JP2013100950A - Cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling device capable of cooling various kinds of cooled objects by a simple configuration in which a cooling part is detachable.SOLUTION: A peltier element 31 is activated by a current caused by received electric power from a power receiving coil 28 via a high frequency magnetic field from an induction heating cooker 21. A cooling means cools a heat radiating plate located at a lower surface of the peltier element 31. Furthermore, heat absorption by a cooling plate located at an upper surface of the peltier element cools a first cooling body 32. In addition, a second cooling body 36 detachably adhered to the first cooling body 32 by a connection means is provided so that various kinds of cooled objects can be cooled.

Description

  The present invention relates to a cooling device using a Peltier element, and more particularly to a cooling device using an induction heating cooker used in general households.

  In recent years, induction heating cookers have become widespread as a safe and clean heat source that does not use fire and does not emit combustion gas. This induction heating cooker includes a heating coil for induction heating and various electronic components on a control circuit that supplies a high-frequency current to the heating coil in a controllable manner.

  Various non-contact power receiving devices that are fed with electric power using a high-frequency magnetic field from the induction heating cooker have been proposed (see, for example, Patent Document 1).

  For example, FIG. 7 is a cross-sectional view of a conventional cooling device using a Peltier element as an example of a non-contact power receiving device.

  A high frequency induction magnetic field generating coil 2 is provided on the back side of a pedestal 1 which is a top plate or a dining table plate of a kitchen, and a main body is provided with a cooling device 3 configured to be detachably mounted on the pedestal 1. The lower part is provided with an operating part 4, and the upper part thereof is provided with a container part 5 having a cup shape that can be carried with one hand for containing beverages, etc., and the operating part 4 generates induced power by the magnetic field of the high-frequency induction magnetic field generating coil 2. Including a passive side coil 6 that generates electric current, a Peltier element 7 that is operated by direct current based on a current generated by the passive side coil 6, a circuit board 8 and a heat dissipation fan 9, and a heat dissipation heat sink 10 for the Peltier element 7. In the configuration in which the bottom portion of the container portion 5 is received in the receiving opening of the upper surface opening of the operation portion 4, the operation portion 4 and the container portion 5 can be separated, and the heat absorption of the Peltier element 7 The container portion so that the heat conducting plate 11 joined to the upper surface of the container portion via a thin electrical insulating material forms the bottom surface of the receptacle, and the bottom wall of the container portion 5 is in contact with the heat conducting plate 11. An object to be cooled such as a beverage stored in the container 5 is cooled in a state in which the bottom of 5 is fitted in the receptacle.

  Then, the Peltier element 7 such as a Peltier element is activated by the induced power generated when placed in the magnetic field of the high frequency induction magnetic field generating coil 2 disposed on the back side of the pedestal 1 which is the top plate of the kitchen or the dining table plate. Since the object to be cooled such as the beverage in the container 5 is cooled, no power cord is required. For this reason, the cooling device 3 is convenient to carry and the range of use of the electromagnetic induction heating device that is widely used as facilities such as kitchens and dining areas is expanded.

  Further, the main body detachably mounted on the pedestal 1 having the high frequency induction magnetic field generating coil 2 includes a lower operation part 4 and an upper container part 5 for accommodating an object to be cooled. Will be lowered and stable installation will be possible.

  Further, the main body detachably mounted on the pedestal 1 having the high frequency induction magnetic field generating coil 2 is configured such that the container portion 5 for accommodating the object to be cooled is detachably mounted on the lower operation portion 4. In addition, since the actuating part 4 includes a receiving part having an upper surface opening on which the bottom part of the container part 5 is detachably set, the container part 5 is easy to attach and detach and is easy to use.

  For this reason, it becomes easy to perform operations such as removing the container part 5 and putting a beverage or the like into the container part 5 or transferring the cooled beverage or the like to another container.

  Moreover, since the container part 5 can be removed and water-washed, in that case, it is safe, without water splashing on the action | operation part 4 of the lower part. Furthermore, since the same direct current as the power to the Peltier element 7 is used for the power to the heat radiating fan 9, the Peltier element 7 is mounted by placing the main body on the base 1 having the high-frequency induction magnetic field generating coil 2. Power supply can be performed simultaneously with power supply to the power supply, and a power supply cord for supplying power to the heat radiating fan 9 is not required. Further, ON / OFF control by a switch is not required, and the usability is convenient. Furthermore, since the container part 5 has a cup shape that can be carried with one hand, it is convenient to carry and easy to use.

Japanese Patent No. 4744242

  However, in the conventional configuration, the object to be cooled is limited to the object to be cooled such as beverages and cannot be used for other objects to be cooled, and the object to be cooled can be carried with one hand. There is a problem that it is not possible to deal with various things such as a different shape that does not fit in the container portion 5 that forms the shape, such as a fruit, or a wide and thin thing, such as a sheet-like cheese.

  Further, since the cooling temperature and the cooling area cannot be changed, the use is limited, and there is a drawback that it is difficult to increase the variation of the capacity of the object to be cooled and the cooling temperature.

  SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object of the present invention is to provide a cooling device that can cope with various objects to be cooled with a simple configuration in which a cooling unit is detachable.

  In order to solve the above-described conventional problems, a cooling device of the present invention includes a power receiving coil that receives power using a high-frequency magnetic field from an induction heating cooker, and a Peltier element that is operated by a current received by the power receiving coil. And a cooling means for cooling the Peltier element, a substantially flat first cooling body cooled by the Peltier element, and a detachable close contact with the first cooling body by a joining means via the first cooling body. The second cooling body is cooled by the Peltier element and is different in size or shape from the cooling surface of the substantially flat first cooling body.

  The second cooling body is configured to change the cooling temperature by increasing the area of the first cooling body.

  With the configuration described above, the Peltier element is activated by the current received by the receiving coil using the high-frequency magnetic field from the induction heating cooker, and the heat dissipation surface located on the lower surface of the Peltier element is cooled by the cooling means. Moreover, the 1st cooling body is cooled with the heat absorption of the cooling surface located in an upper surface. And by arrange | positioning the 2nd cooling body closely_contact | adhered to the 1st cooling body with the joining means so that attachment or detachment is possible, it comes to be able to respond to various to-be-cooled objects.

  That is, by preparing a second cooling body corresponding to each object to be cooled and replacing a plurality of second cooling bodies on one cooling device, it becomes possible to deal with various objects to be cooled.

  Further, since the first cooling body is directly cooled by the Peltier element and the second cooling body is cooled via the first cooling body, the second cooling body is cooled more than the first cooling body by heat transfer loss. The amount is reduced.

  Therefore, the first cooling body is made for a low temperature by narrowing the area, and the second cooling body is made to have a larger area than the first cooling body and the cooling area and the cooling temperature are changed for a medium to low temperature. By doing so, usability is greatly improved.

  Furthermore, the second cooling body can be used according to various scenes by preparing multiple ones with different areas or shapes that are adapted to the object to be cooled. improves.

  And since the Peltier element operates by the electric current which received the electric power using the high frequency magnetic field from the induction heating cooker by the receiving coil, the power supply part which requires a large capacity is unnecessary, and the configuration becomes simple and compact. It can be inexpensive and can be cordless, and an easy-to-use device can be provided.

  The cooling device of the present invention changes the cooling area and the cooling temperature corresponding to each object to be cooled, and prepares a plurality of objects whose shapes are changed according to the object to be cooled. It can be used and greatly improves usability.

  In addition, power is obtained by using a high-frequency magnetic field from an induction heating cooker by means of a power receiving coil, and the configuration is simple, can be made compact and inexpensive, can be cordless, and is easy to use. Can be provided.

Sectional drawing of the principal part of the cooling device mounted in the induction heating cooking appliance in Embodiment 1 of this invention Control block diagram of induction heating cooker in Embodiment 1 of the present invention The control block diagram of the cooling device mounted in the induction heating cooking appliance in Embodiment 1 of this invention (A) Other shapes of second cooling body of cooling device in embodiment 1 of the present invention (b) Other shapes of second cooling body of cooling device in embodiment 1 of the present invention Outline block diagram of cooling device in embodiment 2 of the present invention Control block diagram of cooling device placed on induction heating cooker in Embodiment 3 of the present invention Cross-sectional view of a conventional cooling device

  A cooling device according to a first aspect of the present invention cools a power receiving coil that receives power using a high-frequency magnetic field from an induction heating cooker, a Peltier element that is operated by a current received by the power receiving coil, and the Peltier element. A cooling means, a substantially flat first cooling body cooled by the Peltier element, and detachably adhered to the first cooling body by a joining means, and cooled by the Peltier element via the first cooling body, A cooling surface of the substantially flat plate-like first cooling body has a configuration in which a second cooling body having a different size or shape is provided.

  As a result, the Peltier element is activated by the current received by the receiving coil using the high-frequency magnetic field from the induction heating cooker, the heat radiation surface located at the lower surface of the Peltier element is cooled by the cooling means, and the upper surface Since the first cooling body is cooled by the heat absorption of the cooling surface located in the first cooling body, a second cooling body that is detachably attached to the first cooling body by a joining means can be disposed to cope with various objects to be cooled. It becomes possible to use it according to various scenes, and usability is greatly improved.

  The cooling device of the second invention is particularly configured such that the second cooling body of the first invention has a larger area than the first cooling body and changes the cooling temperature.

  As a result, the Peltier element is activated by the current received by the receiving coil using the high-frequency magnetic field from the induction heating cooker, the heat radiation surface located on the lower surface of the Peltier element is cooled by the cooling means, The first cooling body is cooled by the heat absorption of the cooling surface located on the upper surface, and the second cooling body that is detachably attached to the first cooling body by the joining means is disposed, thereby allowing various objects to be cooled. It becomes possible to respond.

  That is, by preparing a second cooling body corresponding to each object to be cooled and replacing a plurality of second cooling bodies on one cooling device, it becomes possible to deal with various objects to be cooled.

  Further, since the first cooling body is directly cooled by the Peltier element and the second cooling body is cooled via the first cooling body, the second cooling body is cooled more than the first cooling body by heat transfer loss. The amount is reduced.

  Therefore, the first cooling body is made for a low temperature by narrowing the area, and the second cooling body is made to have a larger area than the first cooling body and the cooling area and the cooling temperature are changed for a medium to low temperature. By doing so, usability is greatly improved.

  Furthermore, the second cooling body can be used according to various scenes by preparing multiple ones with different areas or shapes that are adapted to the object to be cooled. improves.

  And since the Peltier element operates by the electric current which received the electric power using the high frequency magnetic field from the induction heating cooker by the receiving coil, the power supply part which requires a large capacity is unnecessary, and the configuration becomes simple and compact. It can be inexpensive and can be cordless, and an easy-to-use device can be provided.

  In the cooling device of the third invention, in particular, the joining means for detachably attaching the first cooling body and the second cooling body of the first or second invention is composed of a thermally conductive sheet having adhesiveness. .

  As a result, the joining means for detachably attaching the first cooling body and the second cooling body is composed of a thermally conductive sheet having adhesiveness, so that the first cooling body and the second cooling body are in close contact with each other. The cooling amount of the first cooling body can be efficiently transmitted to the second cooling body, the second cooling body can be fixed to the first cooling body, and the object to be cooled can be stably held. become able to.

  According to a fourth aspect of the present invention, there is provided a cooling device for cooling the Peltier element according to any one of the first to third aspects, wherein the cooling means is disposed above the power receiving coil and has a heat sink in which one side is in close contact with the Peltier element. And a cooling fan that is disposed on the side of the heat sink and blows air to the heat sink.

  Thereby, the cooling means is composed of a heat sink disposed on the upper side of the power receiving coil and having one surface in close contact with the Peltier element, and a cooling fan disposed on the side of the heat sink and blown to the heat sink. There is no need to worry about a decrease in cooling capacity due to short circuit between the supply air and exhaust air flow of the cooling fan that cools the heat sink.

  In addition, since the cooling fan is disposed on the side of the heat sink, the air flow from the cooling fan flows in the vicinity of the power receiving coil, so that the power receiving coil can be cooled together and the heat sink Since the cooling fan is not located in the lower part, the height of the cooling device can be reduced accordingly, and the device can be made compact.

  The cooling device according to the fifth aspect of the invention is characterized in that, in particular, the cooling means for cooling the Peltier element according to any one of the first to third aspects includes a first heat exchanger having one surface in close contact with the Peltier element, and a cooling device body. And a second heat exchanger that releases the heat of the first heat exchanger via the refrigerant.

  Thus, the cooling means for cooling the Peltier element is configured separately from the first heat exchanger having one surface closely attached to the Peltier element and the cooling device main body, and the heat of the first heat exchanger is changed to the refrigerant. The cooling capacity of the first heat exchanger can be greatly improved by the second heat exchanger, and the cooling capacity of the Peltier element can be improved. One heat exchanger can be made small, and the cooling device main body can also be made more compact.

  The cooling device according to the sixth aspect of the invention has a configuration in which a cover provided so as to cover the entire first and second cooling bodies according to any one of the first to fifth aspects is provided. It is.

  As a result, the cover provided so as to cover the entire first cooling body and the second cooling body from above is arranged, so that the amount of heat released from the upper surfaces of the first cooling body and the second cooling body is reduced. The temperature of the first cooling body and the second cooling body can be lowered, and the object to be cooled can be lowered.

  In the cooling device of the seventh invention, in particular, the power receiving coil of any one of the first to sixth inventions is arranged separately from the main body including the Peltier element, the cooling means, and the first cooling body. It is what.

  As a result, the power receiving coil is configured separately from the main body composed of the Peltier element, the cooling means, and the first cooling body, so that the cooling device main body can be used separately from the induction heating cooker, Usability can be greatly improved.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a cross-sectional view of a main part of a cooling device placed on an induction heating cooker according to Embodiment 1 of the present invention, FIG. 2 is a control block diagram of the induction heating cooker according to Embodiment 1 of the present invention, and FIG. FIG. 4A is a control block diagram of the cooling device placed on the induction heating cooker in the first embodiment of the present invention, FIG. 4A is another shape diagram of the second cooling body of the cooling device in the first embodiment of the present invention, and FIG. 4 (b) is another example of the shape of the second cooling body of the cooling device according to Embodiment 1 of the present invention.

  The cooling device 20 of the present invention is used by being placed on the induction heating cooker 21. First, the induction heating cooker 21 will be described.

  As shown in FIG. 1 or 2, the induction heating cooker 21 is formed with a top plate 23 on which a cooking-cooked container 22 such as a pan is placed, and an operation unit 24 is provided on a part thereof. Inside the top plate 23, a substantially circular heating coil 25 for heating the cooked container 22 and an induction heating cooker control unit 27 for controlling the operation of the heating coil 25 and the inverter unit 26 for supplying power are arranged. In addition, the induction heating cooker control unit 27 controls the high frequency oscillation of the inverter unit 26 by turning on and off the switching semiconductor of the inverter unit 26 and also controls the start and stop of the oscillation operation.

The inverter unit 26 is one of frequency converters, and includes a power supply rectifier, a filter capacitor, a resonant capacitor, a switching semiconductor, and the like (not shown). The inverter unit 26 converts a commercial power source into a high frequency current, and the high frequency current is converted into a heating coil 25. The heating coil 25 generates a high frequency magnetic field in the vicinity of the induction heating cooker control unit 27 and heats the bottom of the cooking container 22 to be heated.

  Next, the cooling device 20 of the present embodiment that is used by being placed on the induction heating cooker 21 will be described.

  As shown in FIG. 1 or FIG. 3, the cooling device 20 is provided with a power receiving coil 28 that receives power using a high-frequency magnetic field from the induction heating cooker 21 at the bottom of the cooling device 20. A comb-like heat sink 29 is disposed on the top.

  A cooling fan 30 for sending an air flow for cooling the heat sink 29 is disposed on the side of the heat sink 29, and the upper part is made of a Peltier element 31 and a foamed resin provided around it. Insulation is provided.

  The Peltier element 31 is in close contact with the upper surface of the heat sink 29 with its lower surface as a heat radiating surface. In order to reduce thermal resistance, the conductive surface is thinly coated on the close contact surface, and the upper surface is used as a cooling surface. The first cooling body 32 made of aluminum and disposed in the upper part is in close contact, and the contact surface is similarly coated with a thin thermal conductive grease in order to reduce the thermal resistance.

  And the heat sink 29, the Peltier element 31, and the 1st cooling body 32 are being fixed so that each adhesiveness may be maintained.

  Further, the first cooling body 32 has a slightly larger area than the Peltier element 31, and a resin case lid frame 33 that forms a shell and has a poor thermal conductivity is provided around the first cooling body 32. A heat sink 29, a cooling fan 30, a Peltier element 31, etc. are fixed to a main body case 34 of the cooling device 20 that houses built-in objects so as to cover from above.

  The upper surface of the first cooling body 32 is held at a low temperature by cooling the Peltier element 31, and the object to be cooled is held at a low temperature by placing the object to be cooled on this surface. Be able to.

  Furthermore, on the upper surface of the first cooling body 32, a second cooling body 36 that is detachably attached and fixedly attached by a heat conductive sheet 35 having adhesiveness as a joining means can be disposed. The second cooling body 36 is configured to have a larger area than the first cooling body 32 and to change the cooling temperature.

  Then, in the space on the side of the heat sink 29 in the main body case 34 of the cooling device, the current received by the high-frequency magnetic field from the induction heating cooker 21 by the power receiving coil 28 is converted, and the cooling fan 30, A cooling device control unit 37 for operating and controlling the Peltier element 31 and the like is provided.

  Further, a cover 38 provided so as to cover the entire first cooling body 32 and the second cooling body 36 from above can be disposed, and is placed on the first cooling body 32 or the second cooling body 36. By providing so as to cover the object to be cooled, while protecting it, the cooling performance is improved.

  Further, on the upper surfaces of the first cooling body 32 and the second cooling body 36, a temperature display sheet 39 ← (please indicate the sign in the drawing) (display means) for displaying the cooling temperature with a temperature indicating paint is disposed. It is.

  About the cooling device comprised as mentioned above, the operation | movement and an effect | action are demonstrated below.

  In the configuration described above, when the cooling device 20 is placed on the induction heating cooker 21 instead of a pan or the like and the induction heating cooker 21 is operated to generate a high-frequency magnetic field, induced power is generated in the power receiving coil 28. Then, this is converted by the cooling device control unit 37 of the cooling device 20 to operate and control the cooling fan 30, the Peltier element 31, and the like.

  In this Peltier element 31, a short electron P-type / excess electron N-type semiconductor element is alternately arranged in a π-shape or an inverted π-shape between a single insulating heat transfer plate (ceramics, etc.). In the existing configuration that is connected in series and thermally in parallel, by passing a direct current through the Peltier element 31, a temperature difference occurs on both sides of the element, and the heat absorption and heat dissipation side on the cooling side The total amount of heat absorbed on the cooling side is added to the amount of heat corresponding to the total supply power (W) and released to the heat dissipation side.

  Therefore, in order to effectively cool by the Peltier element 31, cooling is performed by the heat sink 29 and the cooling fan 30 in close contact with the heat radiation side located on the lower surface of the Peltier element 31. Specifically, the heat sink 29 The heat generated on the heat radiating side of the Peltier element 31 is exchanged by the air flow from the cooling fan 30 disposed on the side of the Peltier element 31 via the heat sink 29 and discharged to the opposite side.

  In this way, the cooling side located on the upper surface of the Peltier element 31 is maintained at a low temperature, the first cooling body 32 is brought into close contact with the cooling surface, the first cooling body 32 is held at a low temperature, and the surface is covered with this surface. By placing the cooling object, the object to be cooled can be held at a low temperature.

  Here, the Peltier element 31 is activated by the current received by the receiving coil 28 using the high frequency magnetic field from the induction heating cooker 21, and the heat radiation surface located on the lower surface of the Peltier element 31 is cooled by the cooling means. Moreover, the 1st cooling body 32 is cooled by the heat absorption of the cooling surface located in an upper surface.

  And by arrange | positioning the 2nd cooling body 36 closely attached to this 1st cooling body 32 with the joining means, it becomes possible to respond | correspond to various to-be-cooled objects.

  That is, by preparing the second cooling body 36 corresponding to each object to be cooled and replacing the plurality of second cooling bodies 36 on one cooling device 20, it is possible to cope with various objects to be cooled.

  Moreover, since the 1st cooling body 32 is directly cooled by the Peltier device 31, and the 2nd cooling body 36 is cooled via the 1st cooling body 32, the 2nd cooling body 36 is 1st by heat transfer loss. The cooling amount is smaller than that of the cooling body 32.

  Therefore, the first cooling body 32 has a reduced area for low temperature, and the second cooling body 36 has a larger area than the first cooling body 32 and has a cooling area and a cooling temperature for medium and low temperatures. By preparing things, usability is greatly improved.

  Furthermore, the second cooling body 36 can be used according to various scenes by preparing multiple ones with different areas or different shapes according to the object to be cooled. To improve.

Specifically, as shown in FIG. 4A, the second cooling body 36 may have a dish shape or bowl shape with an edge around the periphery, or a pot as shown in FIG. 4B. As a shape, it is good also as a structure which cools by putting the liquid which entered into the bottle, for example, wine etc. as a to-be-cooled object, and should just make it the shape and magnitude | size according to the to-be-cooled object.

  Since the Peltier element 31 is operated by the current received by the power receiving coil 28 using the high-frequency magnetic field from the induction heating cooker 21, a power supply unit requiring a large capacity is not required, and the configuration is simplified. Therefore, it is possible to provide a device that is compact and inexpensive, can be cordless, and is easy to use.

  In addition, since the first cooling body 32 and the second cooling body 36 are constituted by the thermally conductive sheet 35 having adhesiveness as a joining means for detachably attaching the first cooling body 32 and the second cooling body 36, the first cooling body 32 and the second cooling body 36 are The amount of cooling of the first cooling body 32 can be efficiently transmitted to the second cooling body 36, and the second cooling body 36 can be fixed to the first cooling body 32, and the object to be cooled can be It can be held stably.

  Further, the cooling means is disposed above the power receiving coil 28, a heat sink 29 having one surface closely attached to the Peltier element, and a cooling fan 30 disposed on the side of the heat sink 29 and blowing air to the heat sink 29. As a result, the supply of the cooling fan 30 that cools the heat sink 29 and the flow of the exhaust air are short-circuited, so that there is no fear of reducing the cooling capacity.

  Further, since the cooling fan 30 is disposed on the side of the heat sink 29, the air flow from the cooling fan 30 flows in the vicinity of the power receiving coil 28, so that both the power receiving coil 28 can be cooled. At the same time, since the cooling fan 30 is not located below the heat sink 29, the height of the cooling device 20 can be reduced accordingly and the size can be reduced.

  And since the cover 38 provided so that the whole of the 1st cooling body 32 and the 2nd cooling body 36 may be covered from upper part can be arrange | positioned, from the upper surface of the 1st cooling body 32 and the 2nd cooling body 36 The amount of heat released can be reduced, the temperature of the first cooling body 32 and the second cooling body 36 can be lowered, and the object to be cooled can be lowered.

  Note that the first cooling body 32 and the second cooling body 36 are configured to securely join each other, the second cooling body 36 is pressed against the first cooling body 32 using screws, clamps, or the like, and the first A fitting portion between the cooling body 32 and the second cooling body 36, for example, as shown in the figure, a guide rail portion is provided in the first cooling body 32, and a guide groove provided in the second cooling body 36 is slid and inserted to be closely attached. In addition, any combination may be used as long as it effectively achieves the present invention.

  A temperature display sheet (display means) for displaying the cooling temperature with a temperature indicating paint may be provided on the upper surfaces of the first cooling body 32 and the second cooling body 36. According to this, the temperature of the 1st cooling body 32 or the 2nd cooling body 36 can be easily notified to a user, without requiring a sensor and an electronic circuit, and usability can be improved significantly.

(Embodiment 2)
FIG. 5 is a block diagram showing an outline of the cooling device according to the second embodiment of the present invention.

  Only the arrangement of the cooling means is different from that of the first embodiment, and the same parts as those of the first embodiment are denoted by the same reference numerals, the description thereof is omitted, and only the different parts are described.

As shown in FIG. 5, the cooling means for cooling the Peltier element 31 includes a first heat exchanger 41 in which one side serving as a heat radiating surface of the Peltier element 31 is in close contact, and heat from the first heat exchanger 41 as a water flow ( The second heat exchange that cools the heat of the first heat exchanger 41 separately from the main body of the cooling device 20 through the forward pipe 42 sent by the refrigerant) and the water flow (refrigerant) sent from the forward pipe 42 And a return pipe 44 that returns the water flow (refrigerant) cooled by the second heat exchanger 43 to the first heat exchanger 41.

  The Peltier element 31 is closely attached to the upper surface of the first heat exchanger 41 with its lower surface as a heat radiating surface, and the conductive surface is thinly coated with heat conduction grease to reduce the thermal resistance. The 2nd heat exchanger 43 is comprised so that it may discharge | release to air | atmosphere with the air blower 45, and may cool.

  Here, the cooling means for cooling the Peltier element 31 is configured separately from the first heat exchanger 41 having one surface in close contact with the Peltier element 31 and the main body of the cooling device 20, and the heat of the first heat exchanger 41 is provided. Is constituted by the second heat exchanger 43 that is released to the atmosphere through a water flow (refrigerant), so that the cooling capacity of the first heat exchanger 41 can be greatly improved by the second heat exchanger 43. Moreover, while improving the cooling capacity of the Peltier element 31, the 1st heat exchanger 41 can be comprised small, and the cooling device 20 main body can also be comprised more compactly.

  In particular, since the total amount of heat absorbed on the cooling side of the Peltier element 31 is added to the amount of heat corresponding to the total supply power (W) and is released to the heat dissipation side, the cooling side is not cooled sufficiently. Even if there is a temperature difference between the heat dissipation side and the heat dissipation side, the temperature on the heat dissipation side increases, and as a result, the temperature on the cooling side increases.

  Therefore, the heat of the first heat exchanger 41 is radiated by the second heat exchanger 43 so that the temperature on the heat radiating side of the Peltier element 31 does not increase. Increasing the capacity of the blower 45 and further the amount of water flow (refrigerant) can cope with this, and the cooling device 20 main body can be configured more compactly while increasing the cooling capacity.

  Note that the second heat exchanger 43 may not be air-cooled using the blower 45, but may be water-cooled or other one having a high cooling capacity.

(Embodiment 3)
FIG. 6 is a control block diagram of the cooling device placed on the induction heating cooker in the third embodiment of the present invention.

  Only the arrangement of the power receiving coil 28 is different from that of the first embodiment, the same parts as those of the first embodiment are denoted by the same reference numerals, the description thereof is omitted, and only the different parts are described.

  As shown in FIG. 6, the receiving coil 51 that receives power using the high-frequency magnetic field from the induction heating cooker 21 is integrated with the second control unit 52 that rectifies and converts the current received by the receiving coil 51 into a direct current. The power receiving coil unit 54 is provided.

  In other words, in the present embodiment, unlike the configuration of the cooling device 20 including the Peltier element 31, the cooling fan 30, the first cooling body 32, and the power receiving coil 28 of the first embodiment, the power receiving coil 51 is different. Is arranged.

  Therefore, the direct current obtained by the second control unit 52 in the power receiving coil unit 54 supplies power to the cooling device control unit 37 of the cooling device 20 via the power transmission line 53.

  Further, the power transmission line 53 is detachably connected to the power receiving coil unit 54 and the cooling device 20.

  As described above, the Peltier element 31 shown in the first embodiment, the cooling means including the heat sink 29 closely attached to one surface of the Peltier element and the cooling fan 30 that blows air to the heat sink 29, the first cooling body 32, Unlike the configuration of the cooling device 20 main body provided with the cooling device control unit 37 and the power receiving coil 28, the power receiving coil 51 of the present embodiment includes a Peltier element 31, a cooling means, a first cooling body 32, and a cooling device. The cooling apparatus 20 main body including the apparatus control unit 37 is provided separately.

  Therefore, the cooling apparatus 20 main body can be used separately from the induction heating cooker 21, and the usability can be greatly improved.

  Further, the power receiving coil 51 provided in the power receiving coil unit 54 is formed in a ring shape and can be disposed around a non-heated cooking container heated by the induction heating cooker 21, for example, a pan or the like. It becomes possible to use it with a container, for example, a pan, and the usability can be improved.

  Furthermore, the induction heating cooker 21 may be specially provided with a feeding coil dedicated to the receiving coil unit 54 to control the receiving coil unit 54. According to this, the cooling device 20 can be controlled regardless of the heated state of the cooked container, for example, the pan, and the usability is further improved.

  As described above, the cooling device 20 of the present invention is configured to obtain electric power by using the high-frequency magnetic field from the induction heating cooker 21 by the power receiving coil 51, the configuration is simple, and it can be made compact and inexpensive, Or it can apply also to uses, such as a cooling pan for business, such as a hotel, an inn, and a medical institution.

3, 20 Cooling device 21 Induction heating cooker 28, 51 Power receiving coil 29 Heat sink 30 Cooling fan 7, 31 Peltier element 32 First cooling body 35 Thermal conductive sheet 36 Second cooling body 38 Cover 41 First heat exchanger 42 Pipe 43 Second heat exchanger 44 Return pipe 54 Power receiving coil unit

Claims (7)

A receiving coil that receives power using a high-frequency magnetic field from an induction heating cooker, a Peltier element that operates by a current received by the receiving coil, a cooling means that cools the Peltier element, and cooling by the Peltier element A substantially flat first cooling body that is detachably attached to the first cooling body by a joining means and is cooled by the Peltier element through the first cooling body. A cooling device provided with a second cooling body having a size or shape different from that of the cooling surface. The cooling device according to claim 1, wherein the second cooling body is configured to have a larger area than the first cooling body to change a cooling temperature. The cooling device according to claim 1 or 2, wherein the joining means for detachably attaching the first cooling body and the second cooling body is formed of a thermally conductive sheet having adhesiveness. The cooling means for cooling the Peltier element is composed of a heat sink disposed on the upper side of the power receiving coil and having one surface closely attached to the Peltier element, and a cooling fan disposed on the side of the heat sink and blowing air to the heat sink. The cooling device according to any one of claims 1 to 3. The cooling means for cooling the Peltier element is configured separately from a first heat exchanger in which one side is in close contact with the Peltier element and a cooling device main body, and heat of the first heat exchanger is passed through a refrigerant. The cooling device of any one of Claims 1-3 comprised with the 2nd heat exchanger to discharge | release. The cooling device according to any one of claims 1 to 5, wherein a cover provided so as to cover the entirety of the first cooling body and the second cooling body from above is disposed. The cooling device according to any one of claims 1 to 6, wherein the power receiving coil is disposed separately from a main body including the Peltier element, a cooling unit, and the first cooling body.