JPS6038112A - Dicing device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a cutting technique, and particularly to a dicing technique for cutting a semiconductor wafer into pellets as a semiconductor manufacturing apparatus.

[Background technology]

Generally, when manufacturing a semiconductor device, a dicing process is required to cut and separate semiconductor wafers into device pellets on which a large number of device patterns are formed. In this dicing process, a half-dicing method is used, in which a cut is made to half the total thickness of the wafer, and then the cut is broken and separated, similar to stamp scribing. A full dicing method for cutting is also used (for example, Japanese Patent Laid-Open No. 48
(Refer to Publication No.-58771).

By the way, in this full dicing, the wafer is completely cut, so in order to prevent the cut pellets from falling apart, an adhesive tape is laid under the wafer and the wafer is adhesively fixed to this. is taken. In this case, the adhesive tape used is not very strong so that the pellet can be easily removed from the adhesive tape after cutting, and the wafer is supported on the dicing table by vacuum suction on the back side of the adhesive tape. It has become.

Therefore, when full dicing a wafer in such a supported state, the vibrations caused by the high-speed rotation of the dicing tool (blade) are transmitted to the pellets being cut, and the pellets are vacuum-adsorbed and the adhesive tape with weak adhesiveness The present inventor found that since it is only a support, it is extremely easily vibrated, and this vibration causes the side surface of the pellet (particularly the lower edge) to interfere with the dicing saw, causing scratches and chips on the side surface of the pellet. Such scratches and chips may not only cause poor pellet bonding in subsequent steps, but also may damage the element circuits on the surface of the pellet if they are severe.

[Purpose of the invention]

An object of the present invention is to provide a dicing technique that does not cause scratches or chips on the dicing surface even when the sample is completely or almost cut.

Another object of the present invention is to provide a dicing technique that can prevent scratches and chips on the side surfaces of pellets that have been completely cut or almost cut.

The above and other objects and novel features of the present invention include:
It will become clear from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, by configuring the sample so that magnetic adsorption force can act on it, the supporting force of the sample to be completely cut is increased, and this reduces the vibration of the sample during dicing and the dicing blade. This prevents scratches and chips from occurring by preventing interference with the material.

〔Example〕

FIG. 1 shows an embodiment in which the dicing apparatus of the present invention is applied to a semiconductor wafer dicing apparatus, and FIG. 2 shows the details thereof. In the figure, 1 is a sample, that is, a semiconductor wafer to be diced. On its surface, a large number of element patterns are formed in the form of squares. This makes it possible to obtain individual element pellets (chips). Reference numeral 2 denotes a carrier jig for supporting the wafer 1, which is formed entirely in the shape of an annular ring, and has an adhesive tape 3 with relatively high adhesiveness affixed upward to its lower surface, and a highly adhesive tape 3 on its upper surface. The lower surface of the wafer 1 is supported by pasting an adhesive tape 4 with a low pressure upward.

This carrier jig 2 is attached to the dicing table 5.
supported above.

The dicing table 5 is moved by a drive mechanism (not shown).
It can move continuously in the direction, step move in the Y direction, and move in the Z direction as well.

A plurality of grooves 6 are formed on the upper surface of the carrier jig placed on the dicing table 5 by communicating the grooves 6 with a vacuum source (not shown) through a passage 7. The tool 2 and the wafer 1 attached and supported thereon can be vacuum-adsorbed onto the table surface. Furthermore, the surface of the dicing table 5 is made of a magnetic material 8. Note that this magnetic body 8 itself has magnetism.

On the other hand, an insulating wafer 1 supported on a table 5 is provided with a thin film, in this example a thin plate 9, made of a magnetic material such as chromium or nickel so as to cover the wafer.

This thin plate 9 extends not only to the upper surface of the wafer 1 but also to the periphery of the wafer 1, and as a result, a magnetic attraction force is exerted between it and the magnetic body 8 of the table 5, and this attraction force causes the thin plate 9 to
will press the wafer l onto the table surface.

Further, on one side of the dicing table 5, a dicing saw IO consisting of a rotating blade that is relatively moved as a result of the above-mentioned movement of the table 5 is supported, and is capable of rotating at high speed. Clean water is supplied to this saw 10 from a nozzle 11.

In the figure, 12 is an auxiliary support claw.

According to the above configuration, by sequentially operating the dicing table 5 in two directions and in the For example, a large number of cutting grooves in the X direction are formed.

Next, by rotating the entire table 5 by 90 degrees and performing similar cutting, the wafer can be cut and separated into individual pellets. At this time, the cutting is deep enough to cut into the adhesive tape 4, and the wafer 1 is completely cut.

During such a cutting operation, the wafer 1 is placed in the carrier jig 2.
At the same time, the magnetic attraction force between the magnetic body 8 of the table 5 and the thin plate 9 is applied to the wafer 1, and the wafer 1 is
is strongly suppressed on Table 5. This state is maintained by the thin plates (small pieces) present on each pellet even if the thin plates 9 are cut as the wafer 1 is cut. Therefore, even when the wafer is completely cut into pellets, each pellet is firmly supported on the table as described above, so the dicing saw
Even if the vibration of 0 is transmitted to Kugoha 1 or the pellet, it is possible to prevent the pellet from being vibrated together, and it is possible to prevent interference between the side surface of the pellet and the dicing tool 10, thereby preventing the occurrence of scratches and chips. .

The thickness of the thin plate 9 may be adjusted as appropriate depending on the supporting force and cutting ability of the adhesive tapes 3, 4, vacuum suction, etc.

Further, it is not always necessary to cover the top and side surfaces of the wafer Sl with the thin plate 9, and it is sufficient that at least the surface of the wafer 1 is covered.

〔effect〕

(1) By providing the table with a mechanism that applies magnetic force to the sample, the sample can be firmly supported on the table, and even if vibrations are transmitted to the sample, the vibrations of the sample can be suppressed, and the It can prevent scratches and chips from occurring by preventing interference with the dicing plate.

(2) Since it is only necessary to cover the sample with a thin plate provided separately from the sample, and to provide two ferromagnetic substances on the table, it is easy to integrate into existing equipment, making it extremely simple. It can be configured as follows.

(When forming pellets from 31 wafers, it is possible to prevent scratches and chips on the sides of the pellets, allowing for good pellet pounding in the post-process and preventing damage to the circuits on the pellet surface, improving quality and reliability. can.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, a thin plate (thin film) may be made of a magnetic material that is magnetic by itself, so that a magnetic force acts between it and the magnetic material provided on the table.Also, an electromagnet may be provided on the table. , a magnetic force may act between the sample and a magnetic material covering the sample. Note that when the sample itself is a magnetic material, it is not necessary to cover it with a magnetic material.

[Field of use]

In the above explanation, the invention made by the present inventor was mainly applied to a semiconductor wafer dicing apparatus, which is the background field of application, but it is not limited to this, and is applicable to precision processing in other fields. It can be applied to thin plate cutting or cutting equipment for.

[Brief explanation of the drawing]

FIG. 1 is an overall configuration diagram of an embodiment of the present invention, and FIG. 2 is a partially enlarged perspective view. 1... Sample (wafer), 2... Carrier jig, 3
゜4...Adhesive tape, 5...Dicing table,
6... Concave groove, 8... Magnetic material, 9... Thin film (thin plate)
, 10... Dicing blade.

Claims (1)

[Claims] 1. It has a table on which a sample is placed and supports it, and a dicing blade that can cut or cut the sample by moving relative to the table; A dicing device in which the table is provided with a mechanism that applies force. 2. The tercing device according to claim 1, wherein the mechanism is constructed of a magnetic material at or near the surface of the table. 3. Claim 1, wherein the mechanism is characterized in that an electromagnet is disposed on or near the surface of the table.
The dicing device described in section. 4. The dicing apparatus according to claim 1, 2, or 3, wherein when the sample is an insulating object, at least the surface thereof is coated with a magnetic material. 5. The magnetic material is a metal thin film such as chromium or nickel, or
A dicing device characterized by a thin film containing them.