JPS6039246U - airtight terminal - Google Patents
airtight terminalInfo
- Publication number
- JPS6039246U JPS6039246U JP13051583U JP13051583U JPS6039246U JP S6039246 U JPS6039246 U JP S6039246U JP 13051583 U JP13051583 U JP 13051583U JP 13051583 U JP13051583 U JP 13051583U JP S6039246 U JPS6039246 U JP S6039246U
- Authority
- JP
- Japan
- Prior art keywords
- airtight terminal
- glass
- nail
- shaped head
- stem
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の半導体装置用ステムの断面図である。第
2図は第1図のステムの製造方法について説明するため
の封着前の組立状態を示す断面図である。第3図A、
Bは従来のステムにおいてガラス量が正規の場合と若干
不足する場合の要部拡大断面図である。第4図は本考案
の一実施例の半導体装置用ステムの断面図である。第5
図は本考案に用いるリード線の拡大下面図である。第6
図A、 Bは本考案のステムにおいて、ガラス量が正規
の場合と若干不足する場合の要部拡大断面図である。
1・・・・・・金属外環(ステム基板)、4・曲・透孔
(リード線封着孔)、6・・・・・・リード線、6a・
・回灯状頭部、6b・・・・・・補強用リブ、7・曲・
ガラス。FIG. 1 is a sectional view of a conventional stem for a semiconductor device. FIG. 2 is a sectional view showing an assembled state before sealing for explaining the method of manufacturing the stem of FIG. 1. Figure 3A,
B is an enlarged sectional view of a main part of a conventional stem when the amount of glass is normal and when the amount of glass is slightly insufficient. FIG. 4 is a sectional view of a stem for a semiconductor device according to an embodiment of the present invention. Fifth
The figure is an enlarged bottom view of the lead wire used in the present invention. 6th
Figures A and B are enlarged cross-sectional views of main parts of the stem of the present invention when the amount of glass is normal and when the amount of glass is slightly insufficient. 1...Metal outer ring (stem board), 4.Bent/through hole (lead wire sealing hole), 6...Lead wire, 6a.
・Lamp-shaped head, 6b... Reinforcing ribs, 7. Curved.
glass.
Claims (1)
ド線を気密絶縁的に封着してなる気密端子において、 前記釘状頭部の下面に複数個の補強用リブを形成したこ
とを特徴とする気密端子。[Claims for Utility Model Registration] An airtight terminal in which a lead wire having a nail-shaped head is hermetically and insulatively sealed in a through hole of a metal outer ring through a glass, comprising: a plurality of lead wires on the lower surface of the nail-shaped head; An airtight terminal characterized by forming a number of reinforcing ribs.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13051583U JPS6039246U (en) | 1983-08-23 | 1983-08-23 | airtight terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13051583U JPS6039246U (en) | 1983-08-23 | 1983-08-23 | airtight terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6039246U true JPS6039246U (en) | 1985-03-19 |
Family
ID=30295369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13051583U Pending JPS6039246U (en) | 1983-08-23 | 1983-08-23 | airtight terminal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6039246U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556122U (en) * | 1978-06-29 | 1980-01-16 |
-
1983
- 1983-08-23 JP JP13051583U patent/JPS6039246U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556122U (en) * | 1978-06-29 | 1980-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6039246U (en) | airtight terminal | |
JPS5933255U (en) | semiconductor equipment | |
JPS5832645U (en) | semiconductor equipment | |
JPS6068631U (en) | Resin-sealed electronic components | |
JPS59149355U (en) | temperature fuse | |
JPS60141148U (en) | semiconductor equipment | |
JPS59127247U (en) | Glass sealed semiconductor device | |
JPS59135861U (en) | brazing structure | |
JPS6011442U (en) | Sealed electronic components | |
JPS60153537U (en) | airtight terminal | |
JPS588217U (en) | Hermetic terminal of piezoelectric vibrator | |
JPS5853158U (en) | semiconductor integrated circuit | |
JPS58155851U (en) | Mold type semiconductor device | |
JPS59105710U (en) | superconducting wire | |
JPS6046641U (en) | lamp | |
JPS5887339U (en) | semiconductor equipment | |
JPS6025230U (en) | Airtight terminal for crystal unit | |
JPS5829835U (en) | Bonding wire for semiconductor integrated circuits | |
JPS59183024U (en) | airtight terminal | |
JPS60121649U (en) | airtight terminal | |
JPS6025231U (en) | Airtight terminal for crystal unit | |
JPS6037253U (en) | semiconductor equipment | |
JPS58123572U (en) | airtight terminal | |
JPS6094836U (en) | semiconductor equipment | |
JPS5825050U (en) | Lead terminal arrangement structure of integrated circuit package |