており熱電素子対７
と熱交換器８，９との表面を互いに密着させて熱伝導を
良好にしている。A sealing material 11 such as a heat diffusion compound is filled between the thermoelectric element pair 7 and the heat exchangers 8 and 9.
The surfaces of the heat exchangers 8 and 9 are brought into close contact with each other to improve heat conduction.
熱交換器８には、熱電素子対７の温度調節を行なうため
の調節装置１２や、温度過昇防止装置１３等の制御装置
が取付けられている。The heat exchanger 8 is equipped with control devices such as an adjustment device 12 for adjusting the temperature of the thermoelectric element pair 7 and an excessive temperature rise prevention device 13.
そしてこれらは熱電素子対７と配線コード１４より互い
に結線されており、熱交換器８，９は熱電素子対７、調
節装置１２、温度過昇防止装置１３を収納した状態で、
ネジ１５等により締めつけられている。These are connected to each other by the thermoelectric element pair 7 and the wiring cord 14, and the heat exchangers 8 and 9 house the thermoelectric element pair 7, the adjustment device 12, and the overtemperature rise prevention device 13.
It is tightened with screws 15 and the like.
熱交換器９のシール材１１側の表面にはネジ１５にて他
方の熱交換器８ど締めつけられる前に離型剤１６が塗布
しである。A mold release agent 16 is applied to the surface of the heat exchanger 9 on the sealing material 11 side before the other heat exchanger 8 is tightened with the screws 15.
かかる構成により、熱交換器８，９の間に設置された熱
電素子対７や調節装置１２、温度過昇防止装置１３等を
サービス交換する場合においてのべる。With this configuration, the thermoelectric element pair 7 installed between the heat exchangers 8 and 9, the adjustment device 12, the temperature overrise prevention device 13, etc. will be replaced for service.
始めにネジ１５等をはずして下側の熱交換器９を取りは
ずす。First, remove the screws 15, etc., and remove the lower heat exchanger 9.
しかし、このとき離型剤１６の効果により熱交換器９に
対する熱拡散コンパウンド等のシール材１１の粘着性が
ほとんどなく、熱電素子対７は上側の熱交換器８に付着
した状態のまま、熱交換器９を取り外すことができ配線
コード１４に無理な力が加わり断線等が生ずる危険性は
なくなると同時にサービス性も改善される。However, at this time, due to the effect of the mold release agent 16, the adhesiveness of the sealing material 11, such as a heat diffusion compound, to the heat exchanger 9 is almost non-existent, and the thermoelectric element pair 7 remains attached to the upper heat exchanger 8. Since the exchanger 9 can be removed, there is no risk that excessive force will be applied to the wiring cord 14 and it will break, and at the same time serviceability is improved.
上記実施例より明らかなように、本考案の熱交換装置は
、一面が加熱面となり他面が冷却面となる熱電素子対の
両端面に、熱拡散コンパウンド等のシール材を介在させ
て、熱伝導体からなる熱交換器をそれぞれ配設し、熱電
素子対と連結した制御装置を具備しない方の熱交換器と
前記熱電素子対との当たる位置に離型剤を塗布したもの
であるから、熱拡散フンパウンド等のシール材の粘着性
をなくし、前記熱電素子対や制御装置のサービス交換時
等に、前記熱電素子対が制御装置を具備した熱交換器に
粘着する様にすることにより、サービス時に内部配線コ
ードに無理な力が加わり断線したりする危険性を取り除
き、またサービス時の作業性を改善することができる。As is clear from the above embodiments, the heat exchange device of the present invention uses a sealing material such as a heat diffusion compound on both end surfaces of the thermoelectric element pair, in which one side is a heating surface and the other side is a cooling surface. Each heat exchanger made of a conductor is disposed, and a mold release agent is applied to the position where the heat exchanger not equipped with the control device connected to the thermoelectric element pair contacts the thermoelectric element pair. By eliminating the adhesiveness of the sealing material such as thermal diffusion powder, and making the thermoelectric element pair stick to the heat exchanger equipped with the control device during service replacement of the thermoelectric element pair and the control device, It is possible to eliminate the risk of undue force being applied to the internal wiring cord during service and cause it to break, and it is also possible to improve workability during service.
第１図は本考案の一実施例における熱交換装置を具備し
た冷却、保温容器の斜視図、第２図は第１図のＩ−Ｉ’
線による縦断面図、第３図は第２図のｎ−ｎ’線におけ
る縦断面図、第４図は第３図のｍ−ｍ’線における拡大
縦断面図である。
７゛・・・・・・熱電素子対、８，９・・・・・・熱交
換器、１１・・・・・・シール材、１６・・・・・・離
型剤。FIG. 1 is a perspective view of a cooling/warming container equipped with a heat exchange device according to an embodiment of the present invention, and FIG. 2 is an I-I'
FIG. 3 is a longitudinal sectional view taken along line nn' in FIG. 2, and FIG. 4 is an enlarged longitudinal sectional view taken along line mm' in FIG. 3. 7゛... Thermoelectric element pair, 8, 9... Heat exchanger, 11... Seal material, 16... Mold release agent.
Claims (1)
両端面に熱伝導体からなる熱交換器をそれぞれ配設し、
前記熱電素子対の両端面と前記熱交換器との間に熱拡散
コンパウンド等の粘着性を有するシール材を充填せしめ
、前記熱交換器のうち電熱素子対と連結した制御装置を
具備しない方の熱交換器と前記シール材間に離型剤を介
在させた熱交換装置。A heat exchanger made of a thermal conductor is disposed on each end face of the thermoelectric element pair, with one side serving as a heating surface and the other side serving as a cooling surface.
An adhesive sealing material such as a heat diffusion compound is filled between both end surfaces of the thermoelectric element pair and the heat exchanger, and the heat exchanger is not equipped with a control device connected to the electrothermal element pair. A heat exchange device in which a mold release agent is interposed between the heat exchanger and the sealing material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979025828U JPS6041482Y2 (en) | 1979-02-28 | 1979-02-28 | heat exchange equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979025828U JPS6041482Y2 (en) | 1979-02-28 | 1979-02-28 | heat exchange equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55126177U JPS55126177U (en) | 1980-09-06 |
| JPS6041482Y2 true JPS6041482Y2 (en) | 1985-12-17 |
Family
ID=28866929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1979025828U Expired JPS6041482Y2 (en) | 1979-02-28 | 1979-02-28 | heat exchange equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6041482Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013100950A (en) * | 2011-11-09 | 2013-05-23 | Panasonic Corp | Cooling device |
-
1979
- 1979-02-28 JP JP1979025828U patent/JPS6041482Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55126177U (en) | 1980-09-06 |
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