JPS6041066U - Optical semiconductor device - Google Patents

Optical semiconductor device

Info

Publication number
JPS6041066U
JPS6041066U JP13410283U JP13410283U JPS6041066U JP S6041066 U JPS6041066 U JP S6041066U JP 13410283 U JP13410283 U JP 13410283U JP 13410283 U JP13410283 U JP 13410283U JP S6041066 U JPS6041066 U JP S6041066U
Authority
JP
Japan
Prior art keywords
optical semiconductor
stem base
semiconductor device
heat radiator
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13410283U
Other languages
Japanese (ja)
Inventor
徹 鎌田
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13410283U priority Critical patent/JPS6041066U/en
Publication of JPS6041066U publication Critical patent/JPS6041066U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の光半導体装置用ステムの実施例を示す斜
視図。第2図は本考案による一実施例を示す斜視図。第
3図は本考案によるリードのフォーミング方法の一実施
例を示す平面図。 11.21,31・・・ステムベース、12,22.3
2・・・放熱部、13,23.33・・・フォーミング
リード、14.24・・・ヒートシンク、15゜25・
・・半導体レーザー素子、16.26・・・金属細線、
17.27・・・ガラス、38・・・パンチ型。
FIG. 1 is a perspective view showing an example of a conventional stem for an optical semiconductor device. FIG. 2 is a perspective view showing an embodiment of the present invention. FIG. 3 is a plan view showing an embodiment of the lead forming method according to the present invention. 11.21,31... Stem base, 12,22.3
2... Heat dissipation part, 13, 23. 33... Forming lead, 14.24... Heat sink, 15° 25.
・・Semiconductor laser element, 16.26・・Thin metal wire,
17.27...Glass, 38...Punch type.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 発光素子からの電極引出用リードを気密かつ絶縁的に支
持したステムベースと、ステムベース面からほぼ垂直に
立ち上がり発光素子が側壁に載置される放熱体が前記ス
テムベースと一体に構成されてなる光半導体装置用ステ
ムに於いて、前記放熱体は、リードとステムベースを封
着した後、前記リード先端部をフォーミング加工できる
よう放熱体の一部を空間的に欠如させた形状を有するこ
とを特徴とする光半導体装置。
A stem base that airtightly and insulatively supports an electrode lead from a light emitting element, and a heat radiator that stands up almost perpendicularly from the stem base surface and on which the light emitting element is placed on a side wall are integrally constructed with the stem base. In the stem for an optical semiconductor device, the heat radiator has a shape in which a part of the heat radiator is spatially cut out so that the lead tip can be formed after the leads and the stem base are sealed. Features of optical semiconductor devices.
JP13410283U 1983-08-30 1983-08-30 Optical semiconductor device Pending JPS6041066U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13410283U JPS6041066U (en) 1983-08-30 1983-08-30 Optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13410283U JPS6041066U (en) 1983-08-30 1983-08-30 Optical semiconductor device

Publications (1)

Publication Number Publication Date
JPS6041066U true JPS6041066U (en) 1985-03-23

Family

ID=30302269

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13410283U Pending JPS6041066U (en) 1983-08-30 1983-08-30 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPS6041066U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02312506A (en) * 1989-05-25 1990-12-27 Minoru Sangyo Kk Mid-mount type riding transplantation machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717165B1 (en) * 1970-11-30 1982-04-09
JPS5898995A (en) * 1981-12-09 1983-06-13 Nec Corp Photosemiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5717165B1 (en) * 1970-11-30 1982-04-09
JPS5898995A (en) * 1981-12-09 1983-06-13 Nec Corp Photosemiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02312506A (en) * 1989-05-25 1990-12-27 Minoru Sangyo Kk Mid-mount type riding transplantation machine

Similar Documents

Publication Publication Date Title
JPS6041066U (en) Optical semiconductor device
JPS6064272U (en) semiconductor test jig
JPS602841U (en) semiconductor mounting board
JPS5920632U (en) semiconductor equipment
JPS619851U (en) Power transistor fixing device
JPS6061741U (en) Semiconductor device with heat dissipation fins
JPS5839041U (en) High voltage semiconductor device
JPS593551U (en) Semiconductor stem
JPH0395671U (en)
JPS5858337U (en) semiconductor equipment
JPS6061740U (en) Hybrid integrated circuit device
JPS60121649U (en) airtight terminal
JPS5815349U (en) circuit board
JPS59145055U (en) Heat sink for semiconductor laser
JPS58433U (en) semiconductor equipment
JPS59107157U (en) GaAs semiconductor device
JPS5944059U (en) light emitting diode display
JPS60103860U (en) semiconductor laser equipment
JPS605141U (en) Insulating sheet with shield for transistors
JPS593550U (en) Stem for high power semiconductors
JPS5878654U (en) Mold type semiconductor device
JPS588950U (en) semiconductor equipment
JPS58434U (en) semiconductor equipment
JPS58177947U (en) semiconductor equipment
JPS5869954U (en) semiconductor equipment